14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler 30DBL0537 May 2005 - Rev 20-May-05 Features Chip Device Layout tio n Integrated Gain, Doubler and Driver Stages Self-biased Architecture +21.0 dBm Output Power 35.0 dBc Fundamental Suppression 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010 General Description uc Absolute Maximum Ratings Supply Voltage (Vd) Supply Current (Id) Gate Bias Voltage (Vg) Input Power (RF Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Channel Temperature (Tch) od Mimix Broadband's 14.5-17.0/29.0-34.0 GHz GaAs MMIC doubler integrates a gain stage, passive doubler and driver amplifier onto a single device. The device provides better than +21.0 dBm output power and has excellent fundamental rejection. This device has a self-biased architecture and requires a single 5V supply. This MMIC uses Mimix Broadband’s 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeterwave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. +6.0 VDC 300 mA +0.3 VDC TBD -65 to +165 OC -55 to MTTF Table1 MTTF Table 1 pr (1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life. e- Electrical Characteristics (Ambient Temperature T = 25 oC) Pr Parameter Input Frequency Range (fin) Output Frequency Range (fout) Input Return Loss (S11) Output Return Loss (S22) Fundamental Level at the Output RF Input Power (RF Pin) Output Power at +4.0 dBm Pin (Pout) Drain Bias Voltage (Vd1,2,3) Supply Current (Id1,2,3) (Vd=5.0V Typical) Units GHz GHz dB dB dBc dBm dBm VDC mA Min. 14.5 29.0 - Typ. TBD TBD -35.0 +4.0 +21.0 +5.0 200 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Max. 17.0 34.0 +5.5 240 Page 1 of 5 Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler 30DBL0537 May 2005 - Rev 20-May-05 Doubler Measurements 30DBL0537: Pout (2xFin) and Pout (Fin) dBm vs. Fin (GHz) Pin = -6 to +4 dBm, Vd = 5V 30DBL0537: Pout (2xFin) and Pout (Fin) dBm vs. Fin (GHz) Pin = +4 dBm, Vd = 5V 25 25 20 20 10 5 Pout (2xFin) 0 Pout (Fin) -5 -10 -15 tio n Pout (Fin) and Pout (2xFin) dBm Pout (Fin) and Pout (2xFin) dBm 15 15 Pout (2xFin) 10 Pin = 4 dBm 5 0 Pin = -4 dBm -5 Pin = -2 dBm -10 Pout (Fin) -15 Pin = 2 dBm -20 Pin = -6 dBm -25 -20 -30 -25 -35 Pin = 0 dBm uc -40 -30 11 11 12 13 14 15 16 17 18 19 12 20 13 14 15 16 17 18 19 20 Fin (GHz) Fin (GHz) 30DBL0537: Pout (2xFin) and Pout (Fin) dBm vs. Pin (dBm) Fin = 14.5 to 17 GHz, Vd = 5V 30DBL0537: Pout (2xFin) dBm vs. Pin (dBm) Fin = 14.5 to 17 GHz, Vd = 5V 25 25 20 od Pout (2xFin) Fin = 14.5 GHz 15 Fin =15 GHz Fin =15.5 GHz 10 pr Pout (2xFin) dBm 20 Fin =16 GHz 5 Pout (2xFin) and Pout (Fin) dBm 15 10 Fin = 14.5 GHz 5 Fin = 15 GHz 0 Fin = 15.5 GHz -5 -10 Fin = 16 GHz -15 Pout (Fin) Fin = 16.5 GHz -20 -25 Fin = 17 GHz -30 Fin =16.5 GHz -35 -40 Fin =17 GHz 0 -8 -6 -4 -2 0 4 -45 -8 -6 -4 -2 0 2 4 6 6 Pin (dBm) Pr e- Pin (dBm) 2 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 5 Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler 30DBL0537 May 2005 - Rev 20-May-05 0.943 (0.037) 1.000 (0.039) 1.343 1.544 (0.053) (0.061) 2 3 4 tio n Mechanical Drawing 5 1 uc 0.420 (0.017) 0.0 od 0.0 0.611 (0.024) 2.000 (0.079) (Note: Engineering designator is 30DBL0537) pr Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.240 mg. Bond Pad #1 (RF In) Bond Pad #2 (Vd1) Pr RF In Bond Pad #5 (RF Out) Bypass Capacitors - See App Note [2] Vd1,2,3 e- Bias Arrangement Bond Pad #3 (Vd2) Bond Pad #4 (Vd3) Vd1,2,3 2 3 4 5 RF Out 1 RF Out RF In Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 3 of 5 Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler 30DBL0537 May 2005 - Rev 20-May-05 App Note [1] Biasing - As shown in the bonding diagram, this device is operated by biasing Vd(1,2,3) with Vd(1,2,3) = +5.0 V, Id1=Id2=50mA and Id3=100mA. App Note [2] Bias Arrangement - Each DC pad (Vd1,2,3) needs to have separate DC bypass capacitance (~100 - 200 pF). All DC pads MTTF Tables (TBD) tio n can be combined, after de-coupling, to the same power supply. Backplate Temperature Channel Temperature Rth MTTF Hours 55 deg Celsius deg Celsius C/W E+ 75 deg Celsius deg Celsius C/W 95 deg Celsius deg Celsius C/W uc These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating foundry. FITs E+ E+ E+ E+ E+ Pr e- pr od Bias Conditions: Vd1=Vd2=Vd3=5.0V, Id1=Id2=50mA, Id3=100mA Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 4 of 5 Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler 30DBL0537 May 2005 - Rev 20-May-05 Handling and Assembly Information CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: tio n Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. uc Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. od ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Pr e- pr Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C +- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 5 of 5 Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.