FBI8A5M1.......FBI8M5M1 8 Amp. Glass Passivated Bridge Rectifier Voltage 50 to 1000 V. Plastic Case Dimensions in mm. 25 3.2 Current 8.0 A. 3.5 ® _ + 1 + 0.05 • Glass Passivated Junction Chips. 5 5 5 L suffix 17.5 8 –4 • UL recognized under component index file 0.7 1 • Mounting Instructions • High temperature soldering guaranteed: 260 ºC – 10 sc. • Recommended mounting torque: 8 Kg.cm. • • • • • number E130180. Lead and polarity identifications. Case: Molded Plastic. Ideal for printed circuit board (P.C.B.). High surge current capability. The plastic material carries U/L recognition 94 V-O. Maximum Ratings, according to IEC publication No. 134 FBI8A 5M1 FBI8B 5M1 FBI8D FBI8G 5M1 5M1 FBI8J FBI8K FBI8M 5M1 5M1 5M1 VRRM Peak recurrent reverse voltage (V) 50 100 200 400 600 800 1000 VRMS Maximum RMS voltage (V) 35 70 140 280 420 560 700 IF(AV) Max. Average forward current with heatsink without heatsink IFSM 8.3 ms. peak forward surge current 8.0 A at 100 ºC 3.0 A at 40 ºC 200 A (Jedec Method) I2t Rating for fusing ( t<8.3 ms.) VDIS Dielectric strength (terminals to case, AC 1 min.) Tj Operating temperature range – 55 to + 150 °C Tstg Storage temperature range – 55 to +150 ºC 166 A2 sec 1500 V Electrical Characteristics at Tamb = 25°C VF Max. forward voltage drop per element at IF = 8 A 1.0 V IR Max. reverse current per element at VRRM 5 A MAXIMUM THERMAL RESISTANCE Rth (j-c) Junction-Case. With Heatsink. Rth (j-a) Junction-Ambient. Without Heatsink. 2.2 ºC/W 22 ºC/W Jan - 00 FBI8 - 5M1 Characteristic Curves FORWARD CURRENT DERATING CURVE TYPICAL FORWARD CHARACTERISTIC Tamb = 25° C 10 heatsink Tc 8 Tc _ + sine wave R-load on heatsink 6 1.0 on glass-epoxi substrate 4 _ + P.C.B. soldering land 5 mm ø sine wave R-load free in air 0.1 2 0 0 0.6 1.0 1.4 0 VF , instantaneous forward voltage (V) 25 50 75 100 125 150 175 Tamb, ambient temperature (°C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 200 150 100 50 0 1 10 100 Number of cycles at 60 Hz. Jan - 00