ANPEC APX9145EE-PB

APX9145
High Sensitivity Hall Effect Sensor IC with FG Output
Features
General Description
•
On-chip Hall Sensor
The APX9145 is an integrated Hall Effect Sensor IC
•
Build-in Output Zener Diodes to Clamp the Peak
wit h frequenc y generat ion out put for elec t ric
commut ation of DC brushless motor applications.
Output Voltage
•
Build-in Frequency Generation Output
•
High Output Sinking Capability up to 400mA
•
High Sensitivilty Hall Effect Senser IC: ±65G
•
4 pin TO-92M Package
•
Lead Free Available (RoHS Compliant)
The AP X9145 is available in a low c os t TO-92M4
package.
Pin Outs
APX9145
Applications
Front View
1 : FG
2 : DO
•
Brushless DC Fan
3 : DOB
4 : GND
1 2 3 4
Ordering and Marking Information
APX9145
Lead Free Code
Handling Code
Temp. Range
Package Code
APX9145 E :
Package Code
E : TO - 92M4
Operating Ambient Temp. Range
E : - 20 to 70 ° C
Handling Code
PB : Plastic Bag
TB : Tape & Box
TR : Tape & Reel
Lead Free Code
L : Lead Free Device
Blank : Original Device
APX
9145
XXXXX
XXXXX - Date Code
No te: ANPEC lea d-free prod ucts contain mo ld ing co mpo und s/d ie attach m ate ria ls an d 1 00% ma tte tin pla te
te rmin atio n fi nish ; wh ich are full y compl iant with Ro HS and compa tibl e wi th both SnPb an d le ad-free sold ieri ng
op era tio ns. AN PEC le ad-free produ cts me et or exceed th e l ead -free req uireme nts of IPC /JEDEC J STD -02 0C
fo r MSL classi ficati on at lea d-fre e p eak re flo w temp era ture.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
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APX9145
Block Diagram
Zener
Diodes
APX9145
Voltage
Regulator
Hall
Element
Temperature
Compensated
Current
Amplifier
Latch
Circuit
Hysteresis
Control
Rotation
Frequency
Detection
Output
Buffer 1
DO
Output
Buffer 2
DOB
Zener
Diodes
Sensitivity
Control
Gnd
FG
Pin Description
PIN
Description
No.
Name
1
FG
Open collector pin for rotation frequency detection
2
DO
Coil output / Power input
3
DOB
Coil output / Power input
4
GND
IC ground
Absolute Maximum Ratings
Symbol
(TA = 25°C unless otherwise noted)
Parameter
Rating
Unit
VCC
Supply Voltage (DO/DOB Voltage)
25
V
VOFF
FG Pin Off Voltage
25
V
IFG
FG Sink Current
10
mA
IOUT
Output Current
500
mA
PD
Maximum Power Dissipation
500
mW
TJ
Junction Temperature Range
-20 to 150
TSTG
Storage Temperature Range
-65 to 150
T SOL
Soldering Temperature (10 Sec.)
°C
260
Note 1: Stresses beyond the absolute maximum rating may damage the devic e and operating in the absolute
maximum rating conditions may affect device reliability.
Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) =
(TJ – TA) / θJA ; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature.
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APX9145
Recommended Operating Conditions
Symbol
Parameter
VC C
Supply voltage (DO/DOB Voltage)
I OUT
Maximum Output Sink Current
I FG
Maximum FG Sink Current
VOFF
Maximum FG Pin Off Voltage
TJ
Operating Ambient Temperature
TA
Junction Temperature Range
Electrical Characteristics
Symbol
Parameter
VSAT
Output Saturation Voltage
ICC
Supply Current
IOFF
FG OFF Leakage Current
VON
FG ON Saturation Voltage
Vclamp
(TA = 25°C)
Rating
Unit
3.7 to 20
V
400
mA
5
mA
20
V
-20 to 70
°C
-20 to 125
°C
(TA = 25°C, VCC=12V unless otherwise noted)
Test Condition
APX9145
Min.
IOUT = 400mA
IFG = 5mA
Max.
700
900
mV
11
15
mA
1
µA
0.4
V
0.2
Clamp Output Voltage
Unit
Typ.
33
V
tr
Output Rise Time
RL = 200Ω, CL = 10pF
0.4
µS
tf
Output Fall Time
RL = 200Ω, CL = 10pF
0.1
µS
td
Propagation Delay Time
RL = 200Ω, CL = 10pF
2
µS
Magnetic Characteristics
Symbol
Parameter
(TA = 25°C, VCC=12V unless otherwise noted)
Test Condition
APX9145
Min.
Typ.
Max.
Unit
Bop
Magnetic Operate Points
10
65
Gauss
Brp
Magnetic Release Points
-65
-10
Gauss
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APX9145
Test Circuit
V1
+B
V2
-B
IFG
A IOFF
A
VON V
ICC
V VCC
Note 1: Measure VCC, ICC when DO is off.
Note 2: Measure VON, IFG when FG is on.
Note 3: Measure IOFF when FG is off.
Application Circuit
Typical DC brushless fan applicat ion circuit
VDD
VFG
APX9145
+B
-B
1
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Rev. A.2 - Nov., 2005
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4
L1
L2
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APX9145
Typical Characteristics
(TA = 25°C, VCC=12V unless otherwise noted)
Supply Current vs. Temperature
12
12
10
11.5
Supply Current (mA)
Supply Current (mA)
Supply Current vs. Supply Voltage
8
6
4
10.5
10
9.5
2
9
-20
0
0
5
10
15
20
25
0
20
40
60
80
100
120
140
Supply Voltage (V)
Temperature (°C)
Magnetic Switching Points vs. Supply Voltage
Magnetic Switching Points vs. Temperature
60
Magnetic Switching Points (G)
60
Magnetic Switching Points (G)
11
45
30
15
0
-15
-30
-45
-60
3
7
11
15
19
30
15
0
-15
-30
-45
-60
-20
23
Supply Voltage (V)
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Rev. A.2 - Nov., 2005
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0
20
40
60
80
100
120
140
Temperature (°C)
5
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APX9145
Typical Characteristics (Cont.)
Output Current vs. Output Saturation Voltage
FG Sink Current vs FG On Saturation Voltage
400
5
FG Sink Current (mA)
Output Current (mA)
350
300
250
200
150
4
3
2
1
100
0
0.1
50
0
0.15
0.3
0.45
0.6
0.75
Output Saturation Voltage (V)
0.15
0.2
0.25
FG On Saturation Voltage(V)
Power Dissipation vs. Temperature
Power Dissipation (mW)
600
500
400
300
200
100
0
0
25
50
75
100
125
Temperature (°C)
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APX9145
Package Information
TO-92M4
Marking Surface
S
IC chip
C
E
L
A
L1
b1
e1
J
e
1.35mm
1.75mm
D
Sensitive Area (0.286× 0.286mm2)
Position of Hall Sensor
reference to the top-left of package
x= 1.35 ± 0.1mm
y= 1.75± 0.1mm
Dim
A
b1
C
D
e
e1
E
J
L
L1
S
Millimeters
Min.
3.60
0.35
0.351
5.17
3.78
1.24
1.50
4.04
14.0
1.342
0.45
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Inches
Max.
3.70
0.41
0.411
5.27
3.84
1.30
1.60
4.34
15.0
1.542
0.55
Min.
0.141
0.014
0.014
0.203
0.148
0.049
0.059
0.158
0.549
0.053
0.018
7
Max.
0.145
0.016
0.016
0.207
0.150
0.051
0.063
0.170
0.588
0.060
0.022
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APX9145
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
T L to T P
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
°
t 25 C to Peak
Time
Classificatin Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
3°C/second max.
3°C/second max.
(TL to T P)
Preheat
100°C
150°C
- Temperature Min (Tsmin)
°
150 C
200°C
- Temperature Max (Tsmax)
60-120 seconds
60-180 seconds
- Time (min to max) (ts)
Time maintained above:
183°C
217°C
- Temperature (TL)
60-150
seconds
60-150
seconds
- Time (t L)
Peak/Classificatioon Temperature (Tp)
See table 1
See table 2
Time within 5 °C of actual
10-30 seconds
20-40 seconds
Peak Temperature (tp)
Ramp-down Rate
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25 °C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
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APX9145
Classificatin Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
3
3
Package Thickness
Volume mm
Volume mm
<350
≥ 350
<2.5 mm
240 +0/-5 °C
225 +0/- 5 ° C
≥ 2.5 mm
225 +0/-5 °C
225 +0/- 5 ° C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350 -2000
>2000
<1.6 mm
260 +0 ° C *
260 +0° C*
260 +0 ° C *
1.6 mm – 2.5 mm
260 +0 ° C *
250 +0° C*
245 +0 ° C *
≥ 2.5 mm
250 +0 ° C *
245 +0° C*
245 +0 ° C *
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0 °C.
For example 260 ° C+0 °C) at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245° C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121 ° C
-65° C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
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Rev. A.2 - Nov., 2005
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APX9145
Carrier Tape & Reel Dimensions (Cont.)
T2
J
C
A
B
T1
Application
TO-92
A0
A1
A2
A3
B0
B1
B2
C0
C1
3.18~12
90±1
76±1
30±1
90±1
31±1
76±1
5.8
3.8
C2
D
D1
D2
F1-F2
M
H
H1
7.8
4.0±0.2
0.36~0.53
9.0 MAX
±0.3
2.5±0.5
16±0.5
9±0.5
H2
H2A
H3
H4
F1=F2
2.5+0.2
-0.1
H5=H0+M
L
L1
P
P1
18.5±0.5
11.0 MAX
2.5 MIN
12.7±0.3
6.35±0.4
T3
T4
W
W1
W2
15
1.7
18.0±0.2
6.0±0.2
≤1
0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX
P2
T
T1
T2
50.8±0.5 0.55 MAX 1.42 MAX 0.36~0.68
(mm)
Cover Tape Dimensions
Application
TO-92
Carrier Width
17.5~19
Cover Tape Width
5.0~7.0
Devices Per Reel
2000
(mm)
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
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