INTEL LF80539KF0412M

Product Brief
Dual-Core Intel® Xeon® Processors LV and ULV
Embedded Computing
Dual-Core Intel® Xeon® Processors LV
and ULV for Embedded Computing
Product Overview
Dual-Core Intel® Xeon® processors LV and ULV are members of
Intel’s growing product line of multi-core processors, utilizing Intel’s
65nm process technology to integrate two cores, along with many
advanced features, into one physical package. With a thermal design power (TDP) of 31W (LV) and 15W (ULV), these processors
combine the benefits of two high-performance execution cores
with intelligent power management features to deliver significantly greater performance-per-watt over previous single-core
Intel® Xeon® processors.
Available in three speeds – 2.16 GHz (LV), 2.0 GHz (LV) and 1.66
GHz (LV and ULV) – these dual-core processors are ideal for a
wide range of low-power embedded, storage and communications
applications such as storage area networks (SAN), network
attached storage (NAS), routers, virtual private networks (VPN),
ruggedized small form factor systems, intrusion detection systems,
and telecommunications (wireless and wireline) servers, particularly
in AdvancedTCA* form-factor designs. While incorporating advanced
processor technology, they remain software-compatible with
previous IA-32 processors.
Product Highlights
Intel’s comprehensive processor/chipset validation process enables
fast deployment of next-generation platforms to help developers
maximize competitive advantage while minimizing development
risks. Dual-Core Intel Xeon processors LV and ULV are validated
with the following:
L1 Cache
Execution
Resources
Arch State
L1 Cache
Execution
Resources
Arch State
L1 Cache
Execution
Resources
Arch State
L1 Cache
Execution
Resources
Arch State
Thermal Control
Thermal Control
Thermal Control
Thermal Control
APIC
APIC
APIC
APIC
Power Management Logic
Power Management Logic
Shared L2 Cache
Shared L2 Cache
Bus Interface
Bus Interface
667 MHz Front-Side Bus
Figure 1: Dual-processor configuration for Dual-Core Intel® Xeon® processors LV and ULV,
supported by the Intel® E7520 chipset, provides four high-performance cores per platform.
Product Highlights (continued)
• Intel® E7520 chipset, featuring high bandwidth for increased
memory and I/O throughput with dual-processor support, providing four high-performance cores per platform (see Figure 1).
• Intel® 3100 chipset, providing a single chip system controller. This
integrated chipset combines the Memory Controller Hub (MCH)
and I/O Controller Hub (ICH) into a single component, significantly
conserving board real-estate and power consumption.
• Two complete execution cores in one processor package
provide advancements in simultaneous computing such as
multi-threaded applications and multi-tasking environments.
Dual-core processing efficiently delivers performance while
balancing power requirements.
• High-performance front-side bus (FSB) provides dual-processor
support for demanding high-performance, volume applications.
Combined with dual-core processing, this supports up to four
simultaneous threads on the system.
• Enhanced Intel SpeedStep® technology allows a system to
dynamically adjust processor voltage and core frequency,
decreasing average power consumption and average
heat production.
• Intel® Smart Cache Design allows two execution cores to
share 2 MB of L2 cache, reducing FSB traffic and enhancing
system responsiveness.
• Intel® Advanced Thermal Manager supports new digital
temperature sensors and thermal monitors on each
execution core to enhance thermal monitoring accuracy.
• Streaming SIMD Extensions 3 (SSE3) provides significant
performance enhancement for multi-media applications.
Additional instructions designed to improve thread synchronization, complex arithmetic, graphics, and video encoding.
• Fully code compatible with existing Intel® architecture-based
32-bit application software.
• Utilizing Intel® Dynamic Power Coordination, application
software or operating system can change the sleep state
of each execution core, allowing the platform to balance
performance and power dissipation.
• FSB address, data, and response parity protection provides
a key reliability and data integrity feature for the communications, storage, and other embedded market segments.
• Enhanced 36-bit memory addressing supports up to 16 GB
of DDR2 memory, when paired with the Intel E7520 chipset.
• Embedded lifecycle support protects system investment
by enabling extended product availability.
• Along with a strong ecosystem of hardware and software
vendors, including members of the Intel® Communications
Alliance (intel.com/go/ica), Intel helps developers cost-effectively
meet design challenges and shorten time-to-market.
Benchmark Tests Demonstrate Improvements in Performance and Performance-per-Watt
Dual-core LV and ULV processors versus single-core LV processors
The Dual-Core Intel® Xeon® processor LV 2.0 GHz can provide a greater than 2x performance gain, and the Dual-Core Intel Xeon processor
ULV 1.66 GHz can provide a greater than 1.9x performance gain, compared to the single-core LV Intel® Xeon® processor 2.8 GHz (see Figure 2).
Due to lower thermal dissipation, the Dual-Core Intel Xeon processor LV 2.0 GHz can deliver a 4x improvement in performance/watt, and the
Dual-Core Intel Xeon processor ULV 1.66 GHz can deliver a 7.1x improvement in performance/watt, compared to the single-core LV Intel Xeon
processor 2.8 GHz (see Figure 3).
Figure 2: Relative Performance
(Specint_rate_base2000)1,2
Figure 3: Relative Performance/Watt
(Specint_rate_base2000/TDP)1,2,3
Source: Intel Corporation
Source: Intel Corporation
1
Platform Configurations:
•Two Dual-Core Intel Xeon Processors LV 2.0 GHz, Intel E7520 Memory Controller Hub, DDR2-400 MHz, 8 DIMMS, each with 512 MB memory. (Dual-Core Intel® Xeon®
Processor LV with Intel® E7520 Chipset Development Kit).
• Two Low Voltage Intel Xeon Processors with 800 MHz System Bus, Intel E7520 Memory Controller Hub, DDR2-400 MHz, 8 DIMMS, each with 256 MB memory. (Intel® Xeon®
Processor with 800 MHz system bus, Intel® E7520 Chipset, and Intel® 6300ESB ICH Development Kit). Performance tests and ratings are measured using specific computer
systems and/or components and reflect the approximate performance of Intel product as measured by those tests. Any difference in system hardware or software design
configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering
purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm
2
SPEC CPU2000 benchmark tests reflect the performance of the microprocessor, memory architecture, and compiler of a computer system on compute-intensive, 32-bit applications.
SPEC benchmark test results for Intel microprocessors are determined using particular, well-configured systems. These results may or may not reflect the relative performance
of Intel microprocessors in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information,
including system benchmarks, to evaluate the performance of systems they are considering for purchase. For more information about SPEC CPU2000, visit http://www.intel.com/
performance/resources/limits.htm
3
Performance/watt reflects the Spec CPU2000 benchmark test results (as described above), divided by Thermal Design Power (TDP) for the respective processors. For the
Dual-Core Intel Xeon Processor LV 2.0 GHz, TDP is specified at 31W. For the Low Voltage Intel Xeon Processor with 800 MHz System Bus, TDP is specified at 55W.
4
Intel branded product name for “LV Intel Xeon Processor 2.8 GHz” is Low Voltage Intel Xeon Processor with 800 MHz System Bus.
Dual-Core Intel® Xeon® Processor LV for Dual-Processor Embedded Computing
Product Number
Core Speed
Front-Side
Bus Speed
L2 Cache
Thermal
Design Power
VID
Tjunction
Package
LF80539KF0482M
2.16 GHz
667 MHz
2M
31W
0.825V – 1.275V
0-100° C
478 µFC-PGA
LF80539KF0412M
2.0 GHz
667 MHz
2M
31W
0.825V – 1.275V
0-100° C
478 µFC-PGA
LF80539KF0282M
1.66 GHz
667 MHz
2M
31W
0.825V – 1.275V
0-100° C
478 µFC-PGA
Dual-Core Intel® Xeon® Processor ULV for Dual-Processor Embedded Computing
Product Number
Core Speed
Front-Side
Bus Speed
L2 Cache
Thermal
Design Power
VID
Tjunction
Package
LF80539JF0282M
1.66 GHz
667 MHz
2M
15W
0.825V – 1.2125V
0-100° C
478 µFC-PGA
Intel Access
Embedded Intel® Architecture Home Page:
Developer’s Site:
Intel in Communications:
General Information Hotline:
Intel® Literature Center:
intel.com/design/intarch
developer.intel.com
intel.com/communications
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
(800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
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Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter.
The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks,
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applications. The Dual-Core Intel® Xeon® processors LV and ULV may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available upon request.
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