5.0 mm DIA LED LAMP 560PR2C REV:A / 0 PACKAGE DIMENSIONS Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 1 HD-R/RD013 5.0 mm DIA LED LAMP REV:A / 0 560PR2C FEATURES * 5.0mm DIA LED LAMP * HIGH LUMINOUS INTENSITY OUTPUT. * LOW POWER CONSUMPTION. * HIGH EFFICIENCY. * VERSATILE MOUNTING ON P.C. BOARD OR PANEL. * I.C. COMPATIBLE. CHIP MATERIALS * Dice Material : GaAlInP/GaAs * Light Color : SUPER RED * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25°C ) SYMBOL ULTRA ORANGE 80 PARAMETER UNIT PAD Power Dissipation Per Chip mW VR Reverse Voltage Per Chip 5 V IAF Continuous Forward Current Per Chip 30 mA IPF Peak Forward Current Per Chip (Duty－0.1,1KHz) 120 mA － Derating Linear From 25°C Per Chip 0.40 mA/°C Topr Operating Temperature Range -25°C to 85°C Tstg Storage Temperature Range -40°C to 85°C Lead Soldering Temperature｛1.6mm(0.063 inch) From Body｝260°C ± 5°C for 5 Seconds ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C ) SYMBOL PARAMETER TEST CONDITION MIN. VF Forward Voltage IF = 20mA IR Reverse Current VR = 5V λD Dominant Wavelength IF = 20mA ∆λ Spectral Line Half-Width IF = 20mA 2θ1/2 Half Intensity Angle IF = 20mA IV Luminous Intensity IF = 20mA DRAWING NO. : DS-35-04-0744 1.8 620 TYP. MAX. UNIT 2.1 2.6 V 100 µA 630 nm 624 20 50 55 2600 3200 DATE : 2004-12-03 nm 60 deg 4000 mcd Page : 2 HD-R/RD014 5.0 mm DIA LED LAMP 560PR2C DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 REV:A / 0 Page : 3 5.0 mm DIA LED LAMP REV:A / 0 560PR2C ySOLDERING METHOD DIP SOLDERING SOLDERING CONDITIONS REMARK Bath temperature: 260±5℃ Immersion time: with 5 sec y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. y During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. s e i r w d a e L l e n a P (Fig.1) 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. s e i r w d a e L te hc gn ia lr sa e al c e v a e L (Fig.2) DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 4 5.0 mm DIA LED LAMP 560PR2C REV:A / 0 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). d r a o b C P （Fig.3 ） jig 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 5 5.0 mm DIA LED LAMP 560PR2C REV:A / 0 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) m m 2 7 . g i F 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 6 5.0 mm DIA LED LAMP 560PR2C REV:A / 0 yLEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Trichloroethylene ╳ ⊙--Usable ╳--Do not use. DRAWING NO. : DS-35-04-0744 NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. DATE : 2004-12-03 Page : 7 5.0 mm DIA LED LAMP ssREV:A / 0 560PR2C Experiment Item: Item OPERATION LIFE HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING THERMAL SHOCK SOLDER RESISTANCE SOLDERABILITY Test Condition Lamp & IR Ta： 25±5℃ IF= 20mA RH：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） Reference Standard MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021：B-1 Ta： 65℃±5℃ RH： 90〜95%RH TEST TIME：240HRS±2HRS MIL-STD-202：103B JIS C 7021 ：B-1 105℃〜25℃〜-55℃〜25℃ 30min 5min 30min 5min 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 105℃±5℃〜-55℃±5℃ 10min 10min 10CYCLES T，sol：260℃±5℃ DWELL TIME：10±lsec T，sol：230℃±5℃ DWELL TIME：5±lsec DRAWING NO. : DS-35-04-0744 MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021：A-1 MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 DATE : 2004-12-03 Page : 8