DATA SHEET MUR240 SEMICONDUCTOR Power Rectifier These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features •Ultrafast Recovery Times DO-15 •175°C Operating Junction Temperature Unit:inch(mm) •Low Forward Voltage •Low Leakage Current •High Temperature Glass Passivated Junction •These are Pb−Free Devices* •High temperature soldering : 260OC / 10 seconds at terminals .140 (3.6) .104 (2.6) DIA. • Pb free product at available : 99% Sn above meet RoHS environment substance directive request 1.0 (25.4) MIN. Mechanical Characteristics: •Case: Epoxy, Molded .300 (7.6) .230 (5.8) •Weight: 0.4 Gram (Approximately) •Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable .034 (.86) .028 (.71) DIA. •Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 1.0 (25.4) MIN. •Polarity: Cathode Indicated by Polarity Band •Shipped in Plastic Bags; 1,000 per Bag •Available Tape and Reel; 5,000 per Reel, by Adding a “RL’’ Suffix to the Part Number MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage VRRM Working Peak Reverse Voltage VRWM DC Blocking Voltage Average Rectified Forward Current (Note 1) (Square Wave Mounting Method #3 Per Note 3) VR IF(AV) Unit Value 400 V — 2.0 @ A TA = 85°C Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, IFSM A 60 halfwave, single phase, 60 Hz) Operating Junction Temperature and Storage Temperature Range TJ, Tstg –55 to °C +150 THERMAL CHARACTERISTICS Characteristic Maximum Thermal Resistance, Junction−to−Ambient Symbol Value ө See R JA Unit °C/W Note 3 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://www.yeashin.com 1 REV.02 20110725 MUR240 ELECTRICAL CHARACTERISTICS 0.85 VF (IF = 2.0 Amp, TJ = 150°C) Maximum Instantaneous Reverse Current (Note 2) 150 IR Maximum Reverse Recovery Time Maximum Forward Recovery Time (IF = 1.0 A, di/dt = 100 A/µs) µA 5 (Rated dc Voltage, TJ = 25°C) (IF = 0.5 Amp, IR = 1.0 Amp, IREC = 0.25 A) V 1.0 (IF = 2.0 Amp, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) Unit Value Symbol Characteristic Maximum Instantaneous Forward Voltage (Note 2) trr 50 ns trr 50 ns 2. Pulse Test: Pulse Width = 300 _s, Duty Cycle ≤ 2.0%. 10 VF @ 175°C IF, INSTANTANEOUS FORWARD CURRENT (AMPS) I , INSTANTANEOUS FORWARD CURRENT (AMPS) F 10 100°C 25°C 1.0 0.1 VF @ 175°C 100°C 25°C 1.0 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 0.3 0.5 0.7 0.9 1.1 1.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage http://www.yeashin.com 2 1.5 REV.02 20110725 RATING AND CHARACTERISTIC CURVES MUR240 100 IR, REVERSE CURRENT ( A) IR, REVERSE CURRENT ( A) 1000 IR @ 175°C 100 100°C 10 25°C 1.0 0.1 10 100°C 1.0 0.1 25°C 0.01 0.001 0 100 200 300 400 0 100 200 300 400 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Maximum Reverse Current Figure 4. Typical Reverse Current , AVERAGE POWER DISSIPATION (WATTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) IR @ 175°C 5.0 4.0 3.0 2.0 dc SQUARE WAVE 1.0 0 2.5 SQUARE WAVE dc 2.0 1.5 1.0 0.5 0 0 100 50 150 200 0 0.5 1.0 1.5 2.0 2.5 3.0 35 30 TJ = 25°C 30 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 20 15 10 5.0 TJ = 25°C 25 20 15 10 5.0 0 0 0 10 20 30 40 0 50 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 7. Typical Capacitance Figure 8. Maximum Capacitance http://www.yeashin.com 3 REV.02 20110725 50