BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Features: 1. Emitted Color :Hi-Eff Red and Yellow Green ●Package Dimensions: 2. Lens Appearance : Water Clear. 3. Bi-color type. 4. 3.2x2.7x1.1mm(1210) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Hi-Eff Red Yellow Green Unit Power Dissipation Pd 80 100 mW Forward Current IF 30 30 mA Peak Forward Current ＊1 IFP 100 100 mA Reverse Volage VR 5 V Operating Temperature Topr -25℃~80℃ - Storage Temperature Tstg -30℃~85℃ - Soldering Temperature Tsol See Page5 - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.2.0 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Forward Voltage Vf IF=20mA Luminous Intensity Iv IF=20mA Reverse Current IR VR=5V Peak Wave Length λp IF=20mA Dominant Wave Length λd IF=20mA Spectral Line Half-width Δλ IF=20mA Veiwing Angle 2θ1/2 IF=20mA Color Min. Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Typ. Max. Unit 2.6 2.6 V 3.7 8.2 2.0 2.2 10.0 15 - mcd - - 100 µA - 640 568 - nm 638 576 nm - 624 566 - 40 30 - nm - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength (G) vs. ambient temperature (R) 1.0 60 Forward Current (mA) 0.5 40 30 20 10 0 20 40 60 80 100 Ambient temperature Ta( C) 0 530 580 630 680 Wavelength (nm) Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage (R) (G) 3.0 2.5 30 20 (Normalized @ 20mA) Relative luminous intensity Forward current (mA) 40 10 2.0 1.5 1.0 0.5 0 1 2 3 4 0 -40 5 -20 Forward voltage(V) 0 20 60 40 Ambient temperature Ta( C) A Fig.5 Relative luminous intensity vs. forward current Fig.6 Radiation diagram 0 4.0 10 20 3.0 (G) (R) 2.0 1.0 Relative radlant intensity 30 Relative luminous intensity (@20mA) Relative radiant intensity 50 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 5 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.2.0 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Tapping and packaging specifications(Units: mm) 1.5± 0.1 4.0 ± 0.1 179± 1 TRAILER 13.0± 0.5 71.0± 0.1 3.5 ± 0.05 1.75 ± 0.1 4.0 ± 0.1 3.35± 0.1 END 8.0 ± 0.3 ANODE 2.82 ± 0.1 START CATHODE CATHODE 13.0± 0.5 1.27± 0.1 5.3 ± 0.05 ANODE USER DIRECTION OF FEED LEADER 0.3 FIXING TAPE 2.0± 0.05 NOTE: 3000 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.2.0 Page 3 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Bin Limits I n t e n s i t y B i n L i m i ts ( E 1 ) ( A t 2 0 m A ) BIN CODE Min. (mcd) G 3.2 6.3 H 4.8 9.4 J 7.0 14.0 K 11 . 0 21.0 I n t e n s i t y B i n L i m i ts ( X 1 ) ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) J 7.0 14.0 K 11 . 0 21.0 L 16.0 32.0 M 24.0 48.0 C o l o r B i n L i m i ts ( X 1 ) ( A t 2 0 m A ) BIN CODE Min. (nm) ● B IN： x - x Max. (mcd) Max. (nm) 4 565 569 5 567 571 6 569 573 7 571 575 8 573 577 x Color BIN CODE (X1) Intensity BIN CODE (X1) Intensity BIN CODE (E1) Ver.2.0 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+85℃±5℃ Test time=1,000hrs 0/20 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 235℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA 1.U means the upper limit of specified characteristics. Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.2.0 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 235℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. Temperature 140~160℃ 235℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.2.0 Page 6 of 7 BRIGHT LED ELECTRONICS CORP. BL-HE1X133B-TRB SINCE 1981 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver.2.0 Page 7 of 7