Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Features ․High luminous intensity output ․Oval Shape ․Well defined spatial radiation ․Wide viewing angle (2θ1/2) : 110o / 50 o ․UV resistant epoxy ․The product itself will remain within RoHS compliant version Descriptions ․This precision optical performance oval LED is specifically designed for passenger information signs ․This lamp has matched radiation patterns with yellow, blue or green mixing color applications Applications ․Color Graphic Signs ․Message boards ․Variable message signs (VMS) ․Commercial outdoor advertising Device Selection Guide LED Part No. 3474AN/R3DB-AFGC/R/MS 3474AN/R3DB-AFGC/PR/MS Chip Material Emitted Color AlGaInP Brilliant Red Lens Color Red Diffused Stopper No Yes Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 1 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Package Dimensions Stopper Type No Stopper Type Notes: ․Other dimensions are in millimeters, tolerance is 0.25mm except being specified. ․Protruded resin under flange is 1.5mm Max LED. Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 2 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Absolute Maximum Rating (Ta=25℃) Parameter Forward Current Pulse Forward Current (Duty1/10@ 1KHz) Operating Temperature Storage Temperature Soldering Temperature Power Dissipation Reverse Voltage Electrostatic Discharge Symbol IF Absolute Maximum Rating 50 Unit mA IFP 160 mA Topr Tstg Tsol Pd VR ESD -40 ~ +85 -40 ~ +100 260 120 5 2K ℃ ℃ ℃ mW V V Notes: Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Half width Forward Voltage Reverse Current Symbol IV 2θ1/2 λp λd Δλ VF IR Min. 510 --620 -2.0 -- Typ. -X:110Y:50 632 -20 --- Max. 1020 --632 -2.6 10 Unit mcd deg Condition nm IF=20mA V μA VR=5V Rank Combination (IF=20mA) Rank Luminous Intensity F1 F2 G1 G2 510~610 610~720 720~860 860~1020 *Measurement Uncertainty of Luminous Intensity: ±10% Rank 1 2 Dominant Wavelength 620~626 626~632 Unit:mcd *Measurement Uncertainty of Dominant Wavelength ±1.0nm Unit:nm Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 3 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Typical Electro-Optical Characteristics Curves Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage 50 Forward Current(mA) Relative Intensity(a.u.) 1.0 0.8 0.6 0.4 0.2 0.0 500 550 600 650 40 30 20 10 0 1.0 700 1.5 2.0 Relative Intensity vs. Ambient Temp. 1.5 1.0 0.5 0.0 25 30 35 40 45 50 55 2.5 3.0 3.5 Forward Voltage(V) 60 65 70 Relative Luminous Intensity(a.u.) Relative Luminous Intensity(a.u.) Wavelength(nm) 2.0 2.5 Relative Intensity vs. Forward Current 2.0 1.5 1.0 0.5 0.0 0 10 O 20 30 40 50 Forward Current(mA) Ambient Temperature Ta( C) Forward Current vs. Ambient Temp. Radiation Characteristics Forward Current(mA) 60 50 40 30 20 10 0 0 20 40 60 80 100 O Ambient Temperature Ta( C) Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 4 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Taping Dimensions Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 5 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Taping Sizes Specifications Symbol Items Symbol Avg. mm Inch Tolerance (mm) Tape Feed Hole Diameter D 4.00 0.157 ±0.2 Component Lead Pitch F 2.54 0.100 ±0.3 △H 2.0 0.078 Max Feed Hole to Button of Component H1 H2 0.729 0.969 ±1.0 Feed Hole to Overall Component Height 18.5 24.6 ±1.0 Lead Length after Component Removal L 11.00 0.433 Max Feed Hole Pitch P 12.70 0.500 ±0.3 Lead Location P1 5.10 0.200 ±0.7 Center of Component Location P2 6.35 0.250 ±1.2 Overall Taped Package Thickness T 1.42 0.056 Max Feed Hole Location W0 9.00 0.354 ±0.5 Adhesive Tape Width W1 13.00 0.512 ±0.5 Adhesive Tape Position W2 4.00 0.157 Max Tape Width W3 18.00 0.709 ±0.75 Front-to-Read Deflection Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 6 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Packing Specification ■ Inner Carton EVERLIGHT CPN: P/N:XXXXXXXXXX RoHS XXX/XXXX-XXXX QTY：XXXX CAT:XX HUE:XX REF:XX LOT NO： MADE IN TAIWAN ■ ■ Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Intensity HUE: Rank of Dominant Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Outside Carton ■ Packing Quantity 1. 2500 PCS/1 Inner Carton 2. 10Inner Cartons/1 Outside Carton Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 7 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 300℃ Max. (30W Max.) Preheat temp. 100℃ Max. (60 sec Max.) Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder joint to epoxy bulb) Distance 3mm Min. (From solder joint to epoxy bulb) Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 8 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS Recommended soldering profile laminar wave Fluxing Prehead Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 9 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen Technical Data Sheet 3474AN/R3DB-AFGC/XR/MS 5. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6. ESD (Electrostatic Discharge) Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs. All devices, equipment and machinery must be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 7. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\www.everlight.com Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 10 of 10 Device Number : DT1-347-020 Prepared date: 03-10-20088 Prepared by: Grace Shen