Quartz SMD, Epoxy HE5032/2 HE5032/4 Features: - Application: Bluetooth, wireless LAN - Ultra-thin and small leadress type - Automatic mounting is enabled by emboss taping - Rreflow soldering - RoHS conform Specifications Symbol f Df/f CL HE5032 12.000MHz – 40.000MHz ± 30ppm ~ ±50ppm 10pF ~ 30pF Storage temperature Df/f TSTG ± 30ppm ~± 50ppm -30°C ~ +85°C Operating temperature TOPR 0°C ~ +70°C Maximum drive level MDL 500mW Recommended drive level RDL Frequency range Frequency tolerance,Ta=25°C Load capacitance Temperature tolerance Temperature range Drive level Remarks Fundamental mode Please specify Please specify Please specify Others are offered Series resistance R1 20mW ~ 100mW As per table 25°C Shunt capacitance C0 7pF Max Insulation resistance Aging IR 500M Ohm ± 5ppm/Year Min DfA Resistance of series resonance (ESR) Frequency (MHz) Mode 12 – 16 Fundamental Ohm 80 Frequency (MHz) 16 – 40 Mode Fundamental Ohm 50 Drawing HE5032/2 HE5032/4 Dimensions in mm Order key Q Part Q=Quartz - 40.000000M - HE5032/2 Frequency M=MHz Package HE5032/2 HE5032/4 -F - 30 - 30 -A - 30 - TR Mode of Frequency Temperature Temperature Load oscillation tolerance tolerance range capacitance F=fund. +/-ppm +/-ppm A= pF TR=Tape and reel (25°C) (Temp. range) B=-10°C ~ 60°C SR=series X=Special options 0°C ~ 70°C Option C=-10°C ~ 70°C /2 = 2 pads D=-20°C ~ 70°C /4 = 4 pads H=-20°C ~ +80°C I=-10°C ~ +50°C Remarks: All specifications subject to change without notice! 2.10