SCM1106M High Voltage 3 Phase Motor Driver Features and Benefits Description ▪ Each half-bridge circuit consists of a pre-driver circuit that is completely independent from the others ▪ Protection against simultaneous high- and low-side turning on ▪ Bootstrap diodes with series resistors for suppressing inrush current are incorporated ▪ CMOS compatible input (3.3 to 5 V) ▪ Designed to minimize simultaneous current through both high- and low-side IGBTs by optimizing gate drive resistors ▪ UVLO protection with auto restart ▪ Overcurrent protection with off-time period adjustable by an external capacitor ▪ Fault (FO indicator) signal output at protection activation: UVLO (low side only), OCP, and STP ▪ Proprietary power DIP package The SCM1106M inverter power module (IPM) device provides a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 85 to 253 VAC input voltage, and 10 A (continuous) output current. They can withstand voltages of up to 600 V (IGBT breakdown voltage). Package: Power DIP The SCM1100M series employs a new, small-footprint proprietary DIP package. The IC itself consists of all of the necessary power elements (six IGBTs), pre-drive ICs (three), and flyback diodes (six), needed to configure the main circuit of an inverter, as well as a bootstrap circuit (three bootstrap diodes and three boot resistors) as a high-side drive power supply. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Applications include residential white goods (home appliances) and commercial appliance motor control, such as: ▪ Air conditioner fan motor ▪ Refrigerator compressor motor ▪ Washing machine main motor ▪ Air conditioner compressor motor Not to scale Functional Block Diagram HS VB VBB HO UV VCC Input Detect HIN Logic Level LIN & Shift Drive Circuit U, V, or W Shoot Through Prevention UV Detect COM FO O .C . Drive LO Circuit LS Protect CFO HVIC Figure 1. Diagram of one of three phases in the device. 38110.010, Rev. 2 SCM1106M High Voltage 3 Phase Motor Driver Selection Guide Output Current Part Number Packing IGBT Breakdown Voltage, VCES(min) (V) IGBT Saturation Voltage, VCE(sat)(typ) (V) Continuous, IO(max) (A) Pulsed, IOP (max) (A) SCM1106M 10 pieces per tube 600 2.2 10 20 Absolute Maximum Ratings, valid at TA = 25°C Characteristic Symbol Remarks Rating Units IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 V Logic Supply Voltage VCC Between VCC and COM 20 V Boot-strap Voltage VBS Between VB and HS (U,V,W) 20 V TCase = 25°C 10 A TCase = 100°C 5.2 A Pulse Width ≤ 100 μs 20 A Output Current, Continuous IO Output Current, Pulsed IOP Input Voltage VIN FO Terminal Voltage VFO Maximum Allowable Power Dissipation PD Thermal Resistance, Junction-to-Case RθJC Case Operation Temperature TCOP –0.5 to 7 V 7 V TCase = 25°C, 1 element operation (IGBT) 20.8 W TCase = 100°C, 1 element operation (IGBT) 8.3 W 6 °C/W 6.5 °C/W –20 to 100 °C Between FO and COM 1 element operation (IGBT) 1 element operation (FWD) Junction Temperature (IGBT) TJ 150 °C Storage Temperature Tstg –40 to 150 °C Isolation Voltage Viso 2000 Vrms Between exposed tab region and each pin; 1 minute, AC Recommended Operating Conditions Characteristic Symbol Remarks Min. Typ. Max. Units Main Supply Voltage VBB Between VBB and LS – 300 450 V Logic Supply Voltage VCC Between VCC and COM 13.5 – 16.5 V VBS Between VB and HS Logic Supply Voltage Minimum Input Pulse Width Dead Time Junction Temperature 13.5 – 16.5 V tINmin(on) 0.5 – – μs tINmin(off) 0.5 – – μs tdead 1.5 – – μs TJ – – 125 °C All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 2 SCM1106M High Voltage 3 Phase Motor Driver Typical Application Diagram HS1 SCM 1106 M 8 CBOOT1 7 31 VBB 32 U VB1 VCC1 6 HIN1 5 LIN1 3 COM1 4 FO1 CFO1 HS2 Input Logic & Shoot Through Prevention 1 UV Detect Level Shift HO Drive Circuit UV Detect O.C. Protect 2 Drive LO Circuit 33 LS1 HVIC 1 16 CBOOT2 15 28 VBB 29 V VB2 C o n t r o lle r VCC2 14 HIN2 13 LIN2 11 COM2 FO2 CFO2 HS3 HO UV Input Logic & Shoot Through Prevention 12 9 Detect Level Shift UV Detect O.C. Protect 10 Drive Circuit Drive Circuit M LO 30 LS2 HVIC 2 24 CBOOT3 25 23 VBB VB3 VCC3 22 HIN3 21 LIN3 19 VFO COM3 RFO CN & Shoot Through Prevention 20 FO3 17 CFO3 Input Logic 18 UV Detect Level Shift HO Drive Circuit 26 W UV Detect O.C. Protect Drive LO Circuit VBB 27 LS3 HVIC 3 VCC RS CFO NOTE: ▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them. ▪ To use the OCP circuit, an external shunt resistor, RS, is needed. The RS value can be obtained from the formula: RS(Ω) = 0.5 V / Overcurrent Detection Set Current (A) . ▪ A blanking timer is built-in to mask the noise generated on RS at turn-on. ▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is necessary. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 3 SCM1106M High Voltage 3 Phase Motor Driver ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Logic Supply Voltage Logic Supply Current Input Voltage Input Voltage Hysteresis Input Current Undervoltage Lock Out (High Side) Undervoltage Lock Out (Low Side) FO Terminal Output Voltage Overcurrent Protection Trip Voltage Overcurrent Protection Hold Time Symbol Conditions VCC Between VCC and COM Min Typ Max Units 13.5 – 16.5 V ICC VCC = 15 V, 3 phases operating – 5 8 mA VIH VCC = 15 V, output on – 2.0 2.5 V VIL VCC = 15 V, output off 1.0 1.5 – V VIhys VCC = 15 V – 0.5 – V IIHH VCC = 15 V, VIN = 5 V – 50 100 μA IILH VCC = 15 V, VIN = 0 V – – 2 μA UVHL UVHH UVLL UVLH VFOL VFOH VTRIP tp VCC = 15 V VCC = 15 V VCC = 15 V, VFO = 5 V, RF=10 kΩ VCC = 15 V 10.0 – 12.0 V 10.5 – 12.5 V 10.5 – 12.5 V 11.0 – 13.0 V – – 0.5 V 4.8 – – V 0.46 0.50 0.54 V VCC = 15 V, CFO = 0.022 μF 2 – – ms Blanking Time tblank VCC = 15 V – 2 – μs IGBT Breakdown Voltage VCES VCC = 15 V, IC = 250 μA, VIN = 0 V 600 – – V IGBT Leakage Current ICES VCC = 15 V, VCE = 600 V, VIN = 0 V – – 1 mA V IGBT Saturation Voltage VCE(sat) VCC = 15 V, IC =10 A, VIN = 5 V – 2.2 2.6 Diode Forward Voltage VF VCC = 15 V, IF = 10 A, VIN = 0 V – 1.8 2.2 V Diode Recovery Time trr IF = 10 A, di / dt = 100 A/μs – 50 – ns Diode Leakage Current (Boot Strap) ILb VR = 600 V – 5 10 μA Diode Forward Voltage (Boot Strap) VFb IF = 0.15 A – 1.1 1.3 V Diode Series Resistor (Boot Strap) High Side Switching Time Rb 17.6 22.0 26.4 Ω tdH(on) – 0.42 – μs trH – 0.09 – μs tdH(off) – 0.53 – μs – 0.07 – μs – 0.49 – μs tfH tdL(on) Low Side Switching Time VBB = 300 V, VCC = 15V, IC =10 A, inductive load; VIN 0→5 V or 5→0 V trL – 0.15 – μs tdL(off) – 0.62 – μs tfL – 0.06 – μs Input Output Truth Table HIN LIN OUT L L High Z L H L H L H H H High Z High Z = High Impedence Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 4 SCM1106M High Voltage 3 Phase Motor Driver Pin-out Diagram 25 33 Branded Side 24 1 Terminal List Table Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Number FO1 CFO1 LIN1 COM1 HIN1 VCC1 VB1 HS1 FO2 CFO2 LIN2 COM2 HIN2 VCC2 VB2 HS2 FO3 CFO3 LIN3 COM3 HIN3 VCC3 VB3 HS3 VBB W LS3 VBB V LS2 VBB U 33 LS1 Function U phase fault output for overcurrent and UVLO detected Capacitor for U phase overcurrent protection hold time Signal input for low-side U phase (active high) Supply ground for U phase IC Signal input for high-side U phase (active high) Supply voltage for U phase IC High-side floating supply voltage for U phase High-side floating supply ground for U phase V phase fault output for overcurrent and UVLO detected Capacitor for V phase overcurrent protection hold time Signal input for low-side V phase (active high) Supply ground for V phase IC Signal input for high-side V phase (active high) Supply voltage for V phase IC High-side floating supply voltage for V phase High-side floating supply ground for V phase W phase fault output for overcurrent and UVLO detected Capacitor for W phase overcurrent protection hold time Signal input for low-side W phase (active high) Supply ground for W phase IC Signal input for high-side W phase (active high) Supply voltage for W phase IC High-side floating supply voltage for W phase High-side floating supply ground for W phase Positive dc bus supply voltage Output for W phase Negative dc bus supply ground for W phase Cut-pin ( positive dc bus supply voltage) Output for V phase Negative dc bus supply ground for V phase Cut-pin ( positive dc bus supply voltage) Output for U phase Negative dc bus supply ground for U phase Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 5 SCM1106M High Voltage 3 Phase Motor Driver Timing Diagrams High-Side Driver Input/Output Low-Side Driver Input/Output Hside- Driver I/O Timing Diagrams Lside- Driver I/O Timing Diagrams HIN HIN LIN LIN UVHL UVHH VB- HS *Start from positive edge after UVLO release . UVLL VCC HO HO LO LO FO * No output at H-side UVLO *VCC = 15 V UVLH *Start from positive edge after UVLO release FO * VB- HS =15 V Shoot-Through Prevention Shoot Through Prevention HIN LIN VCC HO LO FO *VCC ,VB- HS = 15 V *While both HIN and LIN are in high state HO and LO turn off and FO signals out Overcurrent Protection Overcurrent Protection LIN IGBT turns off softly after overcurrent condition is detected VB- HS VCC LS BlankingTime (2 μs typ.) FO CFO Vrc (3.5 V typ.) The slope depends on OCP Assist Timer CFO capacitance (2 μs min.) Off operation of all phases can be done by wired OR system * with the three FO pins short circuited Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 6 SCM1106M High Voltage 3 Phase Motor Driver PACKAGE OUTLINE DRAWING Branding Area (Bottom View) Pin pitch measured at root Leadform: 2551 Branding codes (exact appearance at manufacturer discretion) 1st line, type: SCM1106M Dimensions in millimeters 2nd line, lot: YMDDT Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date T is the tracking number Leadframe plating Pb-free. Device composition complies with the RoHS directive. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 7 SCM1106M High Voltage 3 Phase Motor Driver PACKING SPECIFICATION Dimensions in millimeters : Maximum 10 pieces per tube (pins aligned along X direction) Maximum 5 tubes in Y direction Maximum 5 tubes in Z direction < ; Maximum pieces per carton: 10 pieces per tube 5 rows of tubes x 5 layers of tubes 250 pieces per carton Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 8 SCM1106M High Voltage 3 Phase Motor Driver WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 GE Toshiba Silicone Co., Ltd. SC102 Dow Corning Toray Silicone Co., Ltd. Heatsink Mounting Method Torque When Tightening Mounting Screws. The recommended tightening torque for this product package type is: 58.8 to 78.4 N•cm (6.0 to 8.0 kgf•cm). Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 380±5°C • 5s Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 9 SCM1106M High Voltage 3 Phase Motor Driver The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Copyright © 2007 Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 10