ASB ALN1922

plerowTM ALN1922
Internally Matched LNA Module
Features
Description
· S21 = 30.4 dB@1850 MHz
= 29.6 dB@1995 MHz
· NF of 0.65 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 °C, Vs = 5 V, Freq. = 1922.5 MHz, Zo.sys = 50 ohms
Parameter
Unit
Frequency Range
Min
MHz
1850
Gain
dB
29.0
Gain Flatness
dB
Noise Figure
Typ
dBm
S11/S22
30.0
37.5
±0.4
±0.5
0.65
0.7
dBm
Switching Time
(3)
More Information
Website: www.asb.co.kr
E-mail: [email protected]
39
dB
Output P1dB
Max
1995
dB
Output IP3
2-stage Single Type
Specifications
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-18/-9
20
21
msec
-
Supply Current
mA
170
Supply Voltage
V
5
Impedance
W
50
200
Max. RF Input Power
dBm
C.W 29~31 (before fail)
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
plerow
ALN1922
ASB Inc.
(Top View)
(Bottom View)
Pin Number
Function
3
RF In
8
RF Out
10
Vs
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Solder Stencil Area
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/4
www.asb.co.kr
February 2011
plerowTM ALN1922
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
1850~1995 MHz
+5 V
Noise Figure
S-parameters & K Factor
OIP3
2/4
P1dB
www.asb.co.kr
February 2011
plerowTM ALN1922
Internally Matched LNA Module
RF Performance with Voltage Change
1. S-parameter
1850 MHz
1922.5 MHz
1995 MHz
S21 (dB)
S11 (dB)
S22 (dB)
S21 (dB)
G/F (dB)
S11 (dB)
S22 (dB)
S21 (dB)
S11 (dB)
S22 (dB)
4.50 V
30.21
-21.04
-12.28
29.82
0.71
-18.85
-12.54
29.50
-18.76
-11.51
4.75 V
30.27
-21.68
-12.34
29.87
0.72
-19.38
-12.57
29.55
-19.37
-11.55
5.00 V
30.37
-22.55
-12.57
30.02
0.73
-20.11
-12.70
29.64
-20.26
-11.68
5.25 V
30.34
-22.90
-12.38
29.94
0.73
-20.41
-12.52
29.61
-20.55
-11.51
5.50 V
30.33
-23.57
-12.29
29.92
0.73
-20.90
-12.46
29.60
-21.08
-11.45
2. OIP3, P1dB & NF
1850 MHz
1922.5 MHz
1995 MHz
OIP3 (dBm)
P1dB (dBm)
NF (dB)
OIP3 (dBm)
P1dB (dBm)
NF (dB)
OIP3 (dBm)
P1dB (dBm)
NF (dB)
4.50 V
38.62
19.18
0.564
38.75
18.90
0.565
39.20
18.55
0.621
4.75 V
39.10
19.98
0.607
39.24
19.15
0.591
39.45
19.80
0.634
5.00 V
39.50
21.35
0.610
39.78
21.22
0.619
39.85
21.05
0.649
5.25 V
38.44
21.67
0.647
38.84
21.50
0.659
38.98
22.10
0.691
5.50 V
38.21
22.70
0.697
38.45
21.96
0.679
38.76
22.42
0.720
Note: tested at room temperature.
RF Performance with Operating Temperature
1. S-parameter
1850 MHz
1922.5 MHz
1995 MHz
S21 (dB)
S11 (dB)
S22 (dB)
S21 (dB)
G/F (dB)
S11 (dB)
S22 (dB)
S21 (dB)
S11 (dB)
S22 (dB)
-45 °C
30.58
-24.18
-14.91
30.28
0.72
-26.24
-13.39
29.86
-24.46
-12.66
-10 °C
30.54
-22.89
-13.68
30.20
0.75
-23.88
-12.51
29.79
-22.12
-12.14
25 °C
30.38
-21.54
-12.89
30.01
0.71
-21.66
-11.86
29.67
-20.17
-11.65
60 °C
30.13
-20.65
-11.94
29.78
0.75
-20.52
-11.00
29.38
-19.15
-11.03
85 °C
29.97
-20.00
-11.17
29.63
0.74
-19.74
-10.32
29.23
-18.35
-10.47
2. OIP3, P1dB & NF
1850 MHz
1922.5 MHz
1995 MHz
OIP3 (dBm)
P1dB (dBm)
NF (dB)
OIP3 (dBm)
P1dB (dBm)
NF (dB)
OIP3 (dBm)
P1dB (dBm)
NF (dB)
-45 °C
39.25
21.19
0.375
39.20
20.84
0.381
39.48
21.29
0.408
-10 °C
39.40
21.25
0.468
39.80
20.94
0.475
39.65
21.40
0.488
25 °C
39.65
21.48
0.623
39.91
21.13
0.629
40.02
21.43
0.645
60 °C
39.35
20.85
0.801
39.64
20.62
0.813
39.73
20.95
0.823
85 °C
39.04
20.68
0.976
39.25
20.45
0.984
39.40
20.75
0.991
Note: tested at Vs= 5V.
3/4
www.asb.co.kr
February 2011
plerowTM ALN1922
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
ALN
IN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2)
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
20~40 sec
260 °C
Ramp-up
(3 °C/sec)
200 °C
Ramp-down
(6 °C/sec)
OUT
IN
150 °C
Size 25x25mm
(for ALN Series – 13x13mm)
60~180 sec
4/4
www.asb.co.kr
February 2011