Agilent HSMx-C1xx High Performance Chip LED Data Sheet HSMQ-C110/120/150/170/177/190/191/197/265, HSMR-C110/120/130/150/170/177/190/191/197/265 Description These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C130, C150, C170, C177, C190, C191, C197), in side emitting packages (HSMx-C110, C120) or in a reverse mount package (C265). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C130, C170, C177, C190, C191 and C197 packages, and 3000 units per reel for HSMx-C110, C150 and C265 packages. All packages are compatible with IR soldering and binned by both color and intensity. Features • High brightness • Small size • Industrial standard footprint • Diffused optics • Top emitting or right angle emitting • Compatible with IR soldering • Compatible for use with light piping • Available in 8 mm tape on 7" diameter reel • Reel sealed in zip locked moisture barrier bags Applications • LCD backlighting • Push button backlighting • Front panel indicator • Symbol indicator • Microdisplays • Small message panel signage CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE LINE LED DIE CATHODE MARK LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 0.62 (0.024) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) PC BOARD POLARITY 0.3 (0.012) PC BOARD 0.8 (0.031) 1.6 (0.063 ) 0.5 (0.020) CATHODE LINE 3.2 (0.126 ) 0.8 (0.031) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY POLARITY PC BOARD PC BOARD 0.6 (0.023) 0.3 (0.012) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 0.7 (0.028) MIN. Package Dimensions, continued CATHODE MARK CATHODE MARK LED DIE LED DIE 1.25 (0.049) 1.6 (0.063) 0.8 (0.031) 2.00 (0.079) 0.62 (0.025) 3.2 (0.126 ) POLARITY DIFFUSED EPOXY DIFFUSED EPOXY 0.40 (0.016) POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD 0.16 (0.006) PC BOARD CATHODE LINE CATHODE LINE 0.5 (0.020) 0.50 ± 0.20 (0.020 ± 0.008) 0.50 ± 0.20 (0.020 ± 0.008) 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.10 (0.043) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C150 HSMx-C177 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.3 (0.012) 0.40 (0.016) 1.6 (0.063) 0.80 (0.031) 1.60 (0.063) POLARITY POLARITY 1.2 (0.047) CLEAR EPOXY DIFFUSED EPOXY 0.6 (0.024) 0.40 (0.016) 1.0 (0.039) PC BOARD PC BOARD 0.16 (0.006) 0.5 (0.020) CATHODE LINE 3 – 0.3 (0.012) 0.30 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C197 HSMx-C120 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3 Package Dimensions, continued 3.4 (0.134) CATHODE MARK (ETCHED) CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.25 (0.049) (0.625) 1.6 (0.063) GREEN SOLDER MASK POLARITY UNDIFFUSED EPOXY POLARITY 1.15 (0.045) 1.2 (0.047) 0.23 (0.009) DIFFUSED EPOXY 1.1 (0.043) 1.1 (0.043) 0.35 (0.014) PCB BOARD PC BOARD 0.12 (0.005) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C265 HSMx-C130 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Package Dimension (mm) [1], [2] InGaN Green InGaN Blue Package Description 3.2(L) x 1.0(W) x 1.5(H) 1.6(L) x 0.6(W) x 1.0(H) 1.6(L) x 0.8(W) x 0.35(H) 3.2(L) x 1.6(W) x 1.1(H) 2.0(L) x 1.25(W) x 0.8(H) 2.0(L) x 1.25(W) x 0.4(H) 1.6(L) x 0.8(W) x 0.8(H) 1.6(L) x 0.8(W) x 0.6(H) 1.6(L) x 0.8(W) x 0.4(H) 3.4(L) x 1.25(W) x 1.1(H) HSMQ-C110 HSMQ-C120 – HSMQ-C150 HSMQ-C170 HSMQ-C177 HSMQ-C190 HSMQ-C191 HSMQ-C197 HSMQ-C265 HSMR-C110 HSMR-C120 HSMR-C130 HSMR-C150 HSMR-C170 HSMR-C177 HSMR-C190 HSMR-C191 HSMR-C197 HSMR-C265 Untinted, Non-diffused Untinted, Non-diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. 4 HSMQ-Cxxx HSMR-Cxxx 20 78 5 95 –30 to +85 –40 to +85 See reflow soldering profile (Figures 11 & 12) Units mA mW V ˚C ˚C ˚C Electrical Characteristics at TA = 25˚C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ–PIN (˚C/W) Typ. HSMQ-C110/C150 HSMR-C110/C150 HSMQ-C120 HSMR-C120/C130 HSMQ-C170/C190/C191 HSMR-C170/C190/C191 HSMQ-C177/C197 HSMR-C177/C197 HSMQ-C265 HSMR-C265 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 5 5 5 5 5 5 5 5 5 5 140 140 100 100 110 110 110 110 65 65 450 450 450 450 300 300 350 350 300 300 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 VF Tolerance: ±0.1 V Optical Characteristics at TA = 25˚C Part Number Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. HSMQ-C110 HSMQ-C120 HSMQ-C150/170/190/191 HSMQ-C177/197 HSMQ-C265 HSMR-C110 HSMR-C120 HSMR-C130 HSMR-C150/170/190/191 HSMR-C177/197 HSMR-C265 Green Green Green Green Green Blue Blue Blue Blue Blue Blue 45 45 45 45 45 18 18 18 18 18 18 150 145 145 145 140 60 55 55 55 55 45 Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd[2] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[3] Typ. Luminous Efficacy ηV (lm/w) Typ. 520 520 520 520 520 469 469 469 469 469 469 527 527 527 527 527 473 473 473 473 473 473 130 155 140 130 150 130 155 145 140 130 150 500 500 500 500 500 88 88 88 88 88 88 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Blue Color Bins[1] Bin ID A B C D Tolerance: ±1 nm InGaN Green Color Bins[1] Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0 Tolerance: ±1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 5 Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Bin ID N P Q R S T U V W X Y 28.50 Tolerance: ±15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 100 RELATIVE INTENSITY – % 90 BLUE 80 GREEN 70 60 50 40 30 20 10 0 400 600 500 700 WAVELENGTH – nm 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 10 BLUE 1 0.1 GREEN 0.8 0.6 BLUE 0.4 GREEN 0.2 0 2.0 2.5 3.0 3.5 4.0 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 6 1.0 0 5 10 15 20 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 25 IF MAX – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 25 20 15 RθJ-A = 500°C/W 10 RθJ-A = 600°C/W 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 30 50 70 90 ANGLE RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C120. 7 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C130. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 10. Relative intensity vs. angle for HSMx-C265. 8 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C 10 SEC. MAX. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 100 - 150 °C 60 to 150 SEC. MAX. 120 SEC. 3°C/SEC. MAX. 4°C/SEC. MAX. TIME OVER 2 MIN. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 11. Recommended reflow soldering profile. Figure 12. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) 1.2 (0.047) 0.2 (0.008) CENTERING BOARD 2.0 (0.079) 1.5 (0.059) 1.2 (0.047) 1.5 (0.059) 1.2 (0.047) 0.9 (0.035) Figure 13. Recommended soldering pattern for HSMx-C110. Figure 14. Recommended soldering pattern for HSMx-C170/177. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) Figure 15. Recommended soldering pattern for HSMx-C130/190/191/197. 2.0 (0.079) 1.5 (0.059) Figure 16. Recommended soldering pattern for HSMx-C150. 0.4 (0.016) 2.2 (0.087) DIA. PCB HOLE 0.4 (0.016) 0.7 (0.028) 1.25 (0.049) 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) Figure 17. Recommended soldering pattern for HSMx-C120. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 9 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 18. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 19. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 20. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 0.23 ± 0.05 (0.009 ± 0.002) FOR HSMR-C130 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) HSMx-C110/120 POSITION IN CARRIER TAPE PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ± 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.25 (0.089) 1.80 (0.071) 1.85 (0.073) 1.75 (0.069) DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) 1.20 (0.047) 1.70 (0.067) 0.80 (0.031) 1.15 (0.045) 1.27 (0.050) 1.88 (0.074) 0.95 (0.037) 1.45 (0.057) 0.70 (0.028) 1.32 (0.052) 0.87 (0.034) 0.95 (0.037) 0.85 (0.033) 0.88 (0.035) 0.60 (0.024) 0.95 (0.037) R 1.0 ± 0.05 (0.039 ± 0.002) FOR HSMx-C110 R 0.5 ± 0.05 (0.020 ± 0.002) FOR HSMx-C120 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 21. Tape dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 11 COVER TAPE 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 22. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-4832EN April 22, 2004 5989-0493EN MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours.