AP9952GP-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Simple Drive Requirement D ▼ Lower On-resistance ▼ Fast Switching Characteristic ▼ RoHS Compliant & Halogen-Free BVDSS 70V RDS(ON) 12mΩ ID G 68A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. G D TO-220(P) S The TO-220 package is widely preferred for commercial-industrial through-hole applications. Absolute Maximum Ratings Parameter Symbol Rating Units VDS Drain-Source Voltage 70 V VGS Gate-Source Voltage +20 V ID@TC=25℃ Continuous Drain Current, V GS @ 10V 68 A ID@TC=100℃ Continuous Drain Current, V GS @ 10V 43 A 200 A 104 W 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Rthj-c Maximum Thermal Resistance, Junction-case Rthj-a Maixmum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice Value Units 1.2 ℃/W 62 ℃/W 1 201002231 AP9952GP-HF o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 70 - - V RDS(ON) Static Drain-Source On-Resistance 2 VGS=10V, ID=30A - - 12 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=30A - 36 - S IDSS Drain-Source Leakage Current VDS=56V, VGS=0V - - 25 uA IGSS Gate-Source Leakage VGS= +20V, VDS=0V - - +100 nA ID=30A - 35 56 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=56V - 8 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 16 - nC 2 td(on) Turn-on Delay Time VDS=35V - 10.5 - ns tr Rise Time ID=30A - 50 - ns td(off) Turn-off Delay Time RG=1Ω - 21 - ns tf Fall Time VGS=10V - 8.5 - ns Ciss Input Capacitance VGS=0V - 1630 2600 pF Coss Output Capacitance VDS=25V - 260 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 150 - pF Rg Gate Resistance f=1.0MHz - 2 - Ω Min. Typ. IS=30A, VGS=0V - - 1.3 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 2 2 Test Conditions Max. Units trr Reverse Recovery Time IS=10A, VGS=0V - 33 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 43 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9952GP-HF 200 120 10V 8.0V 7.0V o 10V 8.0V o T C = 25 C T C = 150 C 100 ID , Drain Current (A) ID , Drain Current (A) 160 7.0V 120 6.0V 80 80 6.0V 60 40 V GS =5.0V V GS =5.0V 40 20 0 0 0 4 8 12 16 20 0 24 2 4 6 8 10 12 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.2 2.4 I D =30A V G =10V Normalized RDS(ON) Normalized BVDSS (V) 2.0 1.1 1 1.6 1.2 0.9 0.8 0.4 0.8 -50 0 50 100 -50 150 0 50 100 150 T j , Junction Temperature ( o C) T j , Junction Temperature ( o C) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 1.6 Normalized VGS(th) (V) 30 IS(A) 20 T j =150 o C T j =25 o C 10 1.2 0.8 0.4 0 0.0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9952GP-HF f=1.0MHz 2400 I D = 30 A V DS =56V 10 2000 8 1600 C (pF) VGS , Gate to Source Voltage (V) 12 6 C iss 1200 4 800 2 400 C oxx C rss 0 0 0 10 20 30 1 40 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 Operation in this area limited by RDS(ON) ID (A) 100 100us 10 1ms 10ms 100ms DC o T c =25 C Single Pulse 1 Normalized Thermal Response (Rthjc) 1000 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 1 10 100 0.00001 0.0001 0.001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.01 0.1 1 10 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4