AMSCO AS3930_07

AS3930
S i n g l e C h a n n e l L o w F r e q u e n c y Wa k e u p R e c e i v e r
1 General Description
Wake-up sensitivity 100µVRMS (typ.)
Adjustable sensitivity level
The AS3930 is a single-channel low power ASK receiver that is able
to generate a wake-up upon detection of a data signal which uses a
LF carrier frequency between 110 - 150 kHz. The integrated
correlator can be used for detection of a programmable 16-bit wakeup pattern.
Highly resistant to false wake-ups
False wake-up counter
Periodical forced wake-up supported (1s – 2h)
Low power listening modes
The AS3930 provides a digital RSSI value, it supports a
programmable data rate. The AS3930 offers a real-time clock (RTC),
which is either derived from a crystal oscillator or the internal RC
oscillator.
Current consumption in listening mode 1.37µA (typ.)
Programmable data-rate 0.5-4 kbaud (Manchester encoded)
Digital RSSI
The programmable features of AS3930 enable to optimize its
settings for achieving a longer distance while retaining a reliable
wake-up generation. The sensitivity level of AS3930 can be adjusted
in presence of a strong field or in noisy environments. The device is
available in a 16-pin TSSOP package.
Dynamic range 64dB
5-bit RSSI step (2dB per step)
RTC based on 32kHz XTAL, RC-OSC, or external
clock
Operating temperature range -40ºC to +85ºC
2 Key Features
Operating supply voltage 2.4 - 3.6V (TA = 25ºC)
Single channel ASK wake-up receiver
Bi-directional serial digital interface (SDI)
Carrier frequency range 110 - 150 kHz
Package options: 16-pin TSSOP and QFN 4x4 16 LD
Programmable wake-up pattern (16bits)
3 Applications
Doubling of wake-up pattern supported
The AS3930 is ideal for Active RFID tags, real-time location
systems, operator identification, access control, and wireless
sensors.
Wake-up without pattern detection supported
Figure 1. AS3930 Typical Application Diagram with Crystal Oscillator
VCC
CL
CBAT
VCC
CS
XIN
TRANSMITTER
TX
Transmitting Antenna
XTAL
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XOUT
DAT
LF1P
NC
Revision 1.5
WAKE
AS3930
SCL
NC
SDO
LFN
SDI
VSS
GND
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AS3930
Datasheet - A p p l i c a t i o n s
Figure 2. AS3930 Typical Application Diagram without Crystal Oscillator
VCC
VCC
CS
CBAT
TRANSMITTER
TX
Transmitting Antenna
XIN
XOUT
DAT
LF1P
WAKE
NC
AS3930
SCL
NC
SDO
LFN
SDI
VSS
GND
Figure 3. AS3930 Typical Application Diagram with Clock from External Source
VCC
CBAT
External Clock
VCC
R
C
CS
XIN
TX
Transmitting Antenna
XOUT
TRANSMITTER
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DAT
LF1P
NC
Revision 1.5
AS3930
WAKE
SCL
NC
SDO
LFN
SDI
VSS
GND
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AS3930
Datasheet - C o n t e n t s
Contents
1 General Description ..................................................................................................................................................................
1
2 Key Features.............................................................................................................................................................................
1
3 Applications...............................................................................................................................................................................
1
4 Pin Assignments .......................................................................................................................................................................
4
4.1 16-pin TSSOP ......................................................................................................................................................................................
4
4.1.1 Pin Descriptions........................................................................................................................................................................... 4
4.2 QFN 4x4 16 LD.....................................................................................................................................................................................
5
4.2.1 Pin Descriptions........................................................................................................................................................................... 5
5 Absolute Maximum Ratings ......................................................................................................................................................
6
6 Electrical Characteristics...........................................................................................................................................................
7
7 Typical Operating Characteristics .............................................................................................................................................
9
8 Detailed Description................................................................................................................................................................
10
8.1 Operating Modes ................................................................................................................................................................................
8.1.1
8.1.2
8.1.3
8.1.4
Power Down Mode ....................................................................................................................................................................
Listening Mode ..........................................................................................................................................................................
Preamble Detection / Pattern Correlation ..................................................................................................................................
Data Receiving ..........................................................................................................................................................................
8.2 System and Block Specification .........................................................................................................................................................
11
11
11
11
12
12
8.2.1 Main Logic and SDI ................................................................................................................................................................... 12
8.2.2 Serial Data Interface (SDI)......................................................................................................................................................... 14
8.2.3 SDI Timing ................................................................................................................................................................................. 17
8.3 Channel Amplifier and Frequency Detector........................................................................................................................................
18
8.3.1 Frequency Detector / AGC ........................................................................................................................................................ 18
8.3.2 Antenna Damper........................................................................................................................................................................ 19
8.4 Demodulator / Data Slicer ..................................................................................................................................................................
19
8.5 Correlator............................................................................................................................................................................................
20
8.6 Wake-up Protocol - Carrier Frequency 125 kHz.................................................................................................................................
22
8.6.1 Without Pattern Detection.......................................................................................................................................................... 22
8.6.2 Single Pattern Detection ............................................................................................................................................................ 23
8.7 False Wake-up Register .....................................................................................................................................................................
24
8.8 Real Time Clock (RTC).......................................................................................................................................................................
25
8.8.1 Crystal Oscillator........................................................................................................................................................................ 26
8.8.2 RC-Oscillator ............................................................................................................................................................................. 26
8.8.3 External Clock Source ............................................................................................................................................................... 27
9 Package Drawings and Markings ...........................................................................................................................................
28
10 Ordering Information.............................................................................................................................................................
31
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Revision 1.5
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AS3930
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
4.1 16-pin TSSOP
Figure 4. TSSOP Pin Assignments (Top View)
4.1.1
CS
1
16
NC
SCL
2
15
DAT
SDI
3
14
WAKE
SDO
4
13
VSS
VCC
5
12
XOUT
GND
6
11
XIN
NC
7
10
LFN
NC
8
9
AS3930
LF1P
Pin Descriptions
Table 1. 16-pin TSSOP Pin Descriptions
Pin Number
Pin Name
1
CS
2
SCL
3
SDI
4
SDO
5
VCC
6
GND
7
NC
8
NC
9
LF1P
10
LFN
11
XIN
12
XOUT
13
VSS
14
WAKE
15
DAT
16
NC
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Pin Type
Description
Chip select
Digital input
SDI interface clock
SDI data input
Digital output / tristate
Supply pad
-
SDI data output (tristate when CS is low)
Positive supply voltage
Negative supply voltage
Not Connected
Input antenna
Analog I/O
Antenna ground
Crystal oscillator input
Crystal oscillator output
Supply pad
Digital output
-
Substrate
Wake-up output IRQ
Data output
Not Connected
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AS3930
Datasheet - P i n A s s i g n m e n t s
4.2 QFN 4x4 16 LD
4.2.1
GND
VCC
SDO
SDI
Figure 5. QFN Pin Assignments (Top View)
16
15
14
13
12
SCL
11
CS
3
10
NC
4
9
DAT
LF1P
LFN
AS3930A
5
6
7
8
WAKE
2
VSS
NC
XOUT
1
XIN
NC
Pin Descriptions
Table 2. QFN 4x4 16 LD Pin Descriptions
Pin Number
Pin Name
Pin Type
1
NC
-
2
NC
-
3
LF1P
4
LFN
5
XIN
6
XOUT
7
VSS
8
WAKE
9
DAT
10
NC
11
CS
12
SCL
13
SDI
14
SDO
15
VCC
16
GND
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Description
Not connected
Input antenna
Analog I/O
Antenna ground
Crystal oscillator input
Crystal oscillator output
Supply pad
Digital output
-
Substrate
Wake-up output IRQ
Data output
Not connected
Chip select
Digital input
SDI interface clock
SDI data input
Digital output / tristate
Supply pad
Revision 1.5
SDI data output (tristate when CS is low)
Positive supply voltage
Negative supply voltage
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AS3930
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
DC supply voltage (VDD)
-0.5
5
V
Input pin voltage (VIN)
-0.5
5
V
Input current (latch up immunity) (ISOURCE)
-100
100
mA
Norm: Jedec 78
kV
Norm: MIL 883 E method 3015 (HBM)
Electrical Parameters
Electrostatic Discharge
Electrostatic discharge (ESD)
±2
Continuous Power Dissipation
Total power dissipation
(all supplies and outputs)
(Pt)
0.07
mW
150
ºC
Temperature Ranges and Storage Conditions
Storage temperature (Tstrg)
-65
Package body temperature (Tbody)
Humidity non-condensing
Moisture sensitivity level (MSL)
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5
260
ºC
85
%
3
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature (body
temperature) is specified according IPC/JEDEC
J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-hermetic Solid State
Surface Mount Devices”.
Represents a maximum floor time of 168h
Revision 1.5
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AS3930
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
Table 4. Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
3.6
V
Operating Conditions
VDD
Positive supply voltage
2.4
VSS
Negative supply voltage
0
0
V
TAMB
Ambient temperature
-40
85
ºC
DC/AC Characteristics for Digital Inputs and Outputs
CMOS Input
VIH
High level input voltage
0.58*VDD 0.7*VDD 0.83* VDD
V
VIL
Low level input voltage
0.125*VDD 0.2*VDD 0.3* VDD
V
ILEAK
Input leakage current
100
nA
CMOS Output
VOH
High level output voltage
VOL
Low level output voltage
CL
Capacitive load
With a load current of 1mA
VDD-0.4
V
For a clock frequency of 1 MHz
VSS+0.4
V
400
pF
Tristate CMOS Output
VOH
High level output voltage
VOL
Low level output voltage
IOZ
Tristate leakage current
With a load current of 1mA
VDD-0.4
V
To VDD and VSS
VSS+0.4
V
100
nA
Max
Units
Table 5. Electrical System Specifications
Symbol
Parameter
Conditions
RIN
Input Impedance
In case no antenna damper is set
(R1<4>=0)
Fmin
Fmax
Min
Typ
Input Characteristics
2
MΩ
Minimum Input Frequency
110
kHz
Maximum Input Frequency
150
kHz
IPWD
Power Down Mode
400
nA
ICHRC
Current Consumption in standard
listening mode with channel active all
the time and RC-oscillator as RTC
2.7
µA
ICHOORC
Current Consumption in ON/OFF
mode and RC-oscillator as RTC
ICHXT
Current Consumption in standard
listening mode and crystal oscillator
as RTC
IDATA
Current Consumption in Preamble
detection / Pattern correlation / Data
receiving mode (RC-oscillator)
Current Consumption
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11% Duty Cycle
1.37
50% Duty Cycle
2
With 125kHz carrier frequency and
1kbps data-rate.
No load on the output pins.
Revision 1.5
µA
3.5
5.9
µA
5.3
9
µA
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AS3930
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 5. Electrical System Specifications
Symbol
Parameter
Conditions
Input Sensitivity
With 125kHz carrier frequency, chip in
default mode, 4 half bits burst + 4
symbols preamble and single preamble
detection
Min
Typ
Max
Units
Input Sensitivity
SENS
100
µVrms
250
µs
32.768
kHz
Channel Settling Time
TSAMP
Amplifier settling time
Crystal Oscillator
FXTAL
Frequency
TXTAL
Start-up Time
IXTAL
Current consumption
1
µA
Current consumption
1
µA
Crystal dependent
1
s
External Clock Source
IEXTCL
RC Oscillator
FRCNCAL
If no calibration is performed
27
32.768
42
kHz
FRCCAL32
If calibration with 32.768 kHz reference
signal is performed
31
32.768
34.5
kHz
FRCCALMAX
Frequency
FRCCALMIN
TCALRC
Calibration time
IRC
Current consumption
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Maximum achievable frequency
after calibration
35
kHz
Minimum achievable frequency
after calibration
30
kHz
65
200
Revision 1.5
Periods of
reference
clock
nA
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AS3930
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Figure 6. Sensitivity over Voltage and Temperature
Figure 7. Sensitivity over RSSI
1000000
120
95
100
oC
100000
27 oC
Input Voltage [µVrms]
-40 oC
Sensitivity [µVrms]
80
60
40
10000
1000
100
10
20
1
0
2.4
3
2
3.6
4
6
8
10 12 14 16 18 20 22 24 26 28 30
RSSI [dB]
Supply Voltage [V]
Figure 9. RC-Oscillator Frequency over Temperature (calibr.)
34.5
34.5
34
34
33.5
33.5
RC-OSC Frequency [KHz]
RC-OSC Frequency [KHz]
Figure 8. RC-Oscillator Frequency over Voltage (calibr.)
33
32.5
32
33
32.5
32
31.5
31.5
31
31
-36 -30 -20 -10
2.4
2.6
2.8
3
3.2
3.4
3.6
0
10
20
30
40
50
60
70
80
90
Operating Temperature [oC]
Supply Voltage [V]
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS3930 is a one-dimensional low power low-frequency wake-up receiver. The AS3930 is capable of detecting the presence of an inductive
coupled carrier and extract the envelope of the On-Off-Keying (OOK) modulated carrier. In case the carrier is Manchester coded, then the clock
is recovered from the transmitted signal and the data can be correlated with a programmed pattern. If the detected pattern corresponds to the
stored one, then a wake-up signal (IRQ) is risen up. The pattern correlation can be bypassed in which case the wake-up detection is based only
on the frequency detection.
The AS3930 is made up of a single receiving channel, one envelop detector, one data correlator, 8 programmable registers with the main logic
and a real time clock.
The digital logic can be accessed by an SDI. The real time clock can be based on a crystal oscillator or on an internal RC. If the internal RC
oscillator is used, a calibration procedure can be performed to improve its accuracy.
Figure 10. Block Diagram of the LF Wake-up Receiver AS3930
AS3930, 1-D LF Wakeup Receiver
IRQ
Wakeup
SCL
Main
Logic
SDI
SDI
SDO
RSSI
LF1P
CS
Channel
Amplifier1
Envelope Detector / Data Slicer
Correlator
DAT
I/V
Bias
Xtal RTC
RC RTC
LFN
VCC
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GND
XIN
XOUT
Revision 1.5
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
AS3930 needs the following external components:
Power supply capacitor – CBAT – 100 nF
32.768 kHz crystal with its two pulling capacitors – XTAL and CL (it is possible to omit these components if the internal RC oscillator is used
instead of the crystal oscillator)
Input LC resonator
In case the internal RC-oscillator is used (no crystal oscillator is mounted), the pin XIN has to be connected to the supply, while pin XOUT should
stay floating. Application diagrams with and without crystal are shown in Figure 1 and Figure 2.
8.1 Operating Modes
8.1.1
Power Down Mode
In Power Down Mode, AS3930 is completely switched off. The typical current consumption is 400 nA.
8.1.2
Listening Mode
In listening mode only the channel amplifier and the RTC are running. In this mode the system detects the presence of a carrier. In case the
carrier is detected, the RSSI can be displayed.
In this mode it is possible to distinguish the following three sub modes:
Standard Listening Mode. The channel amplifier that is capable of detecting the presence of the carrier frequency, is active all the time.
ON/OFF Mode (Low Power Mode). The channel amplifier is active for one millisecond after which it is switched off. The OFF-time is
programmable (see R4<7:6>).
Figure 11. ON/OFF Mode
Channel
t0
t0 + 1ms
t0 + T
t0 + T + 1ms
t0 + 2T
Time
Presence
of Carrier
Time
Further, for both sub modes, it is possible to enable a feature called Artificial Wake-up. If the Artificial Wake-up is enabled, then the AS3930
produces an interrupt after a certain time regardless of whether any activity is detected on the input. The period of the Artificial Wake-up is
defined in the register R8<2:0>. The user can distinguish between Artificial Wake-up and Wake-up based on the field detection (frequency or
pattern detection) since the Artificial Wake-up interrupt lasts only 128µs. With this interrupt the microcontroller (μC) can get feedback on the
surrounding environment (e.g. read the false wake-up register R13<7:0>) and/or take actions in order to change the setup.
8.1.3
Preamble Detection / Pattern Correlation
The preamble detection and pattern correlation are only considered for the wake-up when the data correlator function is enabled. See R1<1>.
The correlator searches first for preamble frequency (constant frequency of Manchester clock defined according to bit-rate transmission, see
Table 19) and then for data pattern.
If the pattern is matched, then the wake-up interrupt is displayed on the WAKE output and the chip goes in data receiving mode. If the pattern
fails, then the internal wake-up is terminated and no IRQ is produced.
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Revision 1.5
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
8.1.4
Data Receiving
After a successful wake-up the chip enters the data receiving mode. In this mode, the chip can be retained as a normal OOK receiver. The
received data are displayed on the DAT pin. It is possible to put the chip back in to listening mode either with a direct command (CLEAR_WAKE,
see Table 12) or by using the timeout feature. This feature automatically sets the chip back to listening mode after a certain time defined in the
R7<7:5>.
8.2 System and Block Specification
8.2.1
Main Logic and SDI
Table 6. Register Table
7
6
R0
n.a.
R1
ABS_HY
R2
S_ABSH
R3
HY_20m
R4
5
4
3
ON_OFF
AGC_TLIM
AGC_UD
ATT_ON
n.a.
EN_PAT2
EN_A
PWD
EN_WPAT
EN_RTC
S_WU1<1:0>
FS_SLC<2:0>
FS_ENV<2:0>
R_VAL<1:0>
GR<3:0>
R5
TS2<7:0>
R6
TS1<7:0>
R9
0
Reserved
HY_POS
T_OUT<2:0>
R8
1
Reserved
W_PAT_T<1:0>
T_OFF<1:0>
R7
2
T_HBIT<4:0>
n.a.
T_AUTO<2:0>
n.a.
Reserved
R10
n.a.
RSSI1<4:0>
R11
n.a.
R12
n.a.
R13
F_WAKE
Register Table Description and Default Values.
Table 7. Description and Default Values
Register
Name
Type
Default Value
Description
R0<5>
ON_OFF
R/W
0
On/Off operation mode. (Duty-cycle defined in the register R4<7:6>)
R0<4>
MUX_123
R/W
0
Reserved (it is not allowed to set this bit to 1)
R0<3>
Reserved
1
Reserved
R0<2>
Reserved
1
Reserved
R0<1>
EN_A
R/W
1
Channel enable
R0<0>
PWD
R/W
0
Power down
R1<7>
ABS_HY
R/W
0
Data slicer absolute reference
R1<6>
AGC_TLIM
R/W
0
AGC acting only on the first carrier burst
R1<5>
AGC_UD
R/W
1
AGC operating in both directions (up-down)
R1<4>
ATT_ON
R/W
0
Antenna damper enable
R1<3>
Reserved
0
Reserved
R1<2>
EN_PAT2
R/W
0
Double wake-up pattern correlation
R1<1>
EN_WPAT
R/W
1
Data correlation enable
R1<0>
EN_RTC
R/W
1
Crystal oscillator enable
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Revision 1.5
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
Table 7. Description and Default Values
Register
Name
Type
Default Value
Description
R2<7>
S_ABSH
R/W
0
Data slicer threshold reduction
R2<6:5>
W_PAT
R/W
00
Pattern correlation tolerance (see Table 20)
R2<4:2>
Reserved
000
Reserved
R2<1:0>
S_WU1
R/W
00
Tolerance setting for the stage wake-up (see Table 14)
R3<7>
HY_20m
R/W
0
Data slicer hysteresis
if HY_20m = 0, then comparator hysteresis = 40mV
if HY_20m = 1, then comparator hysteresis = 20mV
R3<6>
HY_POS
R/W
0
Data slicer hysteresis on both edges (HY_POS=0 → hysteresis on
both edges; HY_POS=1 → hysteresis only on positive edges)
R3<5:3>
FS_SCL
R/W
100
Data slicer time constant (see Table 18)
R3<2:0>
FS_ENV
R/W
000
Envelop detector time constant (see Table 17)
Off time in ON/OFF operation mode
R4<7:6>
T_OFF
R/W
00
T_OFF=00
1ms
T_OFF=01
2ms
T_OFF=10
4ms
T_OFF=11
8ms
R4<5:4>
D_RES
R/W
01
R4<3:0>
GR
R/W
0000
R5<7:0>
TS2
R/W
01101001
2 Byte of wake-up pattern
R6<7:0>
TS1
R/W
10010110
1 Byte of wake-up pattern
R7<7:5>
T_OUT
R/W
000
R7<4:0>
T_HBIT
R/W
01011
Antenna damping resistor (see Table 16)
Gain reduction (see Table 15)
nd
st
Automatic time-out (see Table 21)
Bit rate definition (see Table 19)
Artificial wake-up
R8<2:0>
T_AUTO
R9<6:0>
Reserved
R10<4:0>
RSSI
R/W
000
000000
T_AUTO=000
No artificial wake-up
T_AUTO=001
1 sec
T_AUTO=010
5 sec
T_AUTO=011
20 sec
T_AUTO=100
2 min
T_AUTO=101
15 min
T_AUTO=110
1 hour
T_AUTO=111
2 hour
Reserved
R
RSSI channel
R11<4:0>
R
n.a.
R12<4:0>
R
n.a.
R
False wake-up register
R13<7:0>
F_WAK
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Revision 1.5
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.2
Serial Data Interface (SDI)
This 4-wire interface is used by the Microcontroller (µC) to program the AS3930. The maximum clock operation frequency of the SDI is 2 MHz.
Table 8. Serial Data Interface (SDI) Pins
Name
Signal
Signal Level
Description
CS
Digital Input with pull down
CMOS
Chip Select
SDI
Digital Input with pull down
CMOS
Serial Data input for writing registers, data to transmit and/
or writing addresses to select readable register
SDO
Digital Output
CMOS
Serial Data output for received data or read value of
selected registers
SCLK
Digital Input with pull down
CMOS
Clock for serial data read and write
Note: SDO is set to tristate if CS is low. In this way more than one device can communicate on the same SDO bus.
SDI Command Structure. To program the SDI, the CS signal has to go high. A SDI command is made up of two bytes serial command and
the data is sampled on the falling edge of SCLK. Table 9 shows how the command looks like, from the MSB (B15) to LSB (B0). The command
stream has to be sent to the SDI from the MSB (B15) to the LSB (B0).
Table 9. SDI Command Structure
Mode
B15
Register Address / Direct Command
B14
B13
B12
B11
B10
B9
Register Data
B8
B7
B6
B5
B4
B3
B2
B1
B0
The first two bits (B15 and B14) define the operating mode. There are three modes available (write, read, direct command) plus one spare (not
used), as shown in Table 10.
Table 10. Bits B15, B14
B15
B14
Mode
0
0
WRITE
0
1
READ
1
0
NOT ALLOWED
1
1
DIRECT COMMAND
In case a write or read command happens, then the next 6 bits (B13 to B8) define the register address which has to be written respectively read,
as shown in Table 11.
Table 11. Bits B13-B8
B13
B12
B11
B10
B9
B8
Read/Write Register
0
0
0
0
0
0
R0
0
0
0
0
0
1
R1
0
0
0
0
1
0
R2
0
0
0
0
1
1
R3
0
0
0
1
0
0
R4
0
0
0
1
0
1
R5
0
0
0
1
1
0
R6
0
0
0
1
1
1
R7
0
0
1
0
0
0
R8
0
0
1
0
0
1
R9
0
0
1
0
1
0
R10
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
Table 11. Bits B13-B8
B13
B12
B11
B10
B9
B8
Read/Write Register
0
0
1
0
1
1
R11
0
0
1
1
0
0
R12
0
0
1
1
0
1
R13
The last 8 bits are the data that has to be written respectively read. A CS toggle high-low-high terminates the command mode.
If a direct command is sent (B15-B14=11), then the bits from B13 to B8 define the direct command while the last 8 bits are omitted. Table 12
shows all possible direct commands.
Table 12. List of Direct Commands
COMMAND_MODE
B13
B12
B11
B10
B9
B8
clear_wake
0
0
0
0
0
0
reset_RSSI
0
0
0
0
0
1
trim_osc
0
0
0
0
1
0
clear_false
0
0
0
0
1
1
preset_default
0
0
0
1
0
0
All direct commands are explained below:
-
clear_wake: Clears the wake state of the chip. In case the chip has woken up (WAKE pin is high), the chip is set back to listening mode.
reset_RSSI: Resets the RSSI measurement.
trim_osc: Starts the trimming procedure of the internal RC oscillator (see Figure 20).
clear_false: Resets the false wake-up register (R13<7:0>=00).
preset_default: Sets all registers in the default mode, as shown in Figure 7.
Note: In order to get the AS3930 work properly after sending the preset_default direct command, it is mandatory to write R0<3>=0 and
R0<2>=0.
Writing of Data to Addressable Registers (WRITE Mode)
The SDI is sampled at the falling edge of SCLK (as shown in the following diagrams).
A CS toggling high-low-high indicates the end of the WRITE command after register has been written. The following example shows a write
command.
Figure 12. Writing of a Single Byte (falling edge sampling)
CS
SCLK
SDI
X
0
0
A5
Two leading
Zeros indicate
WRITE Mode
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A4
A3
SCLK rising
edge Data is
transfered from
µC
A2
A1
A0
D7
D6
SCLK
falling edge
Data is
sampled
D5
D4
D3
D2
D1
Data is moved
to Address
A5-A0
Revision 1.5
D0
X
CS falling
edge signals
end of
WRITE Mode
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
Figure 13. Writing of Register Data with Auto-incrementing Address
CS
SCLK
SDI
A A A A A D D D D D D D D D D D D D D D D D D
X 0 0 A
5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6
Two leading
Zeros indicate
WRITE Mode
Data is moved
to Address
<A5-A0 >
Data is moved
to Address
<A5-A0 > + 1
D D D D D D D D D D
1 0 7 6 5 4 3 2 1 0
CS falling
edge signals
end of
WRITE Mode
Data is moved
to Address
<A5-A0 > + n
Data is moved
to Address
<A5-A0 > + (n-1)
X
Reading of Data from Addressable Registers (READ Mode). Once the address has been sent through SDI, the data can be fed
through the SDO pin out to the microcontroller.
A CS LOW toggling high-low-high has to be performed after finishing the read mode session, in order to indicate the end of the READ command
and prepare the Interface to the next command control Byte.
To transfer bytes from consecutive addresses, SDI master has to keep the CS signal high and the SCLK clock has to be active as long as data
need to be read.
Figure 14. Reading of a Single Register Byte
CS
SCLK
SDI
X
0
1
A5
SDO
A4
A3
A2
A1
X
01 pattern
indicates
READ Mode
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X
A0
D7
SCLK rising
edge Data is
transfered from
µC
SCLK
falling edge
Data is
sampled
D6
SCLK rising
edge Data is
moved from
Address
<A5-A0>
Revision 1.5
D5
D4
D3
SCLK falling
edge Data is
transfered to
µC
D2
D1
D0
X
CS falling
edge signals
end of READ
Mode
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Datasheet - D e t a i l e d D e s c r i p t i o n
Figure 15. Send Direct COMMAND Byte
CS
SCLK
X
SDI
1
1
C5
Two leading
ONE indicate
COMMAND
Mode
8.2.3
C4
C3
SCLK rising
edge Data is
transfered from
µC
C2
C1
X
C0
SCLK
falling edge
Data is
sampled
CS falling edge
signals the end of
COMMAND Mode
SDI Timing
Table 13. SDI Timing Parameters
Symbol
Parameter
Min
Typ
Max
Units
TCSCLK
Time CS to Sampling Data
500
ns
TDCLK
Time Data to Sampling Data
300
ns
THCL
SCLK High Time
200
ns
TCLK
SCLK period
1
µs
TCLKCS
Time Sampling Data to CS down
500
ns
TCST
CS Toggling time
500
ns
Figure 16. SDI Timing Diagram
TCST
CS
SPI
SCLK
SCL
t
TCSCLK
TDCLK
t
THCL
TCLKCS
t
TCLK
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Datasheet - D e t a i l e d D e s c r i p t i o n
8.3 Channel Amplifier and Frequency Detector
The channel amplifier consists of a variable gain amplifier (VGA), an automatic gain control, and a frequency detector. The latter detects the
presence of a carrier. As soon as the carrier is detected the AGC is enabled, the gain of the VGA is reduced and set to the right value and the
RSSI can be displayed.
8.3.1
Frequency Detector / AGC
The frequency detection uses the RTC as time base. In case the internal RC oscillator is used as RTC, it must be calibrated, but the calibration
is guaranteed for a 32.768 kHz crystal oscillator only. The frequency detection criteria can be tighter or more relaxed according to the setup
described in R2<1:0> (see Table 14).
Table 14. Tolerance Settings for Wake-up
R2<1>
R2<0>
Tolerance
0
0
relaxed
0
1
tighter (medium)
1
0
stringent
1
1
reserved
The AGC can operate in two modes:
AGC down only (R1<5>=0)
AGC up and down (R1<5>=1)
As soon as the AGC starts to operate, the gain in the VGA is set to maximum. If the AGC down only mode is selected, the AGC can only
decrease the gain. Since the RSSI is directly derived from the VGA gain, the system holds the RSSI peak.
When the AGC up and down mode is selected, the RSSI can follow the input signal strength variation in both directions.
Regardless which AGC operation mode is used, the AGC needs maximum 35 carrier periods to settle.
The RSSI is stored in the register R10<4:0>.
Both AGC modes (only down or down and up) can also operate with time limitation. This option allows AGC operation only in time slot of 256µs
following the internal wake-up. Then the AGC (RSSI) is frozen till the wake-up or RSSI reset occurs.
The RSSI is reset either with the direct command 'clear_wakeup' or 'reset_RSSI'. The 'reset_RSSI' command resets only the AGC setting but
does not terminate wake-up condition. This means that if the signal is still present the new AGC setting (RSSI) will appear not later than 300µs
(35 LF carrier periods) after the command was received. The AGC setting is reset if for duration of 3 Manchester half symbols no carrier is
detected. If the wake-up IRQ is cleared the chip will go back to listening mode.
In case the maximum amplification at the beginning is a drawback (e.g. in noisy environment) it is possible to set a smaller starting gain on the
amplifier (see Table 15). In this way it is possible to reduce the false frequency detection.
Table 15. Bit Setting of Gain Reduction
R4<3>
R4<2>
R4<1>
R4<0>
Gain Reduction
0
0
0
0
No gain reduction
0
0
0
1
n.a.
0
0
1
0 or 1
n.a.
0
1
0
0 or 1
-4dB
0
1
1
0 or 1
-8dB
1
0
0
0 or 1
-12dB
1
0
1
0 or 1
-16dB
1
1
0
0 or 1
-20dB
1
1
1
0 or 1
-24dB
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Datasheet - D e t a i l e d D e s c r i p t i o n
8.3.2
Antenna Damper
The antenna damper allows the chip to deal with higher field strength, it is enabled by register R1<4>. It consists of shunt resistors which
degrade the quality factor of the resonator by reducing the signal at the input of the amplifier. In this way the resonator sees a smaller parallel
resistance (in the band of interest) which degrades its quality factor in order to increase the linear range of the channel amplifier (the amplifier
does not saturate in presence of bigger signals). Table 16 shows the bit setup.
Table 16. Antenna Damper Bit Setup
R4<5>
R4<4>
Shunt Resistor (parallel to the resonator at 125 kHz)
0
0
1 kΩ
0
1
3 kΩ
1
0
9 kΩ
1
1
27 kΩ
8.4 Demodulator / Data Slicer
The performance of the demodulator can be optimized according to bit rate and preamble length as described in Table 17 and Table 18.
Table 17. Bit Setup for Envelop Detector for Different Symbol Rates
R3<2>
R3<1>
R3<0>
Symbol Rate [Manchester symbols/s]
0
0
0
4096
0
0
1
2184
0
1
0
1490
0
1
1
1130
1
0
0
910
1
0
1
762
1
1
0
655
1
1
1
512
If the bit rate gets higher, the time constant in the envelop detector must be set to a smaller value. This means that higher noise is injected
because of the wider band. The next table is a rough indication of how the envelop detector looks like for different bit rates. By using proper data
slicer settings it is possible to improve the noise immunity paying the penalty of a longer preamble. In fact if the data slicer has a bigger time
constant it is possible to reject more noise, but every time a transmission occurs, the data slicer need time to settle. This settling time will
influence the length of the preamble. Table 18 gives a correlation between data slicer setup and minimum required preamble length.
Table 18. Bit Setup for Data Slicer for Different Preamble Length
R3<5>
R3<4>
R3<3>
Minimum Preamble Length [ms]
0
0
0
0.8
0
0
1
1.15
0
1
0
1.55
0
1
1
1.9
1
0
0
2.3
1
0
1
2.65
1
1
0
3
1
1
1
3.5
Note: These times are minimum required, but it is recommended to prolong the preamble.
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Datasheet - D e t a i l e d D e s c r i p t i o n
The comparator of the data slicer can work only with positive or with symmetrical threshold R3<6>. In addition the threshold can be 20 or 40 mV
R3<7>. In case the length of the preamble is an issue the data slicer can also work with an absolute threshold R1<7>. In this case the bits
R3<2:0> would not influence the performance. It is even possible to reduce the absolute threshold in case the environment is not particularly
noisy R2<7>.
8.5 Correlator
After frequency detection, the data correlation is only performed if the correlator is enabled (R1<1>=1).
The data correlation consists of checking the presence of a preamble (ON/OFF modulated carrier) followed by a certain pattern.
After the frequency detection the correlator waits 16 bits (see bit rate definition in Table 19) and if no preamble is detected the chip is set back to
listening mode and the false-wake-up register (R13<7:0>) is incremented by one.
To get started with the pattern correlation the correlator needs to detect at least 4 bits of the preamble (ON/OFF modulated carrier).
The bit duration is defined in the register R7<4:0> (see Table 19) as function of the Real Time Clock (RTC) periods.
Table 19. Bit Rate Setup
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
Bit Duration in RTC
Clock Periods
Bit Rate (bits/s)
Symbol Rate
(Manchester symbols/s)
0
0
0
1
1
4
8192
4096
0
0
1
0
0
5
6552
3276
0
0
1
0
1
6
5460
2730
0
0
1
1
0
7
4680
2340
0
0
1
1
1
8
4096
2048
0
1
0
0
0
9
3640
1820
0
1
0
0
1
10
3276
1638
0
1
0
1
0
11
2978
1489
0
1
0
1
1
12
2730
1365
0
1
1
0
0
13
2520
1260
0
1
1
0
1
14
2340
1170
0
1
1
1
0
15
2184
1092
0
1
1
1
1
16
2048
1024
1
0
0
0
0
17
1926
963
1
0
0
0
1
18
1820
910
1
0
0
1
0
19
1724
862
1
0
0
1
1
20
1638
819
1
0
1
0
0
21
1560
780
1
0
1
0
1
22
1488
744
1
0
1
1
0
23
1424
712
1
0
1
1
1
24
1364
682
1
1
0
0
0
25
1310
655
1
1
0
0
1
26
1260
630
1
1
0
1
0
27
1212
606
1
1
0
1
1
28
1170
585
1
1
1
0
0
29
1128
564
1
1
1
0
1
30
1092
546
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
Table 19. Bit Rate Setup
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
Bit Duration in RTC
Clock Periods
Bit Rate (bits/s)
Symbol Rate
(Manchester symbols/s)
1
1
1
1
0
31
1056
528
1
1
1
1
1
32
1024
512
If the preamble is detected correctly the correlator keeps searching for a data pattern. The duration of the preamble plus the pattern should not
be longer than 40 bits (see bit rate definition in Table 19). The data pattern can be defined by the user and consists of two bytes which are stored
in the registers R5<7:0> and R6<7:0>. The two bytes define the pattern consisting of 16 half bit periods. This means the pattern and the bit
period can be selected by the user. The only limitation is that the pattern (in combination with preamble) must obey Manchester coding and
timing. It must be noted that according to Manchester coding a down-to-up bit transition represents a symbol "0", while a transition up-to-down
represents a symbol "1". If the default code is used (96 [hex]) the binary code is (10 01 01 10 01 10 10 01). MSB has to be transmitted first.
The user can also select (R1<2>) if single or double data pattern is used for wake-up. In case double pattern detection is set, the same pattern
has to be repeated 2 times.
Additionally, it is possible to set the number of allowed missing zero bits (not symbols) in the received bitstream (R2<6:5>), as shown in the
Table 20.
Table 20. Allowed Pattern Detection Errors
R2<6>
R2<5>
Maximum allowed error in the pattern detection
0
0
No error allowed
0
1
1 missed zero
1
0
2 missed zeros
1
1
3 missed zeros
If the pattern is matched, then the wake-up interrupt is displayed on the WAKE output.
If the pattern detection fails, then the internal wake-up is terminated with no signal sent to MCU and the false wake-up register will be
incremented (R13<7:0>).
The wake-up state is terminated with the direct command ‘clear_wake’ (see Table 12). This command terminates the MCU activity. The
termination can also be automatic in case there is no response from MCU. The time out for automatic termination is set in a register R7<7:5>,
as shown in the Table 21.
Table 21. Timeout Setup
R7<7>
R7<6>
R7<5>
Timeout
0
0
0
0 sec
0
0
1
50 msec
0
1
0
100 msec
0
1
1
150 msec
1
0
0
200 msec
1
0
1
250 msec
1
1
0
300 msec
1
1
1
350 msec
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Datasheet - D e t a i l e d D e s c r i p t i o n
8.6 Wake-up Protocol - Carrier Frequency 125 kHz
8.6.1
Without Pattern Detection
Figure 17. Wake-up Protocol Overview without Pattern Detection (only carrier frequency detection)
Carrier Burst
Data
Carrier Burst > 550 us
DAT
WAKE
Clear_wake
In case the data correlation is disabled (R1<1>=0), the AS3930 wakes up upon detection of the carrier frequency only, as shown in Figure 17. In
order to ensure that AS3930 wakes up, the carrier burst has to last longer than 550 µs. There are two possibilities to set AS3930 back to
listening mode: either the microcontroller sends the direct command clear_wake via SDI, or the time out option is used (R7<7:5>). In case the
latter is chosen, then the AS3930 is automatically set to listening mode after the time defined in T_OUT (R7<7:5>), counting starts at the low-tohigh WAKE edge on the WAKE pin.
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Datasheet - D e t a i l e d D e s c r i p t i o n
8.6.2
Single Pattern Detection
Figure 18 shows the wake-up protocol in case the pattern correlation is enabled (R1<1>=1) for a 125 kHz carrier frequency. The initial carrier
burst has to be longer than 550 µs and can last maximum 16 bits (see bit rate definition in Table 19). If the ON/OFF mode is used (R1<5>=1),
the minimum value of the maximum carrier burst duration is limited to 10 ms. This is summarized in Table 22. In case the carrier burst is too long
the internal wake-up will be set back to low and the false wake-up counter (R13<7:0>) will be incremented by one.
The carrier burst must be followed by a preamble (0101... modulated carrier with a bit duration defined in Table 19) and the wake-up pattern
stored in the registers R5<7:0> and R6<7:0>. The preamble must have at least 4 bits and the preamble duration together with the pattern
should not be longer than 40 bits. If the wake-up pattern is correct the signal on the WAKE pin is set to high and the data transmission can get
started. To set the chip back to listening mode the direct command clear_wake, as well as the time out option (R7<7:5>) can be used.
Figure 18. Wake-up Protocol Overview with Single Pattern Detection
Carrier Burst
Preamble
Pattern
Data
1-bit Preamble
Carrier Burst>360 us
Carrier Burst<16-bit duration
Preamble > 4-bit duration
Preamble + Pattern < 40-bit duration
DAT
WAKE
Clear_wake
Table 22. Preamble Requirements in Standard Mode, Scanning Mode and ON/OFF Mode
Bit Rate (bit/s)
Maximum Duration of the Carrier Burst in Standard
Mode and Scanning Mode (ms)
Maximum Duration of the Carrier Burst in ON/OFF
Mode (ms)
8192
1.95
10
6552
2.44
10
5460
2.93
10
4680
3.41
10
4096
3.90
10
3640
4.39
10
3276
4.88
10
2978
5.37
10
2730
5.86
10
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Datasheet - D e t a i l e d D e s c r i p t i o n
Table 22. Preamble Requirements in Standard Mode, Scanning Mode and ON/OFF Mode
Bit Rate (bit/s)
Maximum Duration of the Carrier Burst in Standard
Mode and Scanning Mode (ms)
Maximum Duration of the Carrier Burst in ON/OFF
Mode (ms)
2520
6.34
10
2340
6.83
10
2184
7.32
10
2048
7.81
10
1926
8.30
10
1820
8.79
10
1724
9.28
10
1638
9.76
10
1560
10.25
10.25
1488
10.75
10.75
1424
11.23
11.23
1364
11.73
11.73
1310
12.21
12.21
1260
12.69
12.69
1212
13.20
13.20
1170
13.67
13.67
1128
14.18
14.18
1092
14.65
14.65
1056
15.15
15.15
1024
15.62
15.62
8.7 False Wake-up Register
The wake-up strategy in the AS3930 is based on 2 steps:
1. Frequency Detection: In this phase, the frequency of the received signal is checked.
2. Pattern Correlation: Here the pattern is demodulated and checked whether it corresponds to the valid one.
If there is a disturber or noise capable to overcome the first step (frequency detection) without producing a valid pattern, then a false wake-up call
happens.Each time this event is recognized a counter is incremented by one and the respective counter value is stored in a memory cell (false
wake-up register). Thus, the microcontroller can periodically look at the false wake-up register, to get a feeling how noisy the surrounding
environment is and can then react accordingly (e.g. reducing the gain of the LNA during frequency detection, set the AS3930 temporarily to
power down etc.), as shown in the Figure 19. The false wake-up counter is a useful tool to quickly adapt the system to any changes in the noise
environment and thus avoid false wake-up events.
Most wake-up receivers have to deal with environments that can rapidly change. By periodically monitoring the number of false wake-up events
it is possible to adapt the system setup to the actual characteristics of the environment and enables a better use of the full flexibility of AS3930.
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Datasheet - D e t a i l e d D e s c r i p t i o n
Figure 19. Concept of False Wake-up Register Together with System
Frequency Detector
Wakeup
Level 1
Wakeup
Level 2
Pattern Correlator
WAKE
Unsuccessful
pattern
correlation
False wakeup
register
CHANGE SETUP TO
MINIMIZE THE FALSE
WAKEUP EVENTS
Register Setup
READ FALSE WAKEUP REGISTER
Microcontroller
8.8 Real Time Clock (RTC)
The RTC can be based on a crystal oscillator (R1<0>=1), the internal RC-oscillator (R1<0>=0) or an external clock source (R1<0>=1). The
crystal has higher precision of the frequency but a higher current consumption and needs three external components (crystal plus two
capacitors). The RC-oscillator is completely integrated and can be calibrated if a reference signal is available for a very short time to improve the
frequency accuracy. The calibration gets started with the trim_osc direct command. Since no non-volatile memory is available the calibration
must be done every time after the RCO was turned off. The RCO is turned off when the chip is in power down mode, a POR happened, or the
crystal oscillator is enabled. Since the RTC defines the time base of the frequency detection, the selected frequency (frequency of the crystal
oscillator or the reference frequency used for calibration of the RC oscillator) should be about one forth of the carrier frequency:
FRTC ~ FCAR * 0.25
(EQ 1)
Where:
FCAR is the carrier frequency
FRTC is the RTC frequency
Note: The third option for the RTC is the use of an external clock source, which must be applied directly to the XIN pin (XOUT floating).
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
8.8.1
Crystal Oscillator
Table 23. Characteristics of XTAL
Parameter
Conditions
Crystal accuracy (initial)
Overall accuracy
Min
Typ
Crystal motional resistance
Max
Units
±120
p.p.m.
60
KΩ
Frequency
32.768
kHz
Contribution of the oscillator to the frequency
error
±5
p.p.m
Start-up Time
Crystal dependent
Duty cycle
1
45
50
Current consumption
8.8.2
s
55
1
%
µA
RC-Oscillator
Table 24. Characteristics of RCO
Parameter
Frequency
Calibration time
Conditions
Min
Typ
Max
Units
If no calibration is performed
27
If calibration is performed
31
32.768
42
kHz
32.768
34.5
kHz
65
cycles
Periods of reference clock
Current consumption
200
nA
To trim the RC-Oscillator, set the chip select (CS) to high before sending the direct command trim_osc over SDI. Then 65 digital clock cycles of
the reference clock (e.g. 32.768 kHz) have to be sent on the clock bus (SCL), as shown in Figure 20. After that the signal on the chip select (CS)
has to be pulled down.
The calibration is effective after the 65th reference clock edge and it will be stored in a volatile memory. In case the RC-oscillator is switched off
or a power-on-reset happens (e.g. battery change), then the calibration has to be repeated.
Figure 20. RC-Oscillator Calibration via SDI
65 clock cycles
CS
SCLK
SDI
X
1
1
0
0
0
0
1
X
0
DIRECT COMMAND
Trim_osc
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REFERENCE CLOCK
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AS3930
Datasheet - D e t a i l e d D e s c r i p t i o n
8.8.3
External Clock Source
To clock the AS3930 with an external signal the crystal oscillator has to be enabled (R1<0>=1). As shown in Figure 3, the clock must be applied
on the pin XIN while the pin XOUT must stay floating. The RC time constant has to be 100μs with a tolerance of ±10% (e.g. R=680 kΩ and
C=22pF). In Table 25, the clock characteristics are summarized.
Table 25. Characteristics of External Clock
Symbol
Parameter
Min
VI
Low level
Vh
High level
Tr
Max
Units
0
0.1*VDD
V
0.9*VDD
VDD
V
Rise-time
3
µs
Tf
Fall-time
3
µs
T=1/2πRC
RC Time constant
110
µs
90
Typ
100
Note: In power down mode the external clock has to be set to VDD.
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AS3930
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
9 Package Drawings and Markings
The product is available in a 16-pin TSSOP and QFN 4x4 16 LD package.
Figure 21. 16-pin TSSOP Package
AS3930 @
YYWWMZZ
Symbol
A
A1
A2
b
c
D
E
E1
e
L
L1
Min
0.05
0.80
0.19
0.09
4.90
4.30
0.45
-
Nom
1.00
5.00
6.40 BSC
4.40
0.65 BSC
0.60
1.00 REF
Max
1.20
0.15
1.05
0.30
0.20
5.10
4.50
0.75
-
Symbol
R
R1
S
Θ1
Θ2
Θ3
aaa
bbb
ccc
ddd
N
Min
0.09
0.09
0.20
0º
-
Nom
12 REF
12 REF
0.10
0.10
0.05
0.20
16
Max
8º
-
Notes:
1. Dimensioning & tolerancing conform
to ASME Y14.5M-1994.
2. All dimensions are in millimeters.
Angles are in degrees.
Marking: YYWWMZZ.
YY
WW
M
ZZ
@
Year (i.e. 10 for 2010)
Manufacturing Week
Assembly plant identifier
Assembly traceability code
Sublot identifier
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AS3930
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 22. QFN 4x4 16 LD Package
AS3930 @
YYWWXZZ
Notes:
1. Dimensioning & tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
3. Dimension b applies to metallized terminal and is measured between 0.25mm and
0.30mm from terminal tip. Dimension L1 represents terminal full back from
package edge up to 0.15mm is acceptable.
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
6. N is the total number of terminals.
Symbol
A
A1
A3
L
L1
b
D
E
e
D2
E2
aaa
bbb
ccc
ddd
eee
fff
N
Min
0.80
0
0.35
0
0.25
2.60
2.60
-
Nom
0.90
0.02
0.20 REF
0.40
0.30
4.00 BSC
4.00 BSC
0.65 BSC
2.70
2.70
0.15
0.10
0.10
0.05
0.08
0.10
16
Max
1.00
0.05
0.45
0.15
0.35
2.80
2.80
-
Marking: YYWWXZZ.
YY
WW
X
ZZ
@
Year (i.e. 10 for 2010)
Manufacturing Week
Assembly plant identifier
Assembly traceability code
Sublot identifier
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AS3930
Datasheet - R e v i s i o n H i s t o r y
Revision History
Revision
Date
Owner
Description
1.0
10 Jul, 2009
rlc
Initial draft
1.2
08 Apr, 2010
mrh
Updated the footer link,
Updated the figure title in Figure 10,
Added new information SDI Timing 8.2.3
Updated General Description, Key Features, Figure 1, Figure 2, Figure 3,
Figure 11, ON/OFF Mode (Low Power Mode), Data Receiving, Table 7, Table
8, Revision History, Ordering Information, JEDEC standard in Absolute
Maximum Ratings.
03 Nov, 2010
1.3
08 Dec, 2010
1.4
1.5
rlc
Updated Package Drawings and Markings and footnote in Ordering
Information.
25 May, 2011
Updated Key Features, Package Drawings and Markings, Ordering
Information.
08 Jun, 2011
Updated IPWD in Table 5; registers R11, R12 in Table 6 and Table 7.
04 Feb, 2013
jry
Corrected data inconsistencies across the datasheet.
Note: Typos may not be explicitly mentioned under revision history.
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AS3930
Datasheet - O r d e r i n g I n f o r m a t i o n
10 Ordering Information
Table 26. Ordering Information
1
Ordering Code
Type
Marking
Delivery Form
Delivery Quantity
AS3930-BTST
16-pin TSSOP
AS3930
7 inches Tape & Reel
1000 pcs
AS3930-BQFT
QFN 4x4 16 LD
AS3930
7 inches Tape & Reel
1000 pcs
1. Dry Pack: Moisture Sensitivity Level (MSL) = 3, according to IPC/JEDEC J-STD-033A.
Note: All products are RoHS compliant and ams green.
Buy our products or get free samples online at www.ams.com/ICdirect
Technical Support is available at www.ams.com/Technical-Support
For further information and requests, email us at [email protected]
(or) find your local distributor at www.ams.com/distributor
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AS3930
Datasheet - C o p y r i g h t s
Copyrights
Copyright © 1997-2013, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights
reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no
warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing
by ams AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by ams AG is believed to be correct and accurate. However, ams AG shall not be liable to recipient or any third
party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other
services.
Contact Information
Headquarters
ams AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel
Fax
: +43 (0) 3136 500 0
: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.ams.com/contact
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