PP300B120-ND Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com H-Bridge POW-R-PAK™ IGBT Assembly 300 Amperes/1200 Volts J R N (4 PLACES) +DC H M (6 PLACES) PIN 1 L E K F H –DC G P B A S Q C D T +DC C1 C1 G1 G1 E1 E1 1 2 G2 G2 E2 E2 E2 E2 -DC Gate Driver Board P1 Customer Interface (See Table 1) Outline Drawing and Circuit Diagram Dim. A B C D E F G H J 01/14 Rev. 0 Inches 14.9 14.25 7.6 5.43 10.15 7.2 2.01 0.79 0.3 mm 378.4 362.0 193.0 138.0 257.8 183.0 51.0 20.0 7.7 Dim. Inches K 5.91 L 8.0 M M6 Metric N 0.256 Dia. P 1.0 Q 0.32 R 14.32 S 2.05 T 5.4 mm 150.0 203.2 M6 6.5 Dia. 25.4 8.2 363.6 52.0 137.1 Description: The Powerex POW-R-PAK™ is a configurable IGBT based power assembly that may be used as a converter, chopper, half or full bridge, or three phase inverter for motor control, power supply, UPS or other power conversion applications. The power assembly is mounted on a forced air-cooled heatsink and features state-of-the-art Powerex IGBTs with low conduction and low switching losses for high efficiency operation. The POW-R-PAK™ includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in protection features including overvoltage, undervoltage lockout, overcurrent, overtemperature, and short circuit detection. Depending on application characteristics, the POW-RPAK™ is suitable for operation with DC bus voltages up to 800VDC and switching frequencies below 20kHz. Features: £ High performance IGBT inverter bridge £ Integrated gate drive with fault monitoring and protection £ System status / troubleshooting LEDs to verify or monitor proper operation £ Isolated gate drive power supplies £ Low inductance laminated bus £ Output current measurement and feedback £ Superior short circuit detection & shoot through prevention 1 Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com PP300B120-ND H-Bridge POW-R-PAK™ IGBT Assembly 300 Amperes/1200 Volts Absolute Maximum Ratings, Tj = 25°C unless otherwise specified Module Characteristics IGBT Junction Temperature SymbolRating Units Tj -40 to +150 °C Storage Temperature Tstg -40 to +65 °C Operating Temperature Top -20 to +60 °C Voltage Applied to DC Terminals VCC 800Volts Isolation Voltage, Main Terminals to Heatsink Viso 2500Volts IGBT Part Characteristics Collector Current (DC, TC' = 90°C) Peak Collector Current Emitter Current (TC = 25°C) SymbolRating Units IC 300Amperes ICM 600Amperes IE 300Amperes Peak Emitter Current IEM 600Amperes Maximum Collector Dissipation (Tj < 150°C per Module) PC 1890Watts Interface Board Characteristics 2 SymbolRating Units Unregulated +24V Power Supply Input — 30 Volts IGBT Command Signal Input Voltage — 20 Volts Fault Output Supply Voltage — 30 Volts Fault Output Current — 50 mA 01/14 Rev. 0 Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com PP300B120-ND H-Bridge POW-R-PAK™ IGBT Assembly 300 Amperes/1200 Volts Electrical Characteristics, Tj = 25°C unless otherwise specified IGBT Part Characteristics Collector Cutoff Current Collector-Emitter Saturation Voltage Symbol Test Conditions ICES VCE = VCES, VGE = 0V — — 1.0 mA VCE(sat) IC = 300A, Tj = 25°C — 1.8 2.4 Volts IC = 300A, Tj = 125°C — 1.9 — Volts IE = 300A — — 3.2 Volts — — 300 Ns tr VCC = 600V, IC = 300A, VGE = ±15V, — — 80 Ns td(off) RG = 1.0Ω, Inductive Load — — 500 Ns — — 300 Ns Emitter-Collector Voltage VEC Turn-on Delay Time td(on) Rise Time Turn-off Delay Time Fall Time tf Min. Typ. Max. Units Diode Reverse Recovery Time trr IE = 300A — — 250 Ns Diode Reverse Recovery Charge Qrr IE = 300A — 17.6 — μC Min. Typ. Max. Units Unregulated +24V Power Supply Input 20 24 30 Volts Power Supply Current Consumption — — 800 mA IGBT Command Signal ON Threshold 12 15 — Volts IGBT Command Signal OFF Threshold — 0 2 Volts IGBT Command Signal Input Impedance — 10 — kΩ IGBT Command Signal Input Capacitance — 1 — nF Dead Time — 3.0 — μs Min. Typ. Max. Units Output Over Current Trip — 400 — Amperes Heatsink Over Temperature Trip — 95 — °C Bus Over Voltage Trip — 920 — Volts Power Supply Under Voltage Trip — 18.9 — Volts Fault Reset Time — 9 — μs Heatsink Temperature Feedback — 0.1 V/°C — Volts Output Current Feedback (Bipolar) — ±0.025 V/Amp — Volts DC Link Feedback — Volts Interface Board Characteristics Feedback Signal and Fault Characteristics Characteristics 01/14 Rev. 0 0.01 V/V — 3 Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com PP300B120-ND H-Bridge POW-R-PAK™ IGBT Assembly 300 Amperes/1200 Volts Electrical Characteristics, Tj = 25°C unless otherwise specified Other Electrical Component Specifications Characteristics Min. Typ. Max. Units Total Nominal Capacitance — 3450 — μF Nominal Ripple Current Rating per Capacitor (@ 85°C, 120Hz) — 11.6 — ARMS Nominal Total Voltage Rating — 500 — Volts Minimum Life @ Nominal Ripple Current (80°C) — 10 — khrs — ±400 — Amperes DC Link Capacitor Bank Output Current Sensor Primary Current Measuring Range Accuracy (@ IPN, 25°C) — < ±1 — % Linearity Error — < ±1 — % Response Time — <5 — μs Bandwidth (-3 dB) DC — 25 kHz Thermal Characteristics, Tj = 25°C unless otherwise specified Characteristics Symbol Test Conditions Min. Typ. Max. Units IGBT Thermal Resistance, Junction-to-Case Rth(j-c)Q Per IGBT, 1/2 Module — — 0.05 °C/W FWD Thermal Resistance, Junction-to-Case Rth(j-c)D Per FWD, 1/2 Module — — 0.08 °C/W Contact Thermal Resistance Rth(c-f) Per 1/2 Module — 0.02 — °C/W Heatsink Thermal Resistance Rth(f-a) 286 CFM Airflow — 0.037 — °C/W Min. Typ. Max. Units Mounting Torque, Output Power Terminals — 75 90 in-lb Mounting Torque, DC Bus Terminals — 130 150 in-lb Weight — 39 — lb Mechanical Characteristics, Tj = 25°C unless otherwise specified Characteristics Relevant Standards UL508C: Power Conversion Equipment EN50178: Electronic Equipment for Use in Power Installations 4 01/14 Rev. 0 Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com PP300B120-ND H-Bridge POW-R-PAK™ IGBT Assembly 300 Amperes/1200 Volts Interface Board Signal Defintions (Table 1) Pin Signal Name Description 1 Shield Internally Conected to PGND 2 Gate 1 Neg. 0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on 3 Leg 1 Error1 Open Collector Output, External Pull-up Resistor Required LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV 4 Gate 1 Pos. 0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on 5 Gate 2 Neg. 0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on 6 Leg 2 Error1 Open Collector Output, External Pull-up Resistor Required LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV 7 Gate 2 Pos. 0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on 8 N/C No Connect - Do Not Ground 9 N/C No Connect - Do Not Ground 10 N/C No Connect - Do Not Ground 11 Over Temperature1 Open Collector Output, External Pull-up Resistor Required LOW = No Error; HIGH = Heatsink OT 12 External Fault Reset Active Low: Must be High for Operation; Low for 10microseconds to Reset Faults3 13 DC Link Voltage Analog Voltage Feedback of DC Link Voltage 14 24 VDC Input Power 20-30 VDC Input Power Supply 15 24 VDC Input Power 20-30 VDC Input Power Supply 16 N/C No Connect - Do Not Ground 17 N/C No Connect - Do Not Ground 18 PGND Ground Reference for 24 VDC Power Supply 19 PGND Ground Reference for 24 VDC Power Supply 20 Heatsink Temperature Analog Voltage Representation of Heatsink Temperature 21 AGND2 Tied to Pins 10 and 11 22 IOUT Phase A Analog Voltage Representation of Output Current 23 AGND2 Tied to Pins 10 and 11 24 IOUT Phase B Analog Voltage Representation of Output Current 25 AGND2 Tied to Pins 10 and 11 N/C No Connect - Do Not Ground 25 1. Open collectors can be pulled up to 30V max. and sink 50mA continuous. 2. AGND signals to be used for analog feedback signals (i.e. twisted pair with IOUT Phase A). 3. On the board is a jumper that enables fault reset by bringing all leg control signals low for 10 microseconds (default). Interface Board Connector Description Symbol Type Gate Drive Board Interface Header P1 0.100" x 0.100" Latching Header, 26 Pin 3M# 3429-6002 or Equivalent Recommended Mating Socket — 0.100" x 0.100" IDC Socket, 26 Pin 3M# 3499-7600 or Equivalent Recommended Strain Relief — Plastic Strain Relief 3M# 3448-3026 or Equivalent 01/14 Rev. 0 Manufacturer 5