THINE THC63LVD823B

THC63LVD823B_Rev.3.1_E
THC63LVD823B
160MHz 51Bits LVDS Transmitter
General Description
Features
The THC63LVD823B transmitter is designed to support Single Link transmission between Host and Flat
Panel Display and Dual Link transmission between
Host and Flat Panel Display up to 1080p/QXGA resolutions.
The THC63LVD823B converts 51bits of CMOS/TTL
data into LVDS (Low Voltage Differential Signaling)
data stream. The transmitter can be programmed for rising edge or falling edge clocks through a dedicated pin.
In Dual Link, the transmit clock frequency of 160MHz,
51bits of RGB data are transmitted at an effective rate
of 1.12Gbps per LVDS channel.
• Wide dot clock range suited for TV Signal (480p1080p), PC Signal (VGA-QXGA)
TTL/CMOS Input: 10-160MHz
LVDS Output: 20-160MHz
• PLL requires No external components
• Flexible Input/Output mode
1. Single/Dual TTL IN, Single/Dual LVDS OUT
2. Double edge input for Single TTL IN/Dual LVDS OUT
•
•
•
•
•
•
•
Clock edge selectable
2 LVDS data mapping for simplifying PCB layout.
Pseudo Random pattern generation circuit
Supports Reduced swing LVDS for Low EMI
Power down mode
Low power single 3.3V CMOS design
1.2 up to 3.3V tolerant data inputs to connect
directly to low power,low voltage application and
graphic processor.
• Backward compatible with THC63LVD823/
•
THC63LVD823A
100pin TQFP
HSYNC
VSYNC
DE
24
3
R/F
RS
28
MAP
PARALLEL TO SERIAL
R2[7:0]
G2[7:0]
B2[7:0]
28
24
Data Formatter
DATA Port2
R1[7:0]
G1[7:0]
B1[7:0]
1) DEMUX
2) MUX
DATA Port1
TA1 +/-
PARALLEL TO SERIAL
Block Diagram
TA2 +/-
TB1 +/-
LVDS OUTPUT
Port1
TC1 +/TD1 +/-
TB2 +/-
LVDS OUTPUT
Port2
TC2 +/TD2 +/-
MODE[1:0]
O/E
DDRN
/PDWN
PRBS
TCLK1 +/-
TRANSMITTER CLOCK IN
(10 to 160MHz)
PLL
TCLK2 +/- (N/C)
(20 to 160MHz)
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THC63LVD823B_Rev.3.1_E
B14
B13
B12
GND
VCC
B11
B10
G17
G16
G15
G14
G13
G12
G11
G10
R17
R16
R15
R14
GND
VCC
R13
R12
R11
R10
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Pin Out (top view)
G22
91
35
TB2-
G23
92
34
TB2+
G24
93
33
LVCC
G25
94
32
TC2-
G26
95
31
TC2+
G27
96
30
TCLK2-
B20
97
29
TCLK2+
B21
98
28
TD2-
B22
99
27
TD2+
B23
100
26
LGND
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25
TA2+
24
36
PGND
90
PVCC
G21
23
TA2-
22
37
PGND
G20
N/C
LGND
21
38
89
20
88
Reserved
GND
PRBS
TD1+
19
TD1-
39
18
40
87
/PDWN
86
VCC
GND
R27
17
TCLK1+
O/E
41
MODE0
85
16
R26
15
TCLK1-
MODE1
42
14
TC1+
13
43
84
MAP
83
R25
DDRN
R24
12
TC1-
11
44
RS
82
R/F
R23
10
LVCC
9
45
CLKIN
R22
DE
TB1+
8
46
81
VSYNC
80
HSYNC
R21
7
TB1-
6
TA1+
47
B27
48
79
B26
78
R20
5
B17
4
TA1-
GND
49
3
77
2
B16
VCC
LGND
B25
50
1
76
B24
B15
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Pin Description
Pin Name
Pin #
TA1+, TA1-
48, 49
TB1+, TB1-
46, 47
TC1+, TC1-
43, 44
TD1+, TD1-
39, 40
TCLK1+, TCLK1-
41, 42
TA2+, TA2-
36, 37
TB2+, TB2-
34, 35
TC2+, TC2-
31, 32
TD2+, TD2-
27, 28
TCLK2+, TCLK2-
29, 30
R17 ~ R10
60 -57, 54 - 51
G17 ~ G10
68 - 61
B17 ~ B10
78 - 73, 70, 69
R27 ~ R20
86 - 79
G27 ~ G20
96 - 89
B27 ~ B20
6, 5, 2, 1,
Type
LVDS OUT
LVDS OUT
LVDS OUT
LVDS OUT
Description
The 1st Link.
The 1st pixel output data when Dual-Link.
LVDS Clock Out for 1st and 2nd Link.
The 2nd Link.
These pins are disabled when Single Link.
Additional LVDS Clock Out. Identical to TCLK1+,-.
No connect if not used.
IN
The 1st Pixel Data Inputs.
IN
The 2nd Pixel Data Inputs.
100 - 97
DE
9
IN
Data Enable Input.
VSYNC
8
IN
Vsync Input.
HSYNC
7
IN
Hsync Input.
CLKIN
10
IN
Clock Input.
R/F
11
IN
Input Clock Triggering Edge Select.
H: Rising edge, L: Falling edge
LVDS swing mode, VREF select. See Fig4 - 5.
RS
12
IN
RS
LVDS
Swing
Small Swing
Input Support
VIHM
350mV
N/A
VIMM
350mV
RS=VREFa
VILM
200mV
N/A
a. VREF is Input Reference Voltage.
LVDS mapping table select. See Fig7 to 8 and Table4 to 7.
MAP
MAP
14
IN
VIHM
VILM
VIMM
Mapping Mode
Mapping MODE1
Mapping MODE2
Reserved
Pixel Data Mode.
MODE1, MODE0
15, 16
Copyright©2011 THine Electronics, Inc.
IN
MODE
1
L
H
L
H
3/21
MODE0
Mode
L
L
H
H
Dual Link (Dual-in/Dual-out)
Dual Link (Single-in/Dual-out)
Single Link (Dual-in/Single-out)
Single Link (Single-in/Single-out)
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Pin Description (Continued)
Pin Name
Pin #
Type
Description
Output enable.
O/E
17
IN
H: Output enable,
L: Output disable (all outputs are Hi-Z).
/PDWN
19
IN
H: Normal operation,
L: Power down (all outputs are Hi-Z)
PRBS (Pseudo-Random Binary Sequence) generator is
active in order to evaluate eye patterns when
PRBS a
20
IN
MODE<1:0> = LL (Dual-in/Dual-out mode).
H: PRBS generator is enable.
L: Normal Operation
Reserved
21
IN
Must be tied to GND.
DDR function is active when
DDRN
13
IN
MODE<1:0> = HL (Single-in/Dual-out mode).
Open or H: DDR (Double Edge input) function disable.
L: DDR (Double Edge input) function enable.
N/C
22
VCC
3, 55, 71, 87
GND
4, 18, 56,
72, 88
Must be Open.
Power
Power Supply Pins for TTL inputs and digital circuitry.
Ground
Ground Pins for TTL inputs and digital circuitry.
LVCC
33, 45
Power
Power Supply Pins for LVDS Outputs.
LGND
26, 38, 50
Ground
Ground Pins for LVDS Outputs.
PVCC
24
Power
Power Supply Pin for PLL circuitry.
PGND
23, 25
Ground
Ground Pins for PLL circuitry.
a: Setting the PRBS pin high enables the internal test pattern generator. It generates Pseudo-Random Bit Sequence of
223-1. The generated PRBS is fed into input data latches, formatted as VGA video like data, encoded and serialized
into TXOUT output. This function is normally to be used for analyzing the signal integrity of the transmission
channel including PCB traces, connectors, and cables.
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THC63LVD823B_Rev.3.1_E
Absolute Maximum Ratings
Supply Voltage (VCC)
-0.3V ~ +4.0V
CMOS/TTL Input Voltage
-0.3V ~ (VCC + 0.3V)
LVDS Transmitter Output Voltage
-0.3V ~ (VCC + 0.3V)
Output Current
-30mA ~ 30mA
Junction Temperature
+125 °C
Storage Temperature Range
-55 °C ~ +125 °C
Reflow Peak Temperature / Time
+260 °C / 10sec.
Maximum Power Dissipation @+25 °C
2.4W
Recommended Operating Conditions
Parameter
Min.
Typ
Max
Units
All Supply Voltage
3.0
3.3
3.6
V
Operating Ambient Temperature
-20
70
°C
MODE<1:0>=LL
Input
20
160
MHz
Dual-in/Dual-out
LVDS Output
20
160
MHz
MODE<1:0>=LH
Input
10
80
MHz
Dual-in/Single-out
LVDS Output
20
160
MHz
Single Edge Input
Input
40
160
MHz
MODE<1:0>=HL
(DDRN =Open/H)
LVDS Output
20
80
MHz
Single-in/Dual-out
Double Edge Input
Input
20
80
MHz
(DDRN=L)
LVDS Output
20
80
MHz
MODE<1:0>=HH
Input
20
160
MHz
Single-in/Single-out
LVDS Output
20
160
MHz
Clock
Frequency
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THC63LVD823B_Rev.3.1_E
Electrical Characteristics
CMOS/TTL DC Specifications
VCC = VCC=PVCC=LVCC
Symbol
Parameter
VIHa
High Level Data Input Voltage
VILa
Low Level Data Input Voltage
Conditions
Min.
RS=VIHMor VILM
Typ.
Max.
Units
VCC
2.0
V
VREFb+0.1
RS=VIMM
RS=VIHMor VILM
V
GND
RS=VIMM
0.8
V
VREF-0.1
V
VIHCc
High Level Control Input Voltage
2.0
VCC
V
VILCc
Low Level Control Input Voltage
GND
0.8
V
VIHMd
High Level Control Input Voltage
0.8VCC
VCC
V
VIMMd
Middle Level Control Input Voltage
0.6
1.4
V
VILMd
Low Level Control Input Voltage
GND
0.08VCC
V
IINC
Input Current (except DDRN)
GND ≤ V IN ≤ V CC
± 10
μA
IINCD
Input Current (Only DDRN)
GND ≤ V IN ≤ V CC
± 20
μA
a. CLKIN,R10~R17,G10~G17,B10~B17,R20~R27,G20~G27,B20~B27,DE,HSYNC,VSYNC
b. VREF is input voltage of RS pin.
c. R/F,DDRN,MODE0,MODE1,O/E,PDWN,PRBS
d. RS,MAP
LVDS Transmitter DC Specifications
VCC = VCC=PVCC=LVCC
Symbol
Parameter
Conditions
Normal swing
VOD
Differential Output Voltage
RL=100Ω
RS= VCC
Reduced swing
RS= GND
ΔVOD
VOC
Min.
Typ.
Max.
250
350
450
mV
100
200
300
mV
35
mV
Change in VOD between
complementary output states
Common Mode Voltage
ΔVOC
Change in VOC between
complementary output states
IOS
Output Short Circuit Current
IOZ
Output TRI-State current
Copyright©2011 THine Electronics, Inc.
RL=100Ω
1.125
VOUT=GND, RL=100Ω
/PDWN=GND,
VOUT=GND to VCC
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1.25
1.375
Units
V
35
mV
-24
mA
± 10
μA
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Electrical Characteristics (Continued)
Supply Current
VCC = VCC=PVCC=LVCC
Symbol
Parameter
Condition
mA
MODE<1:0>=HH
CLKIN=85MHz
100
mA
Single-in/Single-out
CLKIN=135MHz
122
mA
CLKIN=160MHz
T.B.D
mA
CLKIN=65MHz
114
mA
CLKIN=85MHz
116
mA
CLKIN=135MHz
155
mA
CLKIN=150MHz
168
mA
CLKIN=160MHz
T.B.D
mA
CLKIN=32.5MHz
114
mA
CLKIN=42.5MHz
118
mA
CLKIN=67.5MHz
155
mA
CLKIN=75MHz
167
mA
CLKIN=80MHz
T.B.D
mA
CLKIN=32.5MHz
84
mA
MODE<1:0>=LH
CLKIN=42.5MHz
98
mA
Dual-in/Single-out
CLKIN=67.5MHz
120
mA
CLKIN=80MHz
T.B.D
mA
CLKIN=65MHz
144
mA
MODE<1:0>=LL
CLKIN=85MHz
171
mA
Dual-in/Dual-out
CLKIN=135MHz
217
mA
CLKIN=160MHz
T.B.D
mA
50
μA
DDRN=H or Open
DDR Input Off
Current
(Worst Case
Pattern) Fig1.
ITCCS
Transmitter Power
Down Supply
Units
86
Single-in/Dual-out
ITCCW
Max.
CLKIN=65MHz
MODE<1:0>=HL
Transmitter Supply
Typ.
RL=100Ω
MODE<1:0>=HL
CL=5pF
Single-in/Dual-out
RS=VCC
DDRN=L
DDR Input On
/PDWN = L, All Inputs = Fixed L or H
Current
TCLK1+
Txy+
x= A, B, C, D
y=1,2
Fig1. Test Pattern
(LVDS Output Full Toggle Pattern)
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THC63LVD823B_Rev.3.1_E
Switching Characteristics
VCC = VCC=PVCC=LVCC
Symbol
Parameter
Min.
Typ.
Max.
Units
tTCIP
CLK IN Period(Fig4,5)
tTCH
CLK IN High Time(Fig4,5)
0.35tTCIP
tTCL
CLK IN Low Time(Fig4,5)
0.35tTCIP
tTS
TTL Data Setup to CLK IN(Fig4,5)
2.5
ns
tTH
TTL Data Hold from CKL IN(Fig4,5)
0.0
ns
6.25
CLK IN to TCLK+/- Delay(Fig4,5)
tTCD
MODE<1:0>=LL
Dual-in/Dual-out
tTCOP
tLVT
tTOP1
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
tTPLL
CLK OUT Period(Fig6)
100
ns
0.5tTCIP
0.65tTCIP
ns
0.5tTCIP
0.65tTCIP
ns
(4+3/7)tTCIP
(4+3/7)tTCIP
+2.6
+7.5
6.25
50
ns
0.6
1.5
ns
0.0
+0.15
ns
LVDS Transition Time(Fig2)
Output Data
-0.15
Position0 (Fig6)
Output Data
Position1 (Fig6)
Output Data
Position2 (Fig6)
tTCOP =
Output Data
Position3 (Fig6)
6.25ns~20ns
Output Data
Position4 (Fig6)
Output Data
Position5 (Fig6)
Output Data
Position6 (Fig6)
ns
t TCOP
--------------- – 0.15
7
t TCOP
--------------7
t TCOP
--------------+ 0.15
7
ns
t TCOP
– 0.15
2 --------------7
t TCOP
2 --------------7
t TCOP
+ 0.15
2 --------------7
ns
t TCOP
3 --------------– 0.15
7
t TCOP
3 --------------7
t TCOP
+ 0.15
3 --------------7
ns
t TCOP
4 --------------– 0.15
7
t TCOP
4 --------------7
t TCOP
+ 0.15
4 --------------7
ns
t TCOP
– 0.15
5 --------------7
t TCOP
5 --------------7
t TCOP
5 --------------+ 0.15
7
ns
t TCOP
– 0.15
6 --------------7
t TCOP
6 --------------7
t TCOP
6 --------------+ 0.15
7
ns
10.0
ms
Phase Lock Time(Fig3)
DE input period (Fig3-1)
tDEINT
Single-in / Dual-out, DDR Off mode
only(MODE<1:0>=HL,
4tTCIP
tTCIP*(2n) a
ns
2tTCIP
tTCIP*(2m)a
ns
DDRN =Open or H)
DE High time (Fig3-1)
tDEH
Single-in / Dual-out, DDR Off mode
only(MODE<1:0>=HL,
DDRN =Open or H)
DE Low time(Fig3-1)
tDEL
Single-in / Dual-out, DDR Off mode
only(MODE<1:0>=HL,
2tTCIP
ns
DDRN =Open or H)
a. Refer to Fig3-1 for details.
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THC63LVD823B_Rev.3.1_E
AC Timing Diagrams
Vdiff=(TA+)-(TA-)
TA+
Vdiff
5pF
80%
80%
20%
20%
100Ω
TAtLVT
tLVT
LVDS Output Load
Fig2. LVDS Output Load and Transition Time
CLKIN
2.0V
/PDWN
tTPLL
Vdiff=0V
TCLKx+/x=1,2
Fig3. PLL Lock Time
tDEINT
tTCIP
CLKIN
DE
tDEH
tDEL
Note: In single-in/dual-out, DDR off mode (MODE<1:0>=HL, DDRN =Open or H),
the period between rising edges of DE (tDEINT), high time of DE (tDEH)
should always satisfy following equations.
tDEH = tTCIP * (2m)
tDEINT = tTCIP * (2n)
m, n =integer
Fig3-1. Single IN / Dual OUT, DDR off mode DE input timing
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THC63LVD823B_Rev.3.1_E
AC Timing Diagrams (Continued)
RS pin
VIHM
tTCIP
tTCH
VIMM
tTCL
VILM
VOD
350mV
200mV
VREF
VCC/2
Input Voltage of RS pin
VCC/2
VCC
VREF
CLKIN
VREF
VREF
GND
Rxn, Gxn, Bxn
HSYNC
VSYNC
VREF
DE
x=1,2 n=0-7
tTS
tTH
VCC
Current Data
VREF
GND
tTCD
TCLKx+/x=1,2
VOD
Txy+/x=1,2
y= A, B, C, D
VOC
Current Data
Note:
CLKIN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig4. CLKIN Period, High/Low Time, Setup/Hold Timing
RS pin
VIHM
tTCIP
tTCH
VIMM
tTCL
VILM
VOD
350mV
200mV
VREF
VCC/2
Input Voltage of RS pin
VCC/2
VCC
VREF
CLKIN
VREF
VREF
GND
tTS
Rxn, Gxn, Bxn
HSYNC
VSYNC
DE
x=1,2 n=0-7
tTH
tTS
tTH
VCC
VREF
1st Pixel
Data
2nd Pixel
Data
VREF
GND
tTCD
TCLKx+/x=1,2
VOD
Txy+/x=1,2
y= A, B, C, D
VOC
Current Data
Note:
CLKIN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig5. CLKIN Period, High/Low Time, Setup/Hold Timing for Double Edge Input Mode (DDR)
MODE<1:0>=HL,DDRN=L
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THC63LVD823B_Rev.3.1_E
AC Timing Diagrams (Continued)
tTOP2
tTOP3
tTOP4
tTOP5
tTOP6
tTOP0
tTOP1
Tyx+/-
Tyx6
Tyx5
Tyx4
Tyx3
TCLKx+
Tyx2
Tyx1
Tyx0
Tyx6
Tyx5
Vdiff = 0V
Tyx4
Tyx3
Tyx2
Tyx1
Vdiff = 0V
x = 1,2
y = A,B,C,D
tTCOP
Note:
Vdiff = (Tyx+) - (Tyx-), (TCLKx+) - (TCLKx-)
Fig6. LVDS Output Data Position
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THC63LVD823B_Rev.3.1_E
Input Data Mapping
•Table1. Input Color Data naming rule
X
Y
Z
Description
X=R
Red Color Data
X=G
Green Color Data
X=B
Blue Color Data
Y= None
Single Pixel
Y=E
Dual Pixel
Y=O
Z=0-7
1st Pixel Data
2nd Pixel Data
Bit number 0: LSB (Least Significant Bit)
7: MSB (Most Significant Bit)
•Table2. TTL/CMOS Input Data Mapping (Single-in mode, MODE1=H)
Data Signals
Copyright©2011 THine Electronics, Inc.
Transmitter
Input Pin Names
R0
R10
R1
R11
R2
R12
R3
R13
R4
R14
R5
R15
R6
R16
R7
R17
G0
G10
G1
G11
G2
G12
G3
G13
G4
G14
G5
G15
G6
G16
G7
G17
B0
B10
B1
B11
B2
B12
B3
B13
B4
B14
B5
B15
B6
B16
B7
B17
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THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Input Data Mapping (Continued)
•Table3. TTL/CMOS Input Data Mapping (Dual-in mode, MODE1=L)
Data Signals
RE0
Transmitter
Input Pin Names
Data Signals
Transmitter
Input Pin Names
R10
RO0
RE1
R11
RO1
R21
RE2
R12
RO2
R22
RE3
R13
RO3
R23
RE4
R14
RO4
R24
RE5
R15
RO5
R25
RE6
R16
RO6
R26
RE7
R17
RO7
R27
GE0
G10
GO0
G20
GE1
G11
GO1
G21
GE2
G12
GO2
G22
GE3
G13
GO3
G23
GE4
G14
GO4
G24
GE5
G15
GO5
G25
GE6
G16
GO6
G26
GE7
G17
GO7
G27
BE0
B10
BO0
B20
BE1
B11
BO1
B21
BE2
B12
BO2
B22
BE3
B13
BO3
B23
BE4
B14
BO4
B24
BE5
B15
BO5
B25
BE6
B16
BO6
B26
BE7
B17
BO7
B27
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THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
LVDS Output Data Mapping
Previous Cycle
(2nd Pixel Data)
Next Cycle
(2nd Pixel Data)
Current Cycle
(1st Pixel Data)
TCLK1+
Tx1+/x= A, B, C, D
Tx11(n-1) Tx10(n-1) Tx16(n)
Tx15(n)
Tx14(n)
Tx13(n)
Tx12(n)
Tx11(n)
Tx10(n)
Tx16(n+1)
Fig7. TTL Data Inputs Mapped to LVDS outputs
MODE0= H (Single-out Mode)
Previous Cycle
Current Cycle
TCLK1+
Tx1+/x= A, B, C, D
Tx11(n-1) Tx10(n-1) Tx16(n)
Tx15(n)
Tx14(n)
Tx13(n)
Tx12(n)
Tx11(n)
Tx10(n)
Tx16(n+1)
Tx2+/x= A, B, C, D
Tx21(n-1) Tx20(n-1) Tx26(n)
Tx25(n)
Tx24(n)
Tx23(n)
Tx22(n)
Tx21(n)
Tx20(n)
Tx26(n+1)
Fig8. TTL Data Inputs Mapped to LVDS outputs
MODE0= L (Dual-out Mode)
Copyright©2011 THine Electronics, Inc.
14/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
LVDS Output Data Mapping (Continued)
•Table4. LVDS Output Data Mapping (Single-in/Single-out, MODE<1:0>=HH)
LVDS
Mapping Mode (Input Pin Name)
Mode1
Output
Data
MAP=H
Mode2
MAP=L
TA10
R12
R10
TA11
R13
R11
TA12
R14
R12
TA13
R15
R13
TA14
R16
R14
TA15
R17
R15
TA16
G12
G10
TB10
G13
G11
TB11
G14
G12
TB12
G15
G13
TB13
G16
G14
TB14
G17
G15
TB15
B12
B10
TB16
B13
B11
TC10
B14
B12
TC11
B15
B13
TC12
B16
B14
TC13
B17
B15
TC14
HSYNC
HSYNC
TC15
VSYNC
VSYNC
TC16
DE
DE
TD10
R10
R16
TD11
R11
R17
TD12
G10
G16
TD13
G11
G17
TD14
B10
B16
TD15
B11
B17
TD16
N/A
N/A
Copyright©2011 THine Electronics, Inc.
15/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
LVDS Output Data Mapping (Continued)
•Table5. LVDS Output Data Mapping (Single-in/Dual-out, DDR On/Off, MODE<1:0>=HL, DDRN =Open/H/L)
Mapping Mode (Input Pin Name)
LVDS
Output Data
Mode1
(1st Link)
MAP=H
TA10
R12
LVDS
Mapping Mode (Input Pin Name)
Mode2
MAP=L
Output Data
Mode1
(2nd Link)
MAP=H
Mode2
MAP=L
R10
TA20
R12
R10
TA11
R13
R11
TA21
R13
R11
TA12
R14
R12
TA22
R14
R12
TA13
R15
R13
TA23
R15
R13
TA14
R16
R14
TA24
R16
R14
TA15
R17
R15
TA25
R17
R15
TA16
G12
G10
TA26
G12
G10
TB10
G13
G11
TB20
G13
G11
TB11
G14
G12
TB21
G14
G12
TB12
G15
G13
TB22
G15
G13
TB13
G16
G14
TB23
G16
G14
TB14
G17
G15
TB24
G17
G15
TB15
B12
B10
TB25
B12
B10
TB16
B13
B11
TB26
B13
B11
TC10
B14
B12
TC20
B14
B12
TC11
B15
B13
TC21
B15
B13
TC12
B16
B14
TC22
B16
B14
TC13
B17
B15
TC23
B17
B15
TC14
HSYNC
HSYNC
TC24
HSYNC
HSYNC
TC15
VSYNC
VSYNC
TC25
VSYNC
VSYNC
TC16
DE
DE
TC26
DE
DE
TD10
R10
R16
TD20
R10
R16
TD11
R11
R17
TD21
R11
R17
TD12
G10
G16
TD22
G10
G16
TD13
G11
G17
TD23
G11
G17
TD14
B10
B16
TD24
B10
B16
TD15
B11
B17
TD25
B11
B17
TD16
N/A
N/A
TD26
N/A
N/A
VCC
DE
GND
R1n,G1n,B1n
n=0 - 7
Hsync
Vsync
VCC
1st Pixel Data 2nd Pixel Data 1st Pixel Data 2nd Pixel Data
GND
Fig9. The decision rule of 1st Pixel data in Single IN/Dual Out DDR Off
(MODE<1:0>=HL, DDRN =Open or H)
Copyright©2011 THine Electronics, Inc.
16/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
LVDS Output Data Mapping (Continued)
•Table6. LVDS Output Data Mapping (Dual-in/Single-out, MODE<1:0>=LH)
LVDS
Mapping Mode (Input Pin Name)
Output Data
Mode1
(1st Pixel)
MAP=H
TA10(n)
R12
LVDS
Mapping Mode (Input Pin Name)
Mode2
Output Data
Mode1
Mode2
MAP=L
(2nd Pixel)
MAP=H
MAP=L
R10
TA10(n+1)
R22
R20
TA11(n)
R13
R11
TA11(n+1)
R23
R21
TA12(n)
R14
R12
TA12(n+1)
R24
R22
TA13(n)
R15
R13
TA13(n+1)
R25
R23
TA14(n)
R16
R14
TA14(n+1)
R26
R24
TA15(n)
R17
R15
TA15(n+1)
R27
R25
TA16(n)
G12
G10
TA16(n+1)
G22
G20
TB10(n)
G13
G11
TB10(n+1)
G23
G21
TB11(n)
G14
G12
TB11(n+1)
G24
G22
TB12(n)
G15
G13
TB12(n+1)
G25
G23
TB13(n)
G16
G14
TB13(n+1)
G26
G24
TB14(n)
G17
G15
TB14(n+1)
G27
G25
TB15(n)
B12
B10
TB15(n+1)
B22
B20
TB16(n)
B13
B11
TB16(n+1)
B23
B21
TC10(n)
B14
B12
TC10(n+1)
B24
B22
TC11(n)
B15
B13
TC11(n+1)
B25
B23
TC12(n)
B16
B14
TC12(n+1)
B26
B24
TC13(n)
B17
B15
TC13(n+1)
B27
B25
TC14(n)
HSYNC
HSYNC
TC14(n+1)
HSYNC
HSYNC
TC15(n)
VSYNC
VSYNC
TC15(n+1)
VSYNC
VSYNC
TC16(n)
DE
DE
TC16(n+1)
DE
DE
TD10(n)
R10
R16
TD10(n+1)
R20
R26
TD11(n)
R11
R17
TD11(n+1)
R21
R27
TD12(n)
G10
G16
TD12(n+1)
G20
G26
TD13(n)
G11
G17
TD13(n+1)
G21
G27
TD14(n)
B10
B16
TD14(n+1)
B20
B26
TD15(n)
B11
B17
TD15(n+1)
B21
B27
TD16(n)
N/A
N/A
TD16(n+1)
N/A
N/A
Copyright©2011 THine Electronics, Inc.
17/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
LVDS Output Data Mapping (Continued)
•Table7. LVDS Output Data Mapping (Dual-in/Dual-out, MODE<1:0>=LL)
LVDS
Mapping Mode (Input Pin Name)
Output Data
Mode1
(1st Link)
MAP=H
TA10
R12
LVDS
Mapping Mode (Input Pin Name)
Mode2
Output Data
Mode1
Mode2
MAP=L
(2nd Link)
MAP=H
MAP=L
R10
TA20
R22
R20
TA11
R13
R11
TA21
R23
R21
TA12
R14
R12
TA22
R24
R22
TA13
R15
R13
TA23
R25
R23
TA14
R16
R14
TA24
R26
R24
TA15
R17
R15
TA25
R27
R25
TA16
G12
G10
TA26
G22
G20
TB10
G13
G11
TB20
G23
G21
TB11
G14
G12
TB21
G24
G22
TB12
G15
G13
TB22
G25
G23
TB13
G16
G14
TB23
G26
G24
TB14
G17
G15
TB24
G27
G25
TB15
B12
B10
TB25
B22
B20
TB16
B13
B11
TB26
B23
B21
TC10
B14
B12
TC20
B24
B22
TC11
B15
B13
TC21
B25
B23
TC12
B16
B14
TC22
B26
B24
TC13
B17
B15
TC23
B27
B25
TC14
HSYNC
HSYNC
TC24
HSYNC
HSYNC
TC15
VSYNC
VSYNC
TC25
VSYNC
VSYNC
TC16
DE
DE
TC26
DE
DE
TD10
R10
R16
TD20
R20
R26
TD11
R11
R17
TD21
R21
R27
TD12
G10
G16
TD22
G20
G26
TD13
G11
G17
TD23
G21
G27
TD14
B10
B16
TD24
B20
B26
TD15
B11
B17
TD25
B21
B27
TD16
N/A
N/A
TD26
N/A
N/A
Copyright©2011 THine Electronics, Inc.
18/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Note
1)Cable Connection and Disconnection
Don't connect and disconnect the LVDS cable, when the power is supplied to the system.
2)GND Connection
Connect the each GND of the PCB which THC63LVD823B and LVDS-Rx on it. It is better for EMI reduction to
place GND cable as close to LVDS cable as possible.
3)Multi Drop Connection
Multi drop connection is not recommended.
TCLK+
THC63LVD823B
LVDS-Rx
TCLKLVDS-Rx
4)Asynchronous use
Asynchronous use such as following systems are not recommended.
CLKOUT
DATA
IC
CLKOUT
DATA
LVDS-Rx
TCLK-
DATA
IC
TCLK+
THC63LVD823B
DATA
TCLK+
THC63LVD823B
CLKOUT
DATA
Copyright©2011 THine Electronics, Inc.
DATA
LVDS-Rx
TCLK-
CLKOUT
IC
CLKOUT
TCLK+
THC63LVD823B
TCLKTCLK+
THC63LVD823B
IC
TCLK-
19/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Package
16.00 BSC
1.20 MAX
14.00 BSC
1.00 +/-0.05
14.00 BSC
16.00 BSC
0.05～0.15
1.00 REF
0.09～0.20
0.50 BSC
0.20 +0.07/-0.03
SEATING PLANE
0°～7.0°
0.10 S
S
0.08R MIN
0.08R～0.20R
GAGE
PLANE
0.25mm
0.60 +/-0.15
0.20 BSC
Unit：mm
Copyright©2011 THine Electronics, Inc.
20/21
THine Electronics, Inc.
THC63LVD823B_Rev.3.1_E
Notices and Requests
1.)The product specifications described in this material are subject to change without prior notice.
2.)The circuit diagrams described in this material are examples of the application which may not
always apply to the customer's design. We are not responsible for possible errors and omissions in
this material. Please note if errors or omissions should be found in this material, we may not be able
to correct them immediately.
3.)This material contains our copy right, know-how or other proprietary. Copying or disclosing to
third parties the contents of this material without our prior permission is prohibited.
4.)Note that if infringement of any third party's industrial ownership should occur by using this
product, we will be exempted from the responsibility unless it directly relates to the production process or functions of the product.
5.)This product is presumed to be used for general electric equipment, not for the applications
which require very high reliability (including medical equipment directly concerning people's life,
aerospace equipment, or nuclear control equipment). Also, when using this product for the equipment concerned with the control and safety of the transportation means, the traffic signal equipment, or various Types of safety equipment, please do it after applying appropriate measures to the
product.
6.)Despite our utmost efforts to improve the quality and reliability of the product, faults will occur
with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you are
encouraged to have sufficiently redundant or error preventive design applied to the use of the product so as not to have our product cause any social or public damage.
7.)Please note that this product is not designed to be radiation-proof.
8.)Customers are asked, if required, to judge by themselves if this product falls under the category
of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
THine Electronics, Inc.
E-mail: [email protected]
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