plerowTM ALN1922 Internally Matched LNA Module Features Description · S21 = 30.4 dB@1850 MHz = 29.6 dB@1995 MHz · NF of 0.65 dB over Frequency · Unconditionally Stable · Single 5 V Supply · High OIP3@Low Current The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ.@T = 25 °C, Vs = 5 V, Freq. = 1922.5 MHz, Zo.sys = 50 ohms Parameter Unit Frequency Range Min MHz 1850 Gain dB 29.0 Gain Flatness dB Noise Figure Typ dBm S11/S22 30.0 37.5 ±0.4 ±0.5 0.65 0.7 dBm Switching Time (3) More Information Website: www.asb.co.kr E-mail: [email protected] 39 dB Output P1dB Max 1995 dB Output IP3 2-stage Single Type Specifications Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -18/-9 20 21 msec - Supply Current mA 170 Supply Voltage V 5 Impedance W 50 200 Max. RF Input Power dBm C.W 29~31 (before fail) Package Type & Size mm Surface Mount Type, 13Wx13Lx3.8H Operating temperature is -40°C to +85°C. 1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow ALN1922 ASB Inc. (Top View) (Bottom View) Pin Number Function 3 RF In 8 RF Out 10 Vs Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Solder Stencil Area (Side View) Ø0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr February 2011 plerowTM ALN1922 Internally Matched LNA Module S-parameters Typical Performance (Measured) 1850~1995 MHz +5 V Noise Figure S-parameters & K Factor OIP3 2/4 P1dB www.asb.co.kr February 2011 plerowTM ALN1922 Internally Matched LNA Module RF Performance with Voltage Change 1. S-parameter 1850 MHz 1922.5 MHz 1995 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) 4.50 V 30.21 -21.04 -12.28 29.82 0.71 -18.85 -12.54 29.50 -18.76 -11.51 4.75 V 30.27 -21.68 -12.34 29.87 0.72 -19.38 -12.57 29.55 -19.37 -11.55 5.00 V 30.37 -22.55 -12.57 30.02 0.73 -20.11 -12.70 29.64 -20.26 -11.68 5.25 V 30.34 -22.90 -12.38 29.94 0.73 -20.41 -12.52 29.61 -20.55 -11.51 5.50 V 30.33 -23.57 -12.29 29.92 0.73 -20.90 -12.46 29.60 -21.08 -11.45 2. OIP3, P1dB & NF 1850 MHz 1922.5 MHz 1995 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) 4.50 V 38.62 19.18 0.564 38.75 18.90 0.565 39.20 18.55 0.621 4.75 V 39.10 19.98 0.607 39.24 19.15 0.591 39.45 19.80 0.634 5.00 V 39.50 21.35 0.610 39.78 21.22 0.619 39.85 21.05 0.649 5.25 V 38.44 21.67 0.647 38.84 21.50 0.659 38.98 22.10 0.691 5.50 V 38.21 22.70 0.697 38.45 21.96 0.679 38.76 22.42 0.720 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 1850 MHz 1922.5 MHz 1995 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) -45 °C 30.58 -24.18 -14.91 30.28 0.72 -26.24 -13.39 29.86 -24.46 -12.66 -10 °C 30.54 -22.89 -13.68 30.20 0.75 -23.88 -12.51 29.79 -22.12 -12.14 25 °C 30.38 -21.54 -12.89 30.01 0.71 -21.66 -11.86 29.67 -20.17 -11.65 60 °C 30.13 -20.65 -11.94 29.78 0.75 -20.52 -11.00 29.38 -19.15 -11.03 85 °C 29.97 -20.00 -11.17 29.63 0.74 -19.74 -10.32 29.23 -18.35 -10.47 2. OIP3, P1dB & NF 1850 MHz 1922.5 MHz 1995 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) -45 °C 39.25 21.19 0.375 39.20 20.84 0.381 39.48 21.29 0.408 -10 °C 39.40 21.25 0.468 39.80 20.94 0.475 39.65 21.40 0.488 25 °C 39.65 21.48 0.623 39.91 21.13 0.629 40.02 21.43 0.645 60 °C 39.35 20.85 0.801 39.64 20.62 0.813 39.73 20.95 0.823 85 °C 39.04 20.68 0.976 39.25 20.45 0.984 39.40 20.75 0.991 Note: tested at Vs= 5V. 3/4 www.asb.co.kr February 2011 plerowTM ALN1922 Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 ALN IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout Vs 20~40 sec 260 °C Ramp-up (3 °C/sec) 200 °C Ramp-down (6 °C/sec) OUT IN 150 °C Size 25x25mm (for ALN Series – 13x13mm) 60~180 sec 4/4 www.asb.co.kr February 2011