DATA SHEET YSBLC33 Series SEMICONDUCTOR Low Capacitance TVS Diode Array APPLICATIONS ◆ Ethernet - 10/100/1000 Base T H SOD-323 ◆ Cellular Phones 2 ◆ I C Bus Protection ◆ Parallel & Serial Port Protection ◆ Personal Digital Assistant (PDA) ◆ Microcontroller Input Protection ◆ ISDN S/T Interface ◆ WAN/LAN Equipment IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 12A (8/20µs) PIN CONFIGURATION FEATURES ◆ 400 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects One Uidirectional I/O line ◆ Low clamping voltage ◆ Working voltages : 3.3V, 5.0V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5.0 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free http://www.yeashin.com 1 REV.02 20110725 DEVICE CHARACTERISTICS YSBLC33 Series MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 350 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ Operating Temperature Range Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) IT VC IR CT (µA) (pF) (@A) (max.) (typ.) VC @1A (mA) (max.) (max.) YSBLC33 S3 3.3 4 1 5.15 13.9 8 20 0.4 YSBLC05 S5 5.0 6 1 9.8 18.3 8 5 0.4 http://www.yeashin.com 2 REV.02 20110725 PACKAGE OUTLINE & DIMENSIONS YSBLC33 Series * SOLDERING FOOTPRINT http://www.yeashin.com 3 REV.02 20110725