ETC FBI8B5M1

FBI8A5M1.......FBI8M5M1
8 Amp. Glass Passivated Bridge Rectifier
Voltage
50 to 1000 V.
Plastic
Case
Dimensions in mm.
25
3.2
Current
8.0 A.
3.5
®
_
+
1 + 0.05
• Glass Passivated Junction Chips.
5
5
5
L
suffix
17.5
8
–4
• UL recognized under component index file
0.7
1
• Mounting Instructions
• High temperature soldering guaranteed: 260 ºC – 10 sc.
• Recommended mounting torque: 8 Kg.cm.
•
•
•
•
•
number E130180.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
High surge current capability.
The plastic material carries U/L recognition 94 V-O.
Maximum Ratings, according to IEC publication No. 134
FBI8A
5M1
FBI8B
5M1
FBI8D FBI8G
5M1
5M1
FBI8J FBI8K FBI8M
5M1 5M1
5M1
VRRM
Peak recurrent reverse voltage (V)
50
100
200
400
600
800
1000
VRMS
Maximum RMS voltage (V)
35
70
140
280
420
560
700
IF(AV)
Max. Average forward current with heatsink
without heatsink
IFSM
8.3 ms. peak forward surge current
8.0 A at 100 ºC
3.0 A at 40 ºC
200 A
(Jedec Method)
I2t
Rating for fusing ( t<8.3 ms.)
VDIS
Dielectric strength (terminals to case, AC 1 min.)
Tj
Operating temperature range
– 55 to + 150 °C
Tstg
Storage temperature range
– 55 to +150 ºC
166 A2 sec
1500 V
Electrical Characteristics at Tamb = 25°C
VF
Max. forward voltage drop per element at IF = 8 A
1.0 V
IR
Max. reverse current per element at VRRM
5 A
MAXIMUM THERMAL RESISTANCE
Rth (j-c) Junction-Case. With Heatsink.
Rth (j-a) Junction-Ambient. Without Heatsink.
2.2 ºC/W
22 ºC/W
Jan - 00
FBI8 - 5M1
Characteristic Curves
FORWARD CURRENT DERATING CURVE
TYPICAL FORWARD CHARACTERISTIC
Tamb = 25° C
10
heatsink
Tc
8
Tc
_
+
sine wave
R-load
on heatsink
6
1.0
on glass-epoxi substrate
4
_
+
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
0.1
2
0
0
0.6
1.0
1.4
0
VF , instantaneous forward voltage (V)
25
50
75 100 125 150 175
Tamb, ambient temperature (°C)
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
200
150
100
50
0
1
10
100
Number of cycles at 60 Hz.
Jan - 00