data sheet CERAMIC / HERMETIC CerPak Ceramic Pack (CerPak) Amkor Technology continues to service this established industry package. The Amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CerPak is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "flat unformed" leadframe. This package can have leads extending from two sides of the package (dual) or extending from four sides of the package (quad). The ceramic / LF / ceramic system is held together hermetically by glass The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade. Features: The CerPak offers a variety of features: 14-256 lead count, 50-30 mil lead pitch's Hermetic package High thermal conductive ceramic Solder Plate lead finish JEDEC standard compliant Wide selection of available cavity sizes to meet most die size needs • Commercial or full Military flows • • • • • • Applications: Along with the other standard industry packages, the CerPak has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, Microwave, Logic, Memory, Microcontrollers, and Video controllers. Some end applications are: Military electronics, Commercial electronics, Consumer electronics, Automotive and Telecommunications. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS802 Rev Date: 08’02