AURIS HE5034

Quartz SMD, Epoxy
HE5032/2
HE5032/4
Features:
- Application: Bluetooth, wireless LAN
- Ultra-thin and small leadress type
- Automatic mounting is enabled by emboss taping
- Rreflow soldering
- RoHS conform
Specifications
Symbol
f
Df/f
CL
HE5032
12.000MHz – 40.000MHz
± 30ppm ~ ±50ppm
10pF ~ 30pF
Storage temperature
Df/f
TSTG
± 30ppm ~± 50ppm
-30°C ~ +85°C
Operating temperature
TOPR
0°C ~ +70°C
Maximum drive level
MDL
500mW
Recommended drive level
RDL
Frequency range
Frequency tolerance,Ta=25°C
Load capacitance
Temperature tolerance
Temperature range
Drive level
Remarks
Fundamental mode
Please specify
Please specify
Please specify
Others are offered
Series resistance
R1
20mW ~ 100mW
As per table
25°C
Shunt capacitance
C0
7pF
Max
Insulation resistance
Aging
IR
500M Ohm
± 5ppm/Year
Min
DfA
Resistance of series resonance (ESR)
Frequency (MHz)
Mode
12 – 16
Fundamental
Ohm
80
Frequency (MHz)
16 – 40
Mode
Fundamental
Ohm
50
Drawing
HE5032/2
HE5032/4
Dimensions in mm
Order key
Q
Part
Q=Quartz
- 40.000000M - HE5032/2
Frequency
M=MHz
Package
HE5032/2
HE5032/4
-F
- 30
- 30
-A
- 30
- TR
Mode of
Frequency
Temperature
Temperature
Load
oscillation
tolerance
tolerance
range
capacitance
F=fund.
+/-ppm
+/-ppm
A=
pF
TR=Tape and reel
(25°C)
(Temp. range)
B=-10°C ~ 60°C
SR=series
X=Special options
0°C ~ 70°C
Option
C=-10°C ~ 70°C
/2 = 2 pads
D=-20°C ~ 70°C
/4 = 4 pads
H=-20°C ~ +80°C
I=-10°C ~ +50°C
Remarks: All specifications subject to change without notice!
2.10