COMCHIP CDBZ0130L-HF

Low VF SMD Schottky Barrier Diode
CDBZ0130L-HF
Io = 100 mA
VR = 30 Volts
RoHS Device
Halogen Free
0201/DFN0603
0.026(0.670)
0.022(0.570)
Features
- Low forward Voltage.
0.015(0.370)
0.011(0.270)
- Ultra small mold type.
Mechanical data
- Case: 0201/DFN0603 package,
molded plastic.
0.013(0.335)
0.010(0.265)
- Terminals: Gold plated, solderable per MIL-STD-750,
method 2026.
0.012(0.285)
0.008(0.215)
0.007(0.175)
0.004(0.105)
- Polarity: Color band denotes cathode end.
- Mounting position: Any
0.011(0.285)
0.008(0.215)
Circuit diagram
Dimensions in inches and (millimeter)
Maximum Rating (at TA=25 ºC unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Reverse voltage
VR
30
V
Average rectified forward current
IO
100
mA
IFSM
500
mA
TJ
+125
O
+125
O
Forward current,surge peak
(60Hz*1cycle)
8.3 ms single half sine-wave superimposed
on rate load(JEDEC method)
Junction temperature
Storage temperature
TSTG
-40
C
C
Electrical Characteristics (at TA=25 ºC unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Forward voltage
IF = 10 mA
VF
-
-
0.37
V
Reverse current
VR = 10 V
IR
-
-
7
µA
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 1
QW-JB039
Comchip Technology CO., LTD.
Low VF SMD Schottky Barrier Diode
RATING AND CHARACTERISTIC CURVES (CDBZ0130L-HF)
Fig.1 - Forward Characteristics
Fig.2 - Reverse Characteristics
10,000
Reverse Current, ( uA )
Forward Current, (mA )
100
125°C
100°C
10
75°C
25°C
50°C
1
0
O
125 C
O
100 C
100
O
75 C
O
10
50 C
O
25 C
1
0.1
0
100
200
300
400
500
600
0
5
10
15
20
30
25
Forward Voltage, (mV)
Reverse Voltage, (V)
Fig.3 - Capacitance Between
Terminals Characteristics
Fig.4 - Current Derating Curve
12
f = 1 MHz
Ta = 25°C
9
7
5
3
Average Forward Current, (%)
Capacitance Between Terminals, ( P F)
1,000
100
80
60
40
20
0
1
0
5
10
15
20
25
30
0
25
50
75
100
125
O
Ambient Temperature, ( C)
Reverse Voltage, (V)
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 2
QW-JB039
Comchip Technology CO., LTD.
Low VF SMD Schottky Barrier Diode
Reel Taping Specification
d
P0
P1
T
E
F
W
B
A
C
P
12
o
0
D2
D1 D
W1
Trailer
Device
.......
.......
End
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
0201
(DFN0603)
0201
(DFN0603)
SYMBOL
A
B
C
d
D
D1
D2
(mm)
0.39 +0.03/-0.02
0.72 ± 0.03
0.36 ± 0.03
1.50 + 0.10
178 ± 1.00
54.4 ± 0.40
13.0 ± 0.20
(inch)
0.015 +0.001/0.001
0.028 ± 0.001
0.014 ± 0.001
0.059 + 0.004
7.008 ± 0.039
2.142 ± 0.016
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
T
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
2.00 ± 0.05
4.00 ± 0.05
2.00 ± 0.05
0.23 ± 0.05
8.00 ± 0.10
12.30 ± 0.10
(inch)
0.069 ± 0.004 0.138 ± 0.002 0.079 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.009 ± 0.002 0.315 ± 0.008 0.484 ± 0.004
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 3
QW-JB039
Comchip Technology CO., LTD.
Low VF SMD Schottky Barrier Diode
Marking Code
Part Number
Marking Code
CDBZ0130L-HF
L
L
Suggested PAD Layout
0201(DFN0603)
SIZE
(mm)
(inch)
A
0.310
0.122
B
0.200
0.079
C
0.350
0.014
D
0.150
0.006
E
0.365
0.014
E
D
C
A
B
Standard Packaging
Case Type
0201(DFN0603)
Qty Per Reel
Reel Size
(Pcs)
(inch)
8,000
7
Company reserves the right to improve product design , functions and reliability without notice.
QW-JB039
REV: B
Page 4