TECHNICAL DATA KK74ACT112 Dual J-K Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS The KK74ACT112 is identical in pinout to the LS/ALS112, HC/HCT112. The KK74ACT112 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. Each flip-flop is negative-edge clocked and has active-low asynchronous Set and Reset inputs. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 µA; 0.1 µA @ 25°C • Outputs Source/Sink 24 mA ORDERING INFORMATION KK74ACT112N Plastic KK74ACT112D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 16=VCC PIN 8 = GND Outputs Set Reset Clock J K Q Q L H X X X H L H L X X X L H X X L * L* L L X H H L L No Change H H L H L H H H H L H L H H H H Toggle H H L X X No Change H H H X X No Change H H X X No Change * Both outputs will remain low as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously X = Don’t Care 1 KK74ACT112 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 4.5 5.5 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 10 8.0 ns/V -40 VCC =4.5 V VCC =5.5 V 0 0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74ACT112 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC - 0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC - 0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage IOUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V 4.5 5.5 3.86 4.86 3.76 4.76 4.5 5.5 0.1 0.1 0.1 0.1 VIN= VIL or VIH IOL=24 mA IOL=24 mA 4.5 5.5 0.36 0.36 0.44 0.44 ±0.1 ±1.0 µA * VIN= VIL or VIH IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA V * IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ∆ICCT Additional Max ICC/Input VIN=VCC - 2.1 V 5.5 1.5 mA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 40 µA 4.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. 3 KK74ACT112 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 25 °C Min -40°C to 85°C Max Min Unit Max fmax Maximum Clock Frequency (Figure 1) 145 125 tPLH Propagation Delay, Clock to Q or Q (Figure 1) 1.0 14.0 1.0 15.0 ns tPHL Propagation Delay, Clock to Q or Q (Figure 1) 1.0 14.0 1.0 14.5 ns tPLH Propagation Delay, Set or Reset to Q or Q (Figure 2) 1.0 12.0 1.0 12.5 ns tPHL Propagation Delay, Set or Reset to Q or Q (Figure 2) 1.0 12.5 1.0 13.0 ns CIN Maximum Input Capacitance 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 35 pF TIMING REQUIREMENTS(VCC=5.0 V ± 10%, CL=50pF, Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 25 °C -40°C to 85°C Unit tsu Minimum Setup Time, J or K to Clock (Figure 3) 2.0 2.5 ns th Minimum Hold Time, Clock to J or K (Figure 3) 2.0 2.0 ns tw Minimum Pulse Width, Clock (Figure 1) 5.0 6.0 ns tw Minimum Pulse Width,Set or Reset (Figure 2) 5.5 6.0 ns trec Minimum Recovery Time, Set or Reset to Clock (Figure 2) 0 0 ns 4 KK74ACT112 Figure 1. Switching Waveform Figure 2. Switching Waveform Figure 3. Switching Waveform EXPANDED LOGIC DIAGRAM 5 KK74ACT112 N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 9 16 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 B 1 8 5.33 C F L C D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 -T- SEATING PLANE N G K M H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 H B 1 G P 8 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 9.8 10 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.72 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 6