NSC LMS4684ITLX

LMS4684
0.5Ω Low-Voltage, Dual SPDT Analog Switch
General Description
Features
The LMS4684 is a low on-resistance, low voltage dual SPDT
(Single-Pole/Double-Throw) analog switch that operates
from a 1.8V to 5.5V supply. The LMS4684 features a 0.5Ω
RON for its NC switch and 0.8Ω RON for its NO switch at a
2.7V supply. The digital logic inputs are 1.8V logiccompatible with a 2.7V to 3.3V supply.
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The LMS4684 is available in the 12 bump micro SMD and
the 10 lead LLP miniature packages. These PCB real estate
saving packages offer extreme performance while saving
money with small footprints.
NC switch RON
0.5Ω max @ 2.7V
NO switch RON
0.8Ω max @ 2.7V
50nA (max) supply current
TA = 25˚C
1.8 to 5.5V single supply operation
12-Bump micro SMD package
LLP-10 package, 3x4mm
See AN-1112 for micro SMD package considerations
See AN-1187 for LLP package considerations
Applications
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Power routing
Battery-operated equipment
Communications circuits
Modems
Cell phones
Connection Diagrams
10-LLP Package
12-Bump micro SMD Package
20077502
20077501
Center Bumps B2 and C2 are Not Electrically Connected
Top View
(Bumped Side Down)
DAP needs to be connected to pin 6 on the board
Top View
IN
NO
0
Off
NC
On
1
On
Off
Switches shown for Logic "0" input
© 2004 National Semiconductor Corporation
DS200775
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LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch
June 2004
LMS4684
Absolute Maximum Ratings (Note 1)
Storage Temperature Range
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Junction Temperature (Note 3)
V+, IN
Nominal Supply Voltage
−0.3V to (V+ + 0.3V)
Continuous Current NO, NC,
COM
± 400mA
−40˚C to 85˚C
Thermal Resistance θJA
2000V
Machine Model
1.8V to 5.5V
Temperature Range
ESD Tolerance (Note 2)
Human Body Model
150˚C Max
Operating Ratings
−0.3V to 6.0V
COM, NO, NC
−65˚C to 150˚C
LLP-10
TBD
micro SMD-12
TBD
200V
Electrical Characteristics
Unless otherwise specified, V+ = 2.7 to 3.3V, VIH = 1.4V, VIL = 0.5V. Typical values are measured at 3V, and TJ = 25˚C.
Boldface limits apply at temperature extremes.
Symbol
Parameter
Conditions
Min
Typ
V
Analog Signal Range
RON (NC)
NC-On-Resistance (Note 4)
V+ =2.7, ICOM =100ma,
VNC =0 to V+
0.3
0.5
Ω
RON (NO)
NO-On-Resistance (Note 4)
V+ =2.7, ICOM =100ma,
VNO =0 to V+
0.45
0.8
Ω
∆RON
On-Resistance Match Between
Channels (Note 4), (Note 5)
V+ =2.7, ICOM =100ma,
VNC or VNO =1.5V
0.06
Ω
V+ =2.7V,
ICOM =100mA,
VNC =0 to V+
0.15
RFLAT(NO) NO-On Resistance Flatness (Note 6)
INO(OFF)
or
INC(OFF)
NO or NC Off-Leakage Current
ICOM
(ON)
COM On-Leakage Current
V
Units
+
VNO,
VNC,
VCOM
RFLAT(NC) NC-On-Resistance Flatness (Note 6)
0
Max
LLP
TJ =0˚C to 85˚C
micro SMD
TJ =0˚C to 85˚C
0.17
LLP
TJ = −40˚C to +85˚C
0.18
micro SMD
TJ = −40˚C to +85˚C
0.20
V+ =2.7V, ICOM =100mA,
VNO = 0 to V+
V+ =3.3V, VNO or VNC =3V,
0.3V; VCOM =0.3V, 3V
V+ =3.3V, VNO or VNC =3V,
0.3V, or floating; VCOM =3V, or floating
0.35
−1
1
−10
10
−2
2
−20
20
Ω
Ω
nA
nA
Dynamic Characteristics
tON
tOFF
Turn-On Time
Turn-Off Time
V+ =2.7V, VNO or VNC =1.5V;
RL =50Ω; CL =35pF;
35
V+ =2.7V, VNO or VNC =1.5V;
RL = 50Ω; CL =35pF;
25
tBBM
Break-Before-Make-Delay
V+ =2.7V, VNO or VNC =1.5V;
RL =50Ω; CL =35pF;
Q
Charge Injection
COM =0; RS =0; CL = 1nF;
55
65
30
40
2
ns
ns
15
ns
200
pC
Digital I/O
VIH
Input Logic High
VIL
Input Logic Low
IIN
IN Input Leakage Current
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1.4
VIN =0 or V+
2
−1
V
0.5
V
1
µA
LMS4684
Electrical Characteristics
(Continued)
Unless otherwise specified, V+ = 2.7 to 3.3V, VIH = 1.4V, VIL = 0.5V. Typical values are measured at 3V, and TJ = 25˚C.
Boldface limits apply at temperature extremes.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
5.5
V
Power Supply
V+
Power-Supply Range
1.8
I+
Supply Current (Note 4)
−50
−200
0.04
50
200
nA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed.
Note 2: Human body model: 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF.
Note 3: The maximum power dissipation is a function of TJ(max) θJA and TA.
Note 4: Guaranteed by design.
Note 5: ∆RON is equal to the difference between NC1/NC2 RON or NO1/NO2 RON at a specified voltage.
Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges.
Symbolic Diagram
20077503
Ordering Information
Package
Part Number
12-Bump
micro SMD
LMS4684ITL
Package Marking
F09A
LMS4684ITLX
10-Pin LLP
LMS4684LD
NSC Drawing
TLA12DPA
3k Units Tape and Reel
1k Units Tape and Reel
L4684
LMS4684LDX
Transport Media
250 Units Tape and Reel
LDA10B
4.5k Units Tape and Reel
Pin Descriptions
Name
Pin ID
LLP
Description
micro SMD
NC
5, 7
D3, D1
Analog switch normally closed terminal
IN
4, 8
C3, C1
Digital control input
COM
3, 9
B3, B1
Analog switch common terminal
NO
2, 10
A3, A1
Analog switch normally open terminal
V+
1
A2
Positive supply voltage
GND
6, GND
D2
Ground
B2, C2
Not electrically connected. Can be used to help dissipate heat by connecting to GND
pin.
3
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LMS4684
Typical Performance Characteristics
Supply Current vs. Supply Voltage
NO ON Resistance vs. COM Voltage
20077504
20077505
NC ON Resistance vs. COM Voltage
Logic Threshold Voltage vs. Supply Voltage
20077506
20077507
Turn-on / Turn-off Times vs. Temperature
Charge Injection vs. COM Voltage
20077508
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20077509
4
LMS4684
Typical Performance Characteristics
(Continued)
NC On-Resistance vs. COM Voltage
NC On-Resistance vs. COM Voltage
20077516
20077515
NO On-Resistance vs. COM Voltage
NO On-Resistance vs. COM Voltage
20077517
20077518
5
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LMS4684
Application Notes
PRODUCT DESCRIPTION
The LMS4684 is a low voltage dual analog switch with
extremely low On-Resistance operating with a supply voltage range of 1.8V to 5.5V. National has fully characterized
the LMS4684 to operate in applications with 3V nominal
supply voltage. The LMS4684 also features fast switching
times for Turn-Off (40ns max over temp) and Turn-On (65ns
max over temp).
The switch operates asymmetrically, one terminal is normally
closed (NC) and the other terminal normally open (NO).
Both NC and NO terminals are connected to a common
terminal (COM). This configuration is ideal for applications
with asymmetric loads such as speaker handsets and internal speakers.
ANALOG SIGNAL LEVELS
20077519
The Analog signal ranges from GND to V+ and are passed
through the switch with very little change. Each switch is
bidirectional so any pin can be an input or output.
FIGURE 1. Overvoltage Protection Circuitry
DIGITAL CONTROL INPUTS
The IN pin can be driven to 5.5V regardless of the voltage
level of the supply pin V+. For example if you wanted to have
a supply of 2V you could still drive the IN digital control input
to 5V. Minimum power is lost when the IN pin, is driven
rail-to-rail.
PCB LAYOUT
Both the LLP and micro SMD packages offer enhanced
board real estate savings because of their tiny footprints.
These tiny packages are capable of supporting up to an
absolute maximum of 400mA of continuous current because
of the advanced thermal handling capabilities.
SUPPLY VOLTAGE SEQUENCING
It is good general practice to first apply the supply voltage to
a CMOS device before any other supply on other pins.This is
also true for the LMS4684 analog switch which is a CMOS
device.
However if it is necessary to have an analog signal applied
before the supply voltage is applied and the analog signal
supply is not limited to 20mA max, a diode connected between the supply voltage and the V+ pin as shown in the
figure below will supply adequate input protection. This will
limit the max analog voltage to a diode drop below V+. This
diode D1 will also provide protection against some overvoltage situations.
The LLP package has the exposed die attach pad internally
connected to the internal circuit GND. When this pad is
soldered to copper on the PCB board according to Application Note AN-1187 the full thermal capability of the LLP
package can be achieved without additional bulky heat sinks
to dissipate the heat generated. The micro SMD package
has a similar capability to help dissipate heat generated
through Bumps B2 and C2 which are not electrically connected. To enhance heat dissipation of the micro SMD package B2 and C2 could be connected to the GND pin and
through copper traces on the board.
Please see Application Note AN-1112 for micro SMD package considerations.
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LMS4684
Parameter Measuring Information
20077510
FIGURE 2. tON / tOFF Time
20077511
FIGURE 3. Break-Before Make Delay
20077513
FIGURE 4. Charge Injection
7
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LMS4684
Parameter Measuring Information
(Continued)
20077514
FIGURE 5. Channel Capacitance
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LMS4684
Physical Dimensions
inches (millimeters) unless otherwise noted
10-Lead LLP
NS Package Number LDA10B
X1 = 1590 ± 30 µm; X2 = 2327 ± 30 µm; X3 = 600 ± 75 µm
12-Bump micro SMD
NS Package Number TLA12DPA
9
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LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
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