Data Sheet No. TSBD-3500D-1B DIOTEC ELECTRONICS CORP 18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958 MECHANICAL SPECIFICATION FEATURES Die Size: 0.180" x 0.180" Square VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION R D A PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE R Soft Glass Passivation G Large die for high power capability F B Silicon Die Silver Plated Copper Slugs Very low forward voltage drop Built-in stress relief mechanism for die protection Silver plated substrates for corrosion resistance and superior soldeability MILLIMETERS DIM 5.33 MAX 5.46 B 2.03 D 4.70 0.64 0.96 Soldering temperature: 250 oC maximum A Protects expensive automotive electronics and mobile equipment F G MIN INCHES MIN 0.210 MAX 0.215 2.16 0.080 0.085 4.83 0.185 0.190 0.76 1.09 0.025 0.038 0.030 0.043 MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS Ratings at 25 °C ambient temperature unless otherwise specified. PARAMETER (TEST CONDITIONS) SYMBOL UNITS TVS3527D Series Number Maximum Recurrent Peak Reverse Voltage VRRM Working Peak Reverse Voltage VRWM Maximum DC Blocking Voltage 23 VOLTS VDC o Breakdown Voltage (IR = 100 mA dc, Tc = 25 C) Average Rectified Forward Current (Single phase, Resistive load, 60 Hz) Non-repetitive Peak Forward Surge Current (Half wave, Single phase, 60 Hz sine applied to rated load) Repetitive Peak Reverse Surge Current (Time constant = 10 mSec Duty cycle < 1.0%, Tc = 25 oC) Instantaneous Forward Voltage Maximum Typical (IF = 80A @300 µSec pulse, TC = 25oC) O Maximum DC Reverse Current (VR = 20V DC, Tc = 25 C) Maximum Thermal Resistance, Junction to Lead (Note 1) Junction Operating & Storage Temperature Range Notes: 1) Single Side Cooled RATINGS V(BR) 24 Min / 32 Max IO 35 IFSM 500 IRSM 110 VF 1.05 1.00 VOLTS IR 200 nA RθJC 0.8 °C/W TJ,TSTG -65 to +175 °C AMPS 3.01 tvs35d J11