05 COM-945GSE COM Express Type 2 CPU Module With Onboard Intel® Atom™ N270 Processor COM Express CPU Modules Features DDR2 SODIMM Intel® 945GSE ■■ Onboard Intel® Atom™ N270 Processor 945GSE + ICH7M ■■ SODIMM DDR2 400/533 Memory, Max. 2 GB ■■ Gigabit Ethernet ■■ CRT, 18-bit Dual-channel LVDS LCD, SDVO ■■ High Definition Audio Interface ■■ PATA x 1, SATA 1.5Gb/s x 2 ■■ USB2.0 x 8 ■■ PCI x 4, PCI-Express [x1] x 3 ■■ Wide DC Input Range, +8.5V To +19V (Optional) ■■ COM Express Pin-out Type 2 ■■ Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0 ■■ Intel® Intel® ICH7M Onboard Intel® Atom™ N270 Processor Intel® 82574L Gigabit Ethernet 2-pin Wafer for RTC Battery Specifications System Form Factor COM Express compact module, Pin-out Type 2, COM.0 Rev. 1.0 Processor Onboard Intel® Atom™ N270 Processor, 1.6 GHz, FSB 533 MHz System Memory 200-pin DDR2 SODIMM x 1, Max. 2 GB (DDR2 400/533) Chipset Intel® 945GSE + ICH7M I/O Chipset ICH7M Ethernet Intel® 82574L, 10/100/1000Base-TX BIOS Award BIOS v8.0 SPI type, 2 MB ROM EEPROM Atmel® AT24C02, save BIOS and configuration data (Optional) Wake on LAN Yes Watchdog Timer Fintek F75111 H/W Status Monitoring Supports CPU temperature monitoring Expansion Interface PCI-Express [x1] x 3 (82801GBM) PCI-Express [x1] x 5 (82801GHM) (Optional) 32-bit PCI x 4 LPC bus x 1 SMBus x 1 I2C x 1 Power Requirement Wide DC input range, +8.5V to +19V (Optional) Nominal: +12V 2-pin wafer for RTC battery Power Consumption (Typical) Intel® Atom™ N270 1.6 GHz, DDR2 533 1 GB 1.31A @ +12V 0.36A @ +5V (w/ECB-916M) Board Size 3.74" (L) x 3.74" (W) (95mm x 95mm) Gross Weight 0.55 lb (0.25 Kg) Operating Temperature 32˚F ~ 140˚F (0˚C ~ 60˚C), -4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1 Storage Temperature -40˚F ~ 176˚F (-40˚C ~ 80˚C) Operating Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 100,000 Display Supports CRT/LCD simultaneous/ dual view displays Chipset Intel® 945GSE integrated Memory Shared system memory up to 224 MB/ DVMT 3.0 Resolutions Up to 2048 x 1536 (QXGA) for CRT Up to 1600 x 1200 (UXGA) for LCD LCD Interface 18-bit dual-channel LVDS SDVO Supports SDVO x 1 Packing List •M2.5 Screw x 4 •Product CD •COM-945GSE I/O Storage PATA x 1 (Two devices) SATA 1.5Gb/s x 2 USB USB2.0 x 8 Audio High definition audio GPIO Up to 4 in or 4 out 05-19 Note: All specifications are subject to change without notice. COM-945GSE Dimension Unit: mm Ordering Information Part Number TF-COM-945GSE-A11-01 TF-COM-945GSEW1-A11 COM Express Type 2 (COM.0 Rev.1.0) 2 (COM.0 Rev.1.0) CPU Memory Intel® Atom™ N270/1.6G DDR2 SODIMM x 1 Max.2GB Intel® Atom™ N270/1.6G DDR2 SODIMM x 1 Max.2GB Display CRT, LVDS, SDVO CRT, LVDS, SDVO LVDS Storage 18-bit dual channel SATA2 x 2 PATA x 1 18-bit dual channel SATA2 x 2 PATA x 1 LAN GbE x 1 GbE x 1 USB USB2.0 x 8 USB2.0 x 8 URAT Expansion Slot Power Temp — PCI-E[1] x 3 32-bit PCI x 4 12V 0°C ~ 60°C — PCI-E[1] x 3 32-bit PCI x 4 12V WiTAS 1 -20°C ~ 70°C Optional Accessories •TF-ECB-916M-A10-02 COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express, AT/ATX, 6th Standoff, Rev. A1.0 •TF-PER-A060 CPU Cooler, For COM-945GSE, Onboard CPU, 12V Fan •TF-PER-A055 Passive Heatsink, For COM-945GSE, Onboard CPU •TF-PER-A056 Heat Speader Kit, For COM-945GSE, Onboard CPU 05-20