Technical Data Sheet High Power Infrared LED HIR5393C/L223 Features ․Popular 10mm package. ․High radiant intensity ․Peak wavelength λp=850nm ․Low forward voltage ․Pb free ․The product itself will remain within RoHS compliant version. ․Soldering methods: Dip soldering. Descriptions ․EVERLIGHT’S Infrared Emitting Diode(HIR5393C/L223) is a high intensity diode , molded in a water clear plastic package. ․The device is spectrally matched with phototransistor , photodiode and infrared receiver module. Applications ․CCD Camera ․Infrared applied system Device Selection Guide LED Part No. Chip Material Lens Color HIR5393C/L223 GaAlAs Water Clear Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 1 of 8 HIR5393C/L223 Package Dimensions ± ± ± ± ± ± ± ± ± ․Other dimensions are in millimeters, tolerance is 0.25mm except being specified. ․Protruded resin under flange is 1.5mm Max LED. ․Bare copper alloy is exposed at tie-bar portion after cutting. Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 2 of 8 HIR5393C/L223 Absolute Maximum Ratings (Ta=25℃ ℃) Parameter Symbol Rating Continuous Forward Current IF 350 Units mA Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +100 ℃ Tstg Rth(j-L) -40 ~ +100 ℃ K/W W Storage Temperature Thermal resistance (junction to leadframe) Soldering Temperature*1 Tsol 20 260 ±5 Power Dissipation at(or below) 25℃Free Air Temperature Pd 0.5 ℃ Notes: *1:Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃ ℃) Parameter Symbol Condition IF=150mA Min. Typ. Max. 150 200 326 nm nm Radiant Intensity Ie IF=350mA -- 470 Peak Wavelength λp IF=20mA -- 850 --- Spectral Bandwidth Δλ IF=20mA -- 50 -- Units mW/sr IF=150mA Forward Voltage VF -- 1.5 2.1 IF=350mA Reverse Current IR 2θ1/2 VR=5V --- 1.7 -- 2.4 10 IF=20mA -- 25 -- μA deg Rise Time Tr IF=20mA -- 11 -- ns Fall Time Tf IF=20mA -- 7 -- ns View Angle V Rank Condition：IF=150mA Unit：mW/sr Bin Number A B C D Min 150 175 200 225 Max 218 254 290 326 Note. 1. Radiant Intensity measurement tolerance : ±10% 2 .2θ1/2 is the off axis angle from lamp centerline where the radiant intensity is 1/2 of the peak value. 3. Forward Voltage measurement tolerance : ±0.1V Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 3 of 8 HIR5393C/L223 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Ambient Temperature Fig.2 Spectral Distribution 400 100 IF=20mA Ta=25° C 350 80 Rthj-a=50 °C/W 300 60 250 200 40 150 20 100 0 50 0 Fig.3 20 40 60 790 810 830 850 870 890 910 930 950 80 100 120 140 Peak Emission Wavelength Fig.4 Forward Current Ambient Temperature vs. Forward Voltage 900 3.0 2.8 2.6 875 2.4 2.2 850 2.0 1.8 1.6 825 1.4 1.2 800 -25 0 25 50 75 100 1.0 0 100 200 300 400 500 600 700 800 900 1000 Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 4 of 8 HIR5393C/L223 Typical Electro-Optical Characteristics Curves Fig.5 Relative Intensity vs. Fig.6 Relative Radiant Intensity vs. Forward Current Angular Displacement -20 Ie-Radiant Intensity(mW/sr) 1000 -10 0 10 20 30 100 10 0 10 0 10 1 2 10 10 3 1.0 40 0.9 50 0.8 0.7 60 10 4 70 80 0.6 0.4 0.2 0 0.2 0.4 0.6 IF-Forward Current (mA) Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 5 of 8 HIR5393C/L223 Reliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes Failure Judgement Ac/Re Criteria 1 Solder Heat TEMP.：260℃±5℃ 2 Temperature Cycle H : +100℃ 3 Thermal Shock 10secs 15mins 300Cycles L : -40℃ 5mins 15mins H :+100℃ 5mins L :-10℃ 10secs 5mins 22pcs 22pcs 0/1 IR≧U×2 0/1 Ie≦L×0.8 VF≧U×1.2 300Cycles 22pcs 0/1 U：Upper Specification 4 High Temperature Storage TEMP.：+100℃ 1000hrs 22pcs Limit L：Lower 5 Low Temperature Storage TEMP.：-40℃ 1000hrs 22pcs Specification 0/1 Limit 1000hrs 22pcs 0/1 1000hrs 22pcs 0/1 6 DC Operating Life IF=350mA 7 High Temperature/ 85℃ / 85% R.H 0/1 High Humidity Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 6 of 8 HIR5393C/L223 Packing Quantity Specification 1.200PCS/1Bag，3Bags/1Box 2.10Boxes/1Carton Label Form Specification (For box) CPN: Customer’s Production Numb P/N : Production Number QTY: Packing Quantity CAT: Ranks RoHS HIR5393C/L223 HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Notes 1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 4. If the emitter is operated, consider using metal heat sink with the lowest possible thermal resistance. For the thermal performance using a flat heat sink, allow an exposed surface area of about 25mm2 at least. Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by Jaine Tsai ：DIH-539-096 ：12-28-2007 ： Page: 7 of 8 HIR5393C/L223 5. Soldering Condition Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to case, and soldering beyond the base of the tie bar is recommended. Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 400℃ Max. (30W Max.) Preheat temp. 100℃ Max. (60 sec Max.) Soldering time 3 sec Max. Bath temp. 265 Max. Distance 3mm Min.(From solder joint to case) Bath time. 5 sec Max. Distance 3mm Min. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\www.everlight.com Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Device No Prepared date Prepared by ：DIH-539-096 ：12-28-2007 Page: 8 of 8 ：Jaine Tsai