APX9145 High Sensitivity Hall Effect Sensor IC with FG Output Features General Description • On-chip Hall Sensor The APX9145 is an integrated Hall Effect Sensor IC • Build-in Output Zener Diodes to Clamp the Peak wit h frequenc y generat ion out put for elec t ric commut ation of DC brushless motor applications. Output Voltage • Build-in Frequency Generation Output • High Output Sinking Capability up to 400mA • High Sensitivilty Hall Effect Senser IC: ±65G • 4 pin TO-92M Package • Lead Free Available (RoHS Compliant) The AP X9145 is available in a low c os t TO-92M4 package. Pin Outs APX9145 Applications Front View 1 : FG 2 : DO • Brushless DC Fan 3 : DOB 4 : GND 1 2 3 4 Ordering and Marking Information APX9145 Lead Free Code Handling Code Temp. Range Package Code APX9145 E : Package Code E : TO - 92M4 Operating Ambient Temp. Range E : - 20 to 70 ° C Handling Code PB : Plastic Bag TB : Tape & Box TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device APX 9145 XXXXX XXXXX - Date Code No te: ANPEC lea d-free prod ucts contain mo ld ing co mpo und s/d ie attach m ate ria ls an d 1 00% ma tte tin pla te te rmin atio n fi nish ; wh ich are full y compl iant with Ro HS and compa tibl e wi th both SnPb an d le ad-free sold ieri ng op era tio ns. AN PEC le ad-free produ cts me et or exceed th e l ead -free req uireme nts of IPC /JEDEC J STD -02 0C fo r MSL classi ficati on at lea d-fre e p eak re flo w temp era ture. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 1 www.anpec.com.tw APX9145 Block Diagram Zener Diodes APX9145 Voltage Regulator Hall Element Temperature Compensated Current Amplifier Latch Circuit Hysteresis Control Rotation Frequency Detection Output Buffer 1 DO Output Buffer 2 DOB Zener Diodes Sensitivity Control Gnd FG Pin Description PIN Description No. Name 1 FG Open collector pin for rotation frequency detection 2 DO Coil output / Power input 3 DOB Coil output / Power input 4 GND IC ground Absolute Maximum Ratings Symbol (TA = 25°C unless otherwise noted) Parameter Rating Unit VCC Supply Voltage (DO/DOB Voltage) 25 V VOFF FG Pin Off Voltage 25 V IFG FG Sink Current 10 mA IOUT Output Current 500 mA PD Maximum Power Dissipation 500 mW TJ Junction Temperature Range -20 to 150 TSTG Storage Temperature Range -65 to 150 T SOL Soldering Temperature (10 Sec.) °C 260 Note 1: Stresses beyond the absolute maximum rating may damage the devic e and operating in the absolute maximum rating conditions may affect device reliability. Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / θJA ; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature. C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 2 www.anpec.com.tw APX9145 Recommended Operating Conditions Symbol Parameter VC C Supply voltage (DO/DOB Voltage) I OUT Maximum Output Sink Current I FG Maximum FG Sink Current VOFF Maximum FG Pin Off Voltage TJ Operating Ambient Temperature TA Junction Temperature Range Electrical Characteristics Symbol Parameter VSAT Output Saturation Voltage ICC Supply Current IOFF FG OFF Leakage Current VON FG ON Saturation Voltage Vclamp (TA = 25°C) Rating Unit 3.7 to 20 V 400 mA 5 mA 20 V -20 to 70 °C -20 to 125 °C (TA = 25°C, VCC=12V unless otherwise noted) Test Condition APX9145 Min. IOUT = 400mA IFG = 5mA Max. 700 900 mV 11 15 mA 1 µA 0.4 V 0.2 Clamp Output Voltage Unit Typ. 33 V tr Output Rise Time RL = 200Ω, CL = 10pF 0.4 µS tf Output Fall Time RL = 200Ω, CL = 10pF 0.1 µS td Propagation Delay Time RL = 200Ω, CL = 10pF 2 µS Magnetic Characteristics Symbol Parameter (TA = 25°C, VCC=12V unless otherwise noted) Test Condition APX9145 Min. Typ. Max. Unit Bop Magnetic Operate Points 10 65 Gauss Brp Magnetic Release Points -65 -10 Gauss C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 3 www.anpec.com.tw APX9145 Test Circuit V1 +B V2 -B IFG A IOFF A VON V ICC V VCC Note 1: Measure VCC, ICC when DO is off. Note 2: Measure VON, IFG when FG is on. Note 3: Measure IOFF when FG is off. Application Circuit Typical DC brushless fan applicat ion circuit VDD VFG APX9145 +B -B 1 C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 2 3 4 4 L1 L2 www.anpec.com.tw APX9145 Typical Characteristics (TA = 25°C, VCC=12V unless otherwise noted) Supply Current vs. Temperature 12 12 10 11.5 Supply Current (mA) Supply Current (mA) Supply Current vs. Supply Voltage 8 6 4 10.5 10 9.5 2 9 -20 0 0 5 10 15 20 25 0 20 40 60 80 100 120 140 Supply Voltage (V) Temperature (°C) Magnetic Switching Points vs. Supply Voltage Magnetic Switching Points vs. Temperature 60 Magnetic Switching Points (G) 60 Magnetic Switching Points (G) 11 45 30 15 0 -15 -30 -45 -60 3 7 11 15 19 30 15 0 -15 -30 -45 -60 -20 23 Supply Voltage (V) C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 45 0 20 40 60 80 100 120 140 Temperature (°C) 5 www.anpec.com.tw APX9145 Typical Characteristics (Cont.) Output Current vs. Output Saturation Voltage FG Sink Current vs FG On Saturation Voltage 400 5 FG Sink Current (mA) Output Current (mA) 350 300 250 200 150 4 3 2 1 100 0 0.1 50 0 0.15 0.3 0.45 0.6 0.75 Output Saturation Voltage (V) 0.15 0.2 0.25 FG On Saturation Voltage(V) Power Dissipation vs. Temperature Power Dissipation (mW) 600 500 400 300 200 100 0 0 25 50 75 100 125 Temperature (°C) C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 6 www.anpec.com.tw APX9145 Package Information TO-92M4 Marking Surface S IC chip C E L A L1 b1 e1 J e 1.35mm 1.75mm D Sensitive Area (0.286× 0.286mm2) Position of Hall Sensor reference to the top-left of package x= 1.35 ± 0.1mm y= 1.75± 0.1mm Dim A b1 C D e e1 E J L L1 S Millimeters Min. 3.60 0.35 0.351 5.17 3.78 1.24 1.50 4.04 14.0 1.342 0.45 C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 Inches Max. 3.70 0.41 0.411 5.27 3.84 1.30 1.60 4.34 15.0 1.542 0.55 Min. 0.141 0.014 0.014 0.203 0.148 0.049 0.059 0.158 0.549 0.053 0.018 7 Max. 0.145 0.016 0.016 0.207 0.150 0.051 0.063 0.170 0.588 0.060 0.022 www.anpec.com.tw APX9145 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 ° t 25 C to Peak Time Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3°C/second max. 3°C/second max. (TL to T P) Preheat 100°C 150°C - Temperature Min (Tsmin) ° 150 C 200°C - Temperature Max (Tsmax) 60-120 seconds 60-180 seconds - Time (min to max) (ts) Time maintained above: 183°C 217°C - Temperature (TL) 60-150 seconds 60-150 seconds - Time (t L) Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5 °C of actual 10-30 seconds 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25 °C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 8 www.anpec.com.tw APX9145 Classificatin Reflow Profiles (Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness Volume mm Volume mm <350 ≥ 350 <2.5 mm 240 +0/-5 °C 225 +0/- 5 ° C ≥ 2.5 mm 225 +0/-5 °C 225 +0/- 5 ° C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350 -2000 >2000 <1.6 mm 260 +0 ° C * 260 +0° C* 260 +0 ° C * 1.6 mm – 2.5 mm 260 +0 ° C * 250 +0° C* 245 +0 ° C * ≥ 2.5 mm 250 +0 ° C * 245 +0° C* 245 +0 ° C * *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 ° C+0 °C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245° C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121 ° C -65° C ~ 150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ko Ao C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 D1 9 www.anpec.com.tw APX9145 Carrier Tape & Reel Dimensions (Cont.) T2 J C A B T1 Application TO-92 A0 A1 A2 A3 B0 B1 B2 C0 C1 3.18~12 90±1 76±1 30±1 90±1 31±1 76±1 5.8 3.8 C2 D D1 D2 F1-F2 M H H1 7.8 4.0±0.2 0.36~0.53 9.0 MAX ±0.3 2.5±0.5 16±0.5 9±0.5 H2 H2A H3 H4 F1=F2 2.5+0.2 -0.1 H5=H0+M L L1 P P1 18.5±0.5 11.0 MAX 2.5 MIN 12.7±0.3 6.35±0.4 T3 T4 W W1 W2 15 1.7 18.0±0.2 6.0±0.2 ≤1 0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX P2 T T1 T2 50.8±0.5 0.55 MAX 1.42 MAX 0.36~0.68 (mm) Cover Tape Dimensions Application TO-92 Carrier Width 17.5~19 Cover Tape Width 5.0~7.0 Devices Per Reel 2000 (mm) Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 C opyright ANPEC Electronics C orp. Rev. A.2 - Nov., 2005 10 www.anpec.com.tw