CYStech Electronics Corp. Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 1/6 PNP Digital Transistors (Built-in Resistors) DTA114EA3 Features • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit). • The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the input. They also have the advantage of almost completely eliminating parasitic effects. • Only the on/off conditions need to be set for operation, making device design easy. • Complements the DTC114EA3 Equivalent Circuit Outline DTA114EA3 TO-92 R1=10kΩ , R2=10 kΩ IN(B) : Base OUT(C) : Collector GND(E) : Emitter GOI Absolute Maximum Ratings (Ta=25°C) Parameter Supply Voltage Input Voltage Output Current Power Dissipation Junction Temperature Storage Temperature DTA114EA3 Symbol Limits Unit VCC VIN IO -50 -40~+10 -50 -100 400 150 -55~+150 V V mA mA mW °C °C IO(max) Pd Tj Tstg CYStek Product Specification CYStech Electronics Corp. Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 2/6 Electrical Characteristics (Ta=25°C) Parameter Input Voltage Output Voltage Input Current Output Current DC Current Gain Input Resistance Resistance Ratio Transition Frequency Symbol VI(off) VI(on) VO(on) II IO(off) GI R1 R2/R1 fT Min. -3 30 7 0.8 - Typ. 10 1 250 Max. -0.5 -0.3 -0.88 -0.5 13 1.2 - Unit V V V mA µA kΩ MHz Test Conditions VCC=-5V, IO=-100µA VO=-0.3V, Io=-10mA IO/II=-10mA/-0.5mA VI=-5V VCC=-50V, VI=0V VO=-5V, IO=-5mA VCE=-10V, IC=-5mA, f=100MHz * * Transition frequency of the device DTA114EA3 CYStek Product Specification Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Current Gain vs Output Current Output Voltage vs Output Current 10 1000 Io / Ii = 20 Output Voltage---VO(ON)(V) Current Gain---GI Vo = 5V 100 1 0.1 0.01 10 0.1 1 10 Output Current---IO(mA) 1 100 100 Output Current vs Input Voltage(OFF characteristics) Input Voltage vs Output Current(ON characteristics) 10 100 VCC = 5 V Output Current---IO(mA) Vo = 0.3V Input Voltage---VI(ON)(V) 10 Output Current---IO(mA) 10 1 1 0.1 0.01 0.1 0.1 1 10 Output Current---IO(mA) 100 0 0.5 1 1.5 2 2.5 3 Input Voltage---VI(OFF) (V) Power Derating Curve 450 Power Dissipation---PD(mW) 400 350 300 250 200 150 100 50 0 0 DTA114EA3 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 4/6 CYStech Electronics Corp. TO-92 Dimension α2 A Marking: B 1 2 DTA114E 3 α3 C D H I G α1 Style : Pin 1.GND(Emitter) 2.OUT(Collector) 3.IN(Base) E F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DTA114EA3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 5/6 TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - DTA114EA3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C252A3 Issued Date : 2003.09.29 Revised Date : Page No. : 6/6 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DTA114EA3 CYStek Product Specification