Nichia STS-DA1-0226
<Cat.No.080519>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE
MODEL : NSSB064T
NICHIA CORPORATION
LED
Nichia STS-DA1-0226
<Cat.No.080519>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
IFP Conditions
:
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Pulse Width ≤ 10msec.
(2) Thermal Characteristics
Item
Symbol
Rja
Heat resistance
Rjs
Absolute Maximum Rating
35
100
85
133
-40 ~ +110
-40 ~ +110
125
Reflow Soldering : 260°C
Hand Soldering : 350°C
and
(Ta=25°C)
Unit
mA
mA
mA
mW
°C
°C
°C
for 10sec.
for 3sec.
Duty ≤ 1/10
(Ta=25°C)
Unit
°C/W
°C/W
Typ.
300
120
½ Rja = Heat resistance from Dice to Ambient temperature (Ta)
Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts)
½ Using Nichia standard circuit board
FR4, t=1.6mm, Copper foil, t=35µm
(3) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Intensity
Iv
Luminous Intensity
Iv
½
x
Chromaticity Coordinate
y
-
Condition
IF=30[mA]
IF=30[mA]
IF=20[mA]
IF=30[mA]
IF=30[mA]
Typ.
(3.4)
(600)
(440)
0.133
0.075
(Ta=25°C)
Max.
Unit
3.8
V
mcd
mcd
-
Min.
600
426
300
(Ta=25°C)
Max.
Unit
852
mcd
600
mcd
426
mcd
½ Please refer to CIE 1931 chromaticity diagram.
(4) Ranking
Item
Luminous Intensity
Rank X
Rank W
Rank V
Symbol
Iv
Iv
Iv
Condition
IF=30[mA]
IF=30[mA]
IF=30[mA]
½ Luminous Intensity Measurement allowance is ± 10%.
-1-
Nichia STS-DA1-0226
<Cat.No.080519>
Color Rank
x
y
(IF=30mA,Ta=25°C)
0.137
0.037
0.124
0.058
Rank W
0.110
0.132
0.087
0.112
0.142
0.081
0.151
0.058
½ Color Coordinates Measurement allowance is ± 0.01.
½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2. INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
Package
: Heat-Resistant Polymer
Material as follows ;
Encapsulating Resin
: Silicone Resin (with Diffused)
Electrodes
: Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “PACKING” on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
{
¯¯¯¯ - U
{ - Year
( 7 for 2007, 8 for 2008 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
¯¯¯¯ - Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
-2-
B for Nov. )
Nichia STS-DA1-0226
<Cat.No.080519>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Standard
Test Method
JEITA ED-4701
300 301
Number of
Damaged
0/22
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Tsld=215 ± 5°C,
3sec.
(using flux, Lead Solder)
-40°C
~
110°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 110°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=110°C
1 time
over 95%
100 cycles
0/100
100 cycles
0/100
10 cycles
0/100
1000 hrs.
0/100
Ta=60°C,
1000 hrs.
0/100
Ta=-40°C
1000 hrs.
0/100
Steady State Operating Life
Ta=25°C, IF=35mA
1000 hrs.
0/100
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
Ta=85°C, IF=30mA
1000 hrs.
0/100
60°C, RH=90%, IF=30mA
1000 hrs.
0/100
Ta=-40°C, IF=30mA
1000 hrs.
0/100
1 time
0/22
48min.
0/10
3 times
0/10
3 times
Negative/Positive
0/22
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Vibration
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
JEITA ED-4701
500 501
JEITA ED-4701
400 403
Drop
Electrostatic Discharge
JEITA ED-4701
300 304
RH=90%
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
75cm
R=1.5kΩ, C=100pF
Test Voltage=2kV
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Forward Voltage
Luminous Intensity
Condition 1
Luminous Intensity
Condition 2
Symbol
Test Conditions
Min.
VF
IF=30mA
-
IV
IF=30mA
L.S.L.**)
0.7
-
IV
IF=30mA
L.S.L.**)
0.5
-
*) U.S.L. : Upper Standard Level
Max.
U.S.L.*)
**) L.S.L. : Lower Standard Level
These test items are judged by the criteria of Luminous Intensity Condition 2.
-3-
1.1
0/22
Nichia STS-DA1-0226
<Cat.No.080519>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
Resin materials, in particular, may contain substances which affects on silver plating,
such as halogen.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-4-
Nichia STS-DA1-0226
<Cat.No.080519>
(3) Recommended circuit
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating
specified for each LED. It is recommended to use Circuit B which regulates the current flowing
through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the
current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the
worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
· This product should be operated in forward bias. A driving circuit must be designed so that the product
is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is
continuously applied to the product, such operation can cause migration resulting in LED damage.
(4) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-5-
Nichia STS-DA1-0226
<Cat.No.080519>
(5) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Temperature
350°C Max.
Pre-heat time
120 sec. Max.
120 sec. Max.
Soldering time
3 sec. Max.
Peak
240°C Max.
260°C Max.
Soldering time
10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
(one time only)
temperature
Temperature - profile 1.
Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
9.5
4
4
4
1.5
2.6
1.5
(Unit : mm)
: Solder resist
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-6-
Nichia STS-DA1-0226
<Cat.No.080519>
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(7) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(8) Others
· NSSB064 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-7-
Nichia STS-DA1-0226
<Cat.No.080519>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
580
0.5
y
590
0.4
600
610
0.3
620
630
490
0.2
480
0.1
W
470
460
0
0
0.1
0.2
0.3
0.4
x
Color Coordinates Measurement allowance is ± 0.01.
-8-
0.5
0.6
0.7
0.8
Forward Voltage vs.
Forward Current
Ta=25°C
Relative Luminosity (a.u.)
Forward Current IFP (mA)
100
50
30
20
10
5
2.0
1.5
1.0
0.5
0
0
20 40 60 80 100 120
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminosity
5.0
2.0
4.6
IFP=30mA
4.2
3.8
3.4
3.0
2.6
2.2
-60 -30 0 30 60 90 120
Ambient Temperature Ta (°C)
Relative Luminosity (a.u.)
-9-
Forward Voltage VF (V)
1
2.0 2.5 3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
2.5
IFP=30mA
1.0
0.5
0.2
-60 -30 0 30 60 90 120
Ambient Temperature Ta (°C)
200
Ta=25°C
100
50
35
20
10
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
3.0
200
Duty Ratio vs.
Allowable Forward Current
Allowable Forward Current IFP (mA)
Forward Current vs.
Relative Luminosity
50
40
35
30
20
Ts=Solder Temperature
(Cathode Side)
10
0
Ta=Ambient Temperature
0
20 40 60 80 100 120
Temperature T (°C)
NICHIA CORPORATION
NSSB064
Title
CHARACTERISTICS
No.
080510816231
Nichia STS-DA1-0226
<Cat.No.080519>
Model
Spectrum
Ta=25°C
0.11
1mA(476nm)
0.10
y
5mA(474nm)
0.09
0.08
30mA(471nm)
35mA(470nm)
0.07
100mA(469nm)
0.06
0.10 0.11 0.12 0.13 0.14 0.15 0.16
x
476
471
466
461
456
1
5 10 20 50 100 200
Forward Current IFP (mA)
Dominant Wavelength λ D (nm)
Dominant Wavelength λ D (nm)
-10-
Ta=25°C
481
Ta=25°C
IF=30mA
1.0
0.8
0.6
0.4
0.2
0
350 400 450 500 550 600 650
Wavelength λ (nm)
Ambient Temperature vs.
Dominant Wavelength
Forward Current vs.
Dominant Wavelength
486
1.2
Directivity
481
0°
1.0
486
IFP=30mA
Relative Luminosity (a.u.)
0.12
Relative Emission Intensity (a.u.)
Forward Current vs.
Chromaticity Coordinate (λD)
476
471
466
461
456
-60 -30 0 30 60 90 120
Ambient Temperature Ta (°C)
10° 20°
30°
Ta=25°C
IFP=30mA
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
0.5
90°
1.0
NSSB064
Title
CHARACTERISTICS
No.
080510816241
Nichia STS-DA1-0226
<Cat.No.080519>
Model
0°
0.8 ± 0.3
(2.4)
Internal Circuit
Anode
A
(1.9)
Cathode mark
(C 0.6)
0.8 ± 0.3
3.5 ± 0.3
3.2
(2.4)
Protection device
K
2.8
2 ± 0.3
(0.8)
(0.4)
-11-
Cathode
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Heat-Resistant Polymer
Silicone Resin (Diffused)
Ag Plating Copper Alloy
½ NxSB064 has a protection device built in as a protection
circuit against static electricity.
(1.05)
2.2
Model
NICHIA CORPORATION
Title
No.
NxSB064
OUTLINE DIMENSIONS
080510816171
Nichia STS-DA1-0226
<Cat.No.080519>
(0.45)
Unit
mm
15/1
Scale
Allow
±0.2
4±0.1
Reel End of tape
φ
φ2
1 ±0.8
±0.2
φ 13
2.15±0.1
1+0.25
-0
11.4±1
9±0.3
φ 180+0
-3
φ 60+1
-0
(2.75)
3.5±0.05
Cathode mark
3.65±0.1
2±0.05
Reel part
0.25±0.05
8+0.3
- 0.1
4±0.1
φ 1.5+0.1
-0
1.75±0.1
Taping part
Label
XXXX LED
TYPE NxSx064xT
LOT xxxxxx-U
QTY
pcs
RoHS
2.85±0.1
No LEDs
LEDs mounting part
No LEDs
-12-
Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NxSx064xT
TAPING DIMENSIONS
080510816181
Nichia STS-DA1-0226
<Cat.No.080519>
2,000pcs/Reel
Unit
mm
Scale
Allow
Nichia STS-DA1-0226
<Cat.No.080519>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NxSx064xT
xxxxxx-U
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NxSx064xT
U
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
2,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-13-
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
Quantity/box (pcs)
14,000 MAX.
30,000 MAX.
60,000 MAX.
Model
NxSx064xT
Title
PACKING
No.
070802651612