ONSEMI MC10H162

SEMICONDUCTOR TECHNICAL DATA
The MC10H162 provides parallel decoding of a three bit binary word to one
of eight lines. The MC10H162 is useful in high–speed multiplexer/ demultiplexer
applications.
The MC10H162 is designed to decode a three bit input word to one of eight
output lines. The MC10H162 output will be high when selected while all other
output are low. The enable inputs, when either or both are high, force all outputs
low.
The MC10H162 is a true parallel decoder. This eliminates unequal parallel
path delay times found in other decoder designs. These devices are ideally
suited for multiplexer/demultiplexer applications.
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 315 mW Typical (same as MECL 10K)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
E0 2
E1 15
6 Q0
VCC1 = Pin 1
VCC2 = Pin 16
VEE = Pin 8
5 Q1
4 Q2
A 7
3 Q3
MAXIMUM RATINGS
13 Q4
Characteristic
Symbol
Rating
Unit
VEE
VI
–8.0 to 0
Vdc
0 to VEE
Vdc
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
Tstg
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range — Plastic
— Ceramic
0°
Symbol
Min
Power Supply Current
IE
IinH
IinL
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
25°
Max
Min
Min
—
84
—
465
—
76
—
275
0.5
—
0.5
—
11 Q6
C 14
10 Q7
TRUTH TABLE
75°
Max
12 Q5
INPUTS
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
Characteristic
B 9
Max
Unit
—
84
mA
—
275
µA
0.3
—
µA
–0.735
Vdc
VOH
VOL
–1.02 –0.84 –0.98 –0.81 –0.92
–1.95 –1.63 –1.95 –1.63 –1.95
–1.60
Vdc
VIH
VIL
–1.17 –0.84 –1.13 –0.81 –1.07
–0.735
Vdc
–1.95 –1.48 –1.95 –1.48 –1.95
–1.45
Vdc
E0 E1
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H X
X H
C
L
L
L
L
H
H
H
H
X
X
OUTPUTS
B
L
L
H
H
L
L
H
H
X
X
A Q0 Q1 Q2 Q3 Q4
L H L L L L
H L H L L L
L L L H L L
H L L L H L
L L L L L H
H L L L L L
L L L L L L
H L L L L L
X L L L L L
X L L L L L
Q5
L
L
L
L
L
H
L
L
L
L
1
16
2
15
VCC2
E1
AC PARAMETERS
Q3
3
14
C
Propagation Delay
Pins 7, 9, 14 Only
Pins 2, 15 Only
Q2
4
13
Q4
Q1
5
12
Q0
6
11
Q5
Q6
Rise Time
Fall Time
tpd
tr
tf
ns
0.7
0.8
2.0
2.3
0.7
0.8
2.1
2.4
0.8
0.9
2.5
2.6
0.6
1.8
0.6
1.9
0.6
2.0
ns
A
7
10
Q7
0.6
1.8
0.6
1.9
0.6
2.0
ns
VEE
8
9
B
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
2–253
Q7
L
L
L
L
L
L
L
H
L
L
DIP
PIN ASSIGNMENT
VCC1
E0
Low Input Voltage
Q6
L
L
L
L
L
L
H
L
L
L
REV 5
MC10H162
TYPICAL APPLICATIONS
FIGURE 1 — HIGH SPEED 16-BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
S0
S1
15 14 13 12 11 10 9 8
7 6 5 4 3 2 1 0
MC10H136
CR
A
B
C
D
E1
C
B
A
MC10H164
D0
E1
C
B
A
MC10H164
D0
S0
S0
S1
S1
MC10H136
CR
A
CR
B
C
D
E1
C
B
A
Start/Stop
E0
MC10H162
15 14 13 12 11 10 9 8
MOTOROLA
2–254
E1
C
B
A
E0
MC10H162
7 6 5 4 3 2 1 0
MECL Data
DL122 — Rev 6
MC10H162
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MECL Data
DL122 — Rev 6
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–255
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA
MC10H162
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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◊
MOTOROLA
2–256
*MC10H162/D*
MC10H162/D
MECL Data
DL122 — Rev 6