Quartz SMD, Ceramic HC5032/2 HC5032/4 Features: - Application: Bluetooth, wireless LAN - Ultra-thin and small leadress type - Automatic mounting is enabled by emboss taping - Reflow soldering Specifications Symbol f Df/f CL HC5032 12.000MHz ~ 50.000MHz 40.000MHz ~ 80.000 MHz ± 30ppm ~ ±50ppm 10pF ~ 32pF Storage temperature Df/f TSTG ± 30ppm ~ ± 50ppm -55°c ~ +125°C Operating temperature TOPR -20°C ~ +70°C Maximum drive level MDL 300mW Recommended drive level RDL 10mW ~ 100mW As per table Frequency range Frequency tolerance,Ta=25°C Load capacitance Temperature tolerance Temperature range Drive level Series resistance R1 Shunt capacitance C0 5pF Insulation resistance Aging IR 500M Ohm ±3 ~ ± 5ppm/Year DfA Resistance of series resonance (ESR) Frequency (MHz) Mode 12 ~ 16 Fundamental 16 ~ 25 Fundamental Ohm 60 50 Remarks Fundamental mode 3rd. OT Please specify Please specify Please specify Others are offered 25°C Frequency (MHz) 25 ~ 50 40 ~ 80 Mode Fundamental 3rd OT Ohm 35 100 Drawing HC5032/2 HC5032/4 Order key Q Part Q=Quartz - 40.000000M - HC5032/2 Frequency M=MHz Package -F - 50 - 50 -D - 30 - TR Mode of Frequency Temperature Temperature Load oscillation tolerance tolerance range capacitance HC5032/2 F=fund. +/-ppm +/-ppm A= pF TR=Tape and reel HC5032/4 3=3.OT (25°C) (Temp. range) B=-10°C ~ 60°C SR=series X=Special options 0°C ~ 70°C Option C=-10°C ~ 70°C /2 = 2 pads D=-20°C ~ 70°C /4 = 4 pads E=-40°C ~ 85°C H=-20°C ~ +80°C I=-10°C ~ +50°C Remarks: All specifications subject to change without notice! 2.13