AAEON ECB-970

ECB-970
Qseven Rev. 2.0 Carrier Board for ARM/X86 Solutions
Features
■■ Supports
Qseven Module
ARM/x86 Based
■■ Supports Gigabit Ethernet, RJ-45
■■ Up to 24-bit Dual Channel LVDS Connector or EDP, DP or HDMI
■■ High Definition Audio or I2S Audio Interface
■■ SATA Port x 2, SDIO x 1
■■ USB 2.0 x 8, USB 3.0 x 2, USB OTG
■■ LPC Connector x 1
■■ Qseven 2.0
■■ 9.65” Form Factor
■■ Support
Launching in Q2
Specifications
System
Form Factor
MTX
I/O Chipset
Winbond W83627DHG-P or Fintek F81866 (optional)
Ethernet
10/1000/1000Base-TX, RJ-45 x 1 (From CPU module)
Expansion Interface
PCI Express [x4] x 1, LPC Connector x 1 (For Super I/O Card only)
Power Requirement
+5V DC
Power Consumption
(Typical)
—
Board Size
9.65" x 9.65" (243.84mm x 243.84mm)
Gross Weight
1.32 lb (0.6 Kg)
Operation Temperature
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 185°F (-40°C ~ 85°C)
Operation Humidity
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
—
Display
LVDS or EDP, DP or HDMI
LCD Interface
Up to 24-bit dual channel LVDS
I/O
—
Storage
SATA x 2, SDIO x 1
Serial Port
RS-232 x 1, RS-232/422/485 x 1
Parallel Port
—
USB
USB 2.0 x 8, USB3.0 x 2, USB OTG
PS/2 Port
—
I2C
1
Audio
Audio Jack, supports Line-in, Line-out, Microphone, Headphone (ARM base only)
Debug LED
—
Packing List
•Product CD
•ECB-970
09-4