SEMICONDUCTOR TECHNICAL DATA The MC10H162 provides parallel decoding of a three bit binary word to one of eight lines. The MC10H162 is useful in high–speed multiplexer/ demultiplexer applications. The MC10H162 is designed to decode a three bit input word to one of eight output lines. The MC10H162 output will be high when selected while all other output are low. The enable inputs, when either or both are high, force all outputs low. The MC10H162 is a true parallel decoder. This eliminates unequal parallel path delay times found in other decoder designs. These devices are ideally suited for multiplexer/demultiplexer applications. • Propagation Delay, 1.0 ns Typical • Power Dissipation, 315 mW Typical (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 LOGIC DIAGRAM E0 2 E1 15 6 Q0 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 5 Q1 4 Q2 A 7 3 Q3 MAXIMUM RATINGS 13 Q4 Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc 0 to VEE Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic 0° Symbol Min Power Supply Current IE IinH IinL Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage 25° Max Min Min — 84 — 465 — 76 — 275 0.5 — 0.5 — 11 Q6 C 14 10 Q7 TRUTH TABLE 75° Max 12 Q5 INPUTS ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) Characteristic B 9 Max Unit — 84 mA — 275 µA 0.3 — µA –0.735 Vdc VOH VOL –1.02 –0.84 –0.98 –0.81 –0.92 –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc VIH VIL –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc E0 E1 L L L L L L L L L L L L L L L L H X X H C L L L L H H H H X X OUTPUTS B L L H H L L H H X X A Q0 Q1 Q2 Q3 Q4 L H L L L L H L H L L L L L L H L L H L L L H L L L L L L H H L L L L L L L L L L L H L L L L L X L L L L L X L L L L L Q5 L L L L L H L L L L 1 16 2 15 VCC2 E1 AC PARAMETERS Q3 3 14 C Propagation Delay Pins 7, 9, 14 Only Pins 2, 15 Only Q2 4 13 Q4 Q1 5 12 Q0 6 11 Q5 Q6 Rise Time Fall Time tpd tr tf ns 0.7 0.8 2.0 2.3 0.7 0.8 2.1 2.4 0.8 0.9 2.5 2.6 0.6 1.8 0.6 1.9 0.6 2.0 ns A 7 10 Q7 0.6 1.8 0.6 1.9 0.6 2.0 ns VEE 8 9 B NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 2–253 Q7 L L L L L L L H L L DIP PIN ASSIGNMENT VCC1 E0 Low Input Voltage Q6 L L L L L L H L L L REV 5 MC10H162 TYPICAL APPLICATIONS FIGURE 1 — HIGH SPEED 16-BIT MULTIPLEXER/DEMULTIPLEXER Control Selection S0 S1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 MC10H136 CR A B C D E1 C B A MC10H164 D0 E1 C B A MC10H164 D0 S0 S0 S1 S1 MC10H136 CR A CR B C D E1 C B A Start/Stop E0 MC10H162 15 14 13 12 11 10 9 8 MOTOROLA 2–254 E1 C B A E0 MC10H162 7 6 5 4 3 2 1 0 MECL Data DL122 — Rev 6 MC10H162 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–255 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H162 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–256 *MC10H162/D* MC10H162/D MECL Data DL122 — Rev 6