application INFO available UC1706 UC2706 UC3706 Dual Output Driver FEATURES DESCRIPTION • Dual, 1.5A Totem Pole Outputs • 40nsec Rise and Fall into 1000pF • Parallel or Push-Pull Operation The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below. • Single-Ended to Push-Pull Conversion • High-Speed, Power MOSFET Compatible • Low Cross-Conduction Current Spike • Analog, Latched Shutdown • Internal Deadband Inhibit Circuit • Low Quiescent Current • 5 to 40V Operation • Thermal Shutdown Protection • 16-Pin Dual-In-Line Package These devices are available in a two-watt plastic “bat-wing” DIP for operation over a 0°C to 70°C temperature range and, with reduced power, in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages. • 20-Pin Surface Mount Package TRUTH TABLE First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each. Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulsesuppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability. Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown. INV H L H L BLOCK DIAGRAM SLUS200A - OCTOBER 1998 - REVISED APRIL 2001 N.I H H L L OUT L H L L OUT = INV and N.I. OUT = INV or N.I. UC1706 UC2706 UC3706 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg . . . . . . . . . . . . . . . J--Pkg Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V Output Current (Each Output, Source or Sink) Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . ±500mA Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5A. . . . . . . . . . . . . . . . . ±1.0A Capacitive Discharge Energy . . . . . . . . . . . . . . . 20µJ . . . . . . . . . . . . . . . . . . . 15µJ Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V . . . . . . . . . . . . . . . . . 5.5V Analog Stop Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . VIN . . . . . . . . . . . . . . . . . . . . VIN Power Dissipation at TA = 25°C (See Note) . . . . . . . 2W . . . . . . . . . . . . . . . . . . 1W Power Dissipation at T (Leads/Case) = 25°C . . . . . . 5W . . . . . . . . . . . . . . . . . . . 2 (See Note) Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . --55°C to +125°C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . --65°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . 300°C Note: All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the specified trerminal. Consult Packaging sections of the Databook for thermal limitations and considerations of package. CONNECTION DIAGRAMS DIL-16, SOIC-16 (TOP VIEW) J or N Package, DW Package PLCC-20, LCC-20 (TOP VIEW) Q, L Packages N/C B INHIBIT 1 16 A INHIBIT INV. INPUT 2 15 INHIBIT REF N.I. INPUT 3 14 VIN GROUND 4 13 GROUND GROUND 5 12 GROUND 6 A OUTPUT 11 B INHIBIT INV INPUT A INHIBIT INHIBIT REF 3 B OUTPUT 7 VC 8 10 9 STOP NON-INV. 1 20 19 N.I.INPUT 4 18 VIN GROUND 5 17 GROUND N/C 6 16 N/C GROUND 7 15 GROUND A OUTPUT 8 14 B OUTPUT 9 FLIP/FLOP 2 10 11 12 13 FLIP/FLOP STOP INV. STOP NON-INV. VC STOP INV. N/C Note: All four ground pins must be connected to a common ground. ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ. PARAMETERS TEST CONDITIONS VIN Supply Current VIN = 40V VC Supply Current VC = 40V, Outputs Low VC Leakage Current VIN = 0, VC = 30V, No Load MIN TYP MAX UNITS 8 10 mA 4 5 mA .05 0.1 mA 0.8 V Digital Input Low Level Digital Input High Level 2.2 V Input Current VI = 0 –0.6 –1.0 mA Input Leakage VI = 5V .05 0.1 mA 2 UC1706 UC2706 UC3706 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ. PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS Output High Sat., VC-VO IO = -50mA 2.0 V Output Low Sat., VO IO = 50mA 0.4 V IO = 500mA 2.5 V Inhibit Threshold VREF = 0.5V 0.4 0.6 V VREF = 3.5V 3.3 3.7 V Inhibit Input Current VREF = 0 Analog Threshold VCM = 0 to 15V, for the UC2706 and UC3706 100 VCM = 0 to 15V, for the UC1706 80 Input Bias Current VCM = 0 Thermal Shutdown –10 –20 µA 130 160 mV 130 160 mV –10 –20 µA 155 °C TYPICAL SWITCHING CHARACTERISTICS: VIN = VC = 20V, TA = 25°C. Delays measured to 10% output change. PARAMETERS TEST CONDITIONS OUTPUT CL = UNITS open 1.0 2.2 Rise Time Delay 110 130 140 ns 10% to 90% Rise 20 40 60 ns Fall Time Delay 80 90 110 ns 90% to 10% Fall 25 30 50 ns 120 130 140 ns From Inv. Input to Output: nF From N. I. Input to Output: Rise Time Delay 10% to 90% Rise 20 40 60 ns Fall Time Delay 100 120 130 ns 90% to 10% Fall 25 30 50 ns VC Cross-Conduction Current Spike Duration Output Rise 25 ns 0 ns Inhibit Delay Output Fall Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V 250 ns Analog Shutdown Delay Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V 180 ns CIRCUIT DESCRIPTION Outputs The totem-pole outputs have been designed to minimize cross-conduction current spikes while maximizing fast, high-current rise and fall times. Current limiting can be done externally either at the outputs or at the common VC pin. The output diodes included have slow recovery and should be shunted with high-speed external diodes when driving high-frequency inductive loads. Flip/Flop Grounding pin 7 activates the internal flip-flop to alternate the two outputs. With pin 7 open, the two outputs operate simultaneously and can be paralleled for higher current operation. Since the flip-flop is triggered by the digital input, an off-time of at last 200nsec must be provided to allow the flip/flop to change states. Note that the circuit logic is configured such that the “OFF” state is defined as the outputs low. Digital Inputs With both an inverting and non-inverting input available, either active-high or active-low signals may be accepted. These are true TTL compatible inputs—the threshold is approximately 1.2V with no hysteresis; and external pullup resistors are not required. Inhibit Circuit Although it may have other uses, this circuit is included to eliminate the need for deadband control when driving relatively slow bipolar power transistors. A diode from each inhibit input to the opposite power switch collector will keep one output from turning-on until the other has turned-off. The threshold is determined by the voltage on pin 15 which can be set from 0.5 to 3.5V. When this circuit is not used, ground pin 15 and leave 1 and 16 open. 3 UC1706 UC2706 UC3706 CIRCUIT DESCRIPTION (cont.) use with a 7 to 40V supply; however, with some slight response time degradation, it can also be driven from 5V. When VIN is low, the entire circuit is disabled and no current is drawn from VC. When combined with a UC1840 PWM, the Driver Bias switch can be used to supply VIN to the UC1706. VIN switching should be fast as if VC is high, undefined operation of the outputs may occur with VIN less than 5V. Analog Shutdown This circuit is included to get a latched shutdown as close to the outputs as possible, from a time standpoint. With an internal 130mV threshold, this comparator has a common-mode range from ground to (VIN – 3V). When not used, both inputs should be grounded. The time required for this circuit to latch is inversely proportional to the amount of overdrive but reaches a minimum of 180nsec. As with the flip-flop, an input off-time of at least 200nsec is required to reset the latch between pulses. Thermal Considerations Should the chip temperature reach approximately 155°C, a parallel, non--inverting input is activated driving both outputs to the low state. Supply Voltage With an internal 5V regulator, this circuit is optimized for APPLICATIONS D1, D2; UC3611 Schottky Diodes D1, D2; UC3611 Schottky Diodes Power MOSFET Drive Circuit Power MOSFET Drive Circuit Using Negative Bias Voltage and Level Shifting to Ground Referenced PWMs D1, D2: UC3611 Schottky Diodes Transformer Coupled MOSFET Drive Circuit 4 Charge Pump Circuits UC1706 UC2706 UC3706 APPLICATIONS (cont'd) D1, D2: UC3611 Schottky Diodes D1, D2: UC3611 Schottky Diodes Power Bipolar Drive Circuit Transformer Coupled Push-Pull MOSFET Drive Circuit UC3706 Converts Single Output PWMs to High Current Push-Pull Configuration UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 • FAX (603) 424-3460 5 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-89611012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596289611012A 5962-8961101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8961101EA UC1706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1706J UC1706J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1706J/883B UC1706L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1706L UC2706DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2706DW UC2706DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2706DW UC2706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2706J UC2706N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2706N UC2706NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2706N UC3706DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW UC3706DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW UC3706DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW UC3706DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW UC3706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 0 to 70 UC3706J UC3706N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3706N UC3706NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3706N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF UC1706, UC2706, UC2706M, UC3706, UC3706M : • Catalog: UC3706, UC2706, UC3706M, UC3706 • Military: UC2706M, UC1706, UC1706 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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