Si2493/57/34/15/04 Global ISOmodem-EVB Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 ISOmodem with UART and SPI Interfaces Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a complete removable modem module on a daughter card. (A functional block diagram of the Si2493/57/34/15/04-EVB is shown below.) The Si2493/57/34/15/04 ISOmodem is a complete controller-based modem chipset with an integrated and programmable direct access arrangement (DAA) that meets global telephone line requirements. Available as a combination of one 16-pin small line-side device and one 24-pin or 16-pin systemside device, the Si2493/57/34/15/04 ISOmodem eliminates the need for a separate DSP data pump, modem controller, memories, codec, isolation transformer, relays, opto-isolators, and a 2- to 4-wire hybrid. The Si2493/57/34/15/04 is ideal for embedded modem applications due to its small board area, controller-based architecture, low power consumption, and global compliance. The Si2493/57/34/15/04-EVB provides an RJ-11 jack (for interfacing the Si2493/57/ 34/15/04-EVB to the phone line), and USB and RS232 serial ports for interfacing to a PC or data terminal. This allows the ISOmodem to operate as a serial modem for straightforward evaluation of the Si2493/57/34/15/04. To evaluate the Si2493/57/34/15/04 ISOmodem in an embedded system, the daughter card can be used independently of or with the motherboard. A direct access header (J103) is available on the motherboard to bypass the RS-232 transceivers and connect the Si2493/57/34/15/04 ISOmodem directly to a target system. An on-board rectifier, filter, and voltage regulator allow the power input to be 7.5–13 V ac or dc (either polarity) supplied through a screw terminal (J8) or a standard 2 mm power jack (J9). Alternatively, power can be supplied through the USB interface (whether the USB or RS232 interface is used). The evaluation board can drive an external speaker for call monitoring or the speaker mounted directly on the board. Please note that the PCM interface, parallel interface, and EEPROM are available on the 24-pin FT only. See "1.7.EVB Part Numbers" on page 8 for ISOmodem EVB options. Features The Si2493/57/34/15/04-EVB includes the following: Dual RJ-11 connection to phone line RS-232 and USB interface to PC Speaker for call monitoring Direct access to Si2493/57/34/15/04 for embedded application evaluation Easy power connection to common 7.5 V–13.5 V power supplies or USB port. 9 V ac adaptor Simple installation and operation EEPROM (24-pin FT only) RS232 lines status display on LEDs. Functional Block Diagram Audio Out 7.5-13.5 V dc or peak ac Adaptor Rectifier Filter Audio Amplifier Voltage Regulator 3.3 V Direct Access HDR Daughter Board Boundary 5V USB Connector UART USB I/F DB9 RS-232 Transceivers Interface Selection Jumpers Phone line AOUT Si2493/57/34/15/04 RESET XTALO Si3018* Interface Circuit RJ-11 XTALI Push Button Reset Power-On Reset Rev. 0.7 4/11 *Si3010 for Si2404 Copyright © 2011 by Silicon Laboratories Si2493/57/34/15/04-EVB Si2493/57/34/15/04 Global ISOmodem-EVB 1. Si2493/57/34/15/04-EVB Setup and 1.3. Motherboard and Daughter Card Configuration Evaluation This section explains how to set up the Si2493/57/34/ 15/04-EVB for evaluation as an RS-232 or USB interface modem. Jumper settings, power connection, PC/terminal connections, and terminal program configuration settings are given. The initial modem setup after power is applied as well as a basic tutorial on modem operation are provided. Si2493/57/34/15/04EVB configurations for evaluating additional features are discussed separately. See the Si2493/57/34/15 or Si2404 data sheets and “AN93: Si2493/57/34/15/04/04 Modem Designer’s Guide” for complete details. 1.1. Si2493/57/34/15/04-EVB Quick Start— RS-232 Interface 1. Set jumpers according to Figure 1, but change J6 to the arrangement shown in Figure 3 if an FS ISOmodem package is used. 2. Connect: DB-9 to PC COM 1 (with a pass-through cable). to phone line or CO simulator. 9 V ac adaptor (or USB cable). 3. Bring up: RJ-11 Turn on power to modem. automatically adjusts modem DTE speed and protocol. 4. Type “AT” followed by a carriage return. Autobaud Should echo “AT” and then an “OK”. The EVB consist of a motherboard that takes a plug in daughter card. The motherboard can be configured in a variety of ways that are explained below and are managed via jumpers. The daughter card contains both the modem system side and the isolated line interface (DAA). The daughter card comes preconfigured and functional although the user may decide to change some operating options such as the type of crystal used with the modem chip or the type of control signals used, i.e. UART vs parallel. These features must be managed by changing strapping resistors soldered down to the daughter card and by changing parts associated with the crystal. These possible changes are explained below. 1.3.1. Motherboard Configuration Check all the jumper setting on the S2493/57/34/15/04EVB before applying power. The standard factory setting for the modem in a 24-pin FT package are shown in the figure below. This setup configures the modem for RS232 serial operation with autobaud enabled. Any standard terminal program configured to communicate through a PC com port can be used to communicate with the EVB. Figure 1 shows the default motherboard setup for the FT package daughter card as well as the functions of connectors and jumpers. 1.2. Si2493/57/34/15/04-EVB Quick Start— USB Interface 1. Set jumpers according to Figure 3, but change J6 to the arrangement shown in Figure 3 if an FS ISOmodem package is used. 2. Connect: USB cable to PC to phone line or CO simulator 3. Download USB driver for your operating system from the CD supplied with the evaluation board. RJ-11 4. Install driver. 5. Bring up. Reset the modem. automatically adjusts modem DTE speed and Autobaud protocol. 6. Type “AT” followed by a carriage return. Should 2 echo “AT” and then an “OK”. Rev. 0.7 Rev. 0.7 LEDs and test points showing status of all control lines as well as TX/RX RS232 com port link to Host RS232 vs USB select jumper, JP23, with RS232 select shown. (Remove to disable both modes). USB, virtual com port link to Host (J11) Audio Power amp (U27) (Daughter card versions prior to rev. 2.0 will not fit this motherboard.) Modem daughter cards mate with J101 & JP2. Remove JP12 Jumper to shut down audio power amp U27 Tests points (+3.3V and Isense) that allow modem current o tbe measured via the 1.0 Ohm shunt: R59. Insert jumper in JP34 to run at a fixed 19.2 kBaud rate. Figure 1. Default Motherboard Setup Reset Pushbutton Insert JP33 & JP34 jumpers to enable EEPROM EEPROM (U5) System Connector. Allows all modem signals to be probed or routed elsewhere. J6: Jumpers for control line configuration. Shown set up for a 24 pin modem on DC. Tip and ring signals available at these test points. RJ11 Tel. Line connectors. Speaker Output, JP11 AC/DC Pwr Inputs: J8 or J9. Call progress Speaker, and its jumper JP14. Si2493/57/34/15/04 Global ISOmodem-EVB 3 Si2493/57/34/15/04 Global ISOmodem-EVB 1.3.1.1. RS232 vs USB vs User Provided IO Selection To change to USB operation simply move the RS232 selection jumper on JP23 to the USB position as marked on the PCB and shown in Figure 1. When the USB vs UART settings are changed the appropriate indicator LED will light up on the EVB. Various modem control lines can be rearranged depending on the user preferences and the specific modem chips used. This is done using JP6. The basic two JP6 configurations are shown in the following figures. J6 If neither jumper is in place then neither serial port will be activated and the user must provide I/O signals via the pins on J103. This IO can be in ASYNCH SERIAL, SPI SERIAL and Parallel Bus mode. 1.3.1.2. Autobaud Control Autobaud is enabled with no jumper at the JP34 position. When a jumper is in place, autobaud is disabled and the user must setup the host to run 19k2 baud in order to use the modem. 1 3 4 6 7 9 10 12 13 15 1.3.1.3. EEPROM Control Figure 2. Default J6 Setup for 24-Pin Modem Chips To enable the EEPROM (U5) both jumpers JP34 and JP35 must be in place and the modem reset. JP35 physically connects the EEPROM chips select line to the modem and allows the EEPROM to function when addressed by the modem, while JP34 connects a strapping option to the correct modem pin which is sensed during reset and instructs the modem firmware to use the EEPROM. J6 1 3 4 6 7 9 10 12 13 15 1.3.1.4. Call Progress Configuration The modem call establishment can be heard by enabling the call progress feature via software (see AN93) and Hardware. The hardware components include installing JP12 which enabled the audio power amplifier and installing JP14 to connect the on board speaker to the power amplifier output. If an offboard speaker is to be used then JP14 can be removed and the alternate speaker can be connected to pins 1 and 4 of JP11. Note the this audio output is 8 and differential so that neither output pin should be grounded. Figure 3. Default J6 Setup for 16-Pin Modem Chips The specific details of what the jumpers connect are shown in Table 1, which is also found printed on the underside of the EVB. 1.3.1.5. Control Line Configuration Table 1. Routing of Control Signals with Jumper Position on J6 RS232 Signal 4 Si24xx 24-Pin Si24xx 16-Pin Si2401 Left Right Left Right Left Right DCD DCD SDI/EESD DCD NC DCD NC RI RI FSYNCH NC RI NC RI DTR ESC RI ESC NC ESC NC RTS RTS SDO/ EECLK NC RTS NC GPIO1 DSR INT AOUT/INT NC INT NC AOUT/INT Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB 1.3.2. Daughter Card Configuration The daughter card comes configured with either a 24pin FT or 16-pin FS system side part and either 32 kHz or 4.9152 MHz operation, and UART operation. The daughter card can also be setup to operate with a third clock frequency, an on board 27 MHz oscillator. To change between these options requires component changes on the daughter card. The daughter card can also operate in three possible interface modes: parallel bus mode, in SPI mode as well as the default UART mode. There are six small (0402) strapping resistors (R101 to R106) that are on the daughter card and are configured differently depending on the combination of chip package, clock frequency chosen, and interface mode. See Figures 5 and 6 for details. The card and its options are shown in Figure 4, which shows the Modem Daughter card Rev 2.0 top and bottom views with the critical parts that may be changed to select another command mode (i.e. SPI) or an alternate crystal frequency, such as 4.9152 MHz. Rev. 0.7 5 Si2493/57/34/15/04 Global ISOmodem-EVB Three possible crystals or ext oscillator. These option strapping resistors select modem command mode UART, SPI or Parallel and crystal clock frequency. Crystal loading caps (C40 & C41) specific to the crystal type used. TOP VIEW BOTTOM VIEW Figure 4. Modem Daughter Card Rev 2.0 Top and Bottom Views Figure 5. R101–R106 Setup for Clock and Mode Configuration on the DC with the 16-Pin FS Package 6 Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB Figure 6. R106 Setup for Clock and Mode Configuration on DC with 24-Pin FT Package 1.3.2.1. 32 kHz Setup Table 2. Signal Usage For 32 kHz, populate Y1 with the 32 kHZ crystal shown in the BOM and use 18 pF capacitors for the C40/C41 values. Also remove Y3 and Y1b if present and strap R101 to R106 as shown in Figure 5. SPI Function JP23 Pin Number Legacy Pin Function SPI_CSb 5 RTSb The modem should then work as expected; no changes are needed on the motherboard SPI_MISO 7 RXD SPI_MOSI 9 TXD SPI_SCLK 11 CTSb 1.3.2.2. 4.9152 MHz For 4.9152 MHz, populate Y1b with the 4.9152 MHz crystal shown in the BOM and use 33 pF capacitors for the C40 and C41 values. Also remove Y3 and Y1 if present and strap R101 to R106 as shown in Figures 5 or 6 above.The modem should then work as expected; no changes are needed on the motherboard 1.3.2.3. 27 MHz For 27 MHz, populate Y3 with the small surface mount oscillator shown in the BOM and remove Y3 and Y1b if present. Also remove any capacitors at the C40 and C41 positions. Strap R101 to R106 as shown in Figures 5 or 6 above. The modem should then work as expected; no changes are needed on the motherboard 1.3.2.4. SPI Mode Setup To change to SPI mode setup it is necessary to configure the R101 straps as shown in Figure 5 or Figure 6, according to the package and clock used. Then setup the daughter card with neither UART nor USB operation selected, i.e. with no jumper on JP23. The SPI signals can then be obtained on J103, the system connector and connected to the host. Signal usage is described in Table 2. 1.3.3. Parallel Bus Mode Setup To change to parallel bus mode setup it is necessary to configure the R101 straps as shown in Figure 5 or Figure 6, according to the package and clock used. Then setup the daughter card with neither UART nor USB operation selected, i.e. with no jumper on JP23. The SPI signals can then be obtained on J103, the system connector and connected to the host. See the data sheet and schematic for signal and pin usage. 1.4. Power Requirements The Si2493/57/34/15/04-EVB has an on-board diode bridge, filter capacitor, and voltage regulator (U10 and U18). Power can be supplied from any source capable of providing 7.5 V–13 V dc or 7.5 V–13 V peak ac and at least 100 mA. (Additional current may be required if a speaker is connected for monitoring call progress tones.) Power may be applied to the Si2493/57/34/15/ 04-EVB through the screw terminals (J8), the 2 mm power jack (J9), or the USB cable (even if the modem is configured for RS-232 operation). The onboard fullwave rectifier and filter ensure the correct polarity is applied to the Si2493/57/34/15/04-EVB. Daughter card current can be measured by connecting a DVM across R59, a 1 resistor using the supplied test points on Rev. 0.7 7 Si2493/57/34/15/04 Global ISOmodem-EVB either side. the data mode. After the ATO command, the modem resumes the data connection and no longer accepts AT commands. 1.5. Terminal and Line Connections The Si2493/57/34/15/04 can be tested as a standard serial data modem by connecting the Si2493/57/34/15/ 04-EVB to a personal computer or other data terminal equipment (DTE), phone line, and power. Connect a PC serial port to the DB9 connector on the Si2493/57/34/ 15/04-EVB with a pass-through cable. The RS-232 transceivers on the EVB can communicate with the DTE at rates up to 1 Mbps. Any standard terminal program, such as HyperTerminal or ProComm, running on a PC communicates with the Si2493/57/34/15/04-EVB. The standard factory jumper configuration has autobaud enabled. Autobaud detects the DTE speed, data length, parity, and number of stop bits. If JP33 is installed, autobaud is disabled. Configure the terminal emulation program to 19200 bps, eight data bits, no parity, one stop bit, and hardware (CTS) handshaking. Connect the RJ-11 jack on the Si2493/57/ 34/15/04-EVB to an analog phone line or telephone line simulator, such as a Teltone TLS 5. 1.6. Making Connections With the terminal program properly configured and running, apply power to the Si2493/57/34/15/04-EVB. Type “AT<cr>”, and the modem should return “OK” indicating the modem is working in the command mode and communicating with the terminal. If the “OK” response is not received, try resetting the modem by pressing the manual reset switch (S1); then, again type “AT<cr>.” Next, type “ATI6<cr>.” The modem should respond with “2493”, “2457”, “2434”, “2415”, or “2404” indicating the terminal is communicating with an Si2493, Si2457, Si2434, Si2415, or Si2404. Type “ATS0=2<cr>” to configure the modem to answer on the second ring. To take the modem off-hook, type “ATH1<cr>.” The modem should go to the off-hook state, draw loop current, and respond with an “OK.” Next, type “ATH<cr>” or “ATH0<cr>”, and the modem should hang up (go on-hook) and stop drawing loop current. To make a modem connection, type “ATDT(called modem phone number)<cr>.” Once the connection is established, a “CONNECT” message appears indicating the two modems are in the data mode and communicating. Typing on one terminal should appear on the other terminal. To return to the command mode without interrupting the connection between the two modems, type “+++.” Approximately two seconds later, “OK” appears. The modem is now in command mode and accepts “AT” commands.Type “ATH” (or “ATH0”) to terminate the data connection, or type “ATO” to return to 8 1.7. EVB Part Numbers The ISOmodem evaluation boards are offered in multiple speeds and packaging options. The first four numbers indicate the system-side device. The next two letters indicate the system-side package (FS–Lead-free, 16-pin SOIC; FT–Lead-free, 24-pin TSSOP). The final two numbers indicate the line-side device. See Figure 7. Si2457-D-FS18-EVB LS Part Number (Si30xx) SS Package SS Revision SS Part Number Figure 7. EVB Part Number Example 2. Si2493/57/34/15/04-EVB Functional Description The Si2493/57/34/15/04-EVB is a multipurpose evaluation system. The modem daughter card illustrates the small size and few components required to implement an entire controller-based modem with global compatibility. The daughter card can be used independently of, or in conjunction with, the motherboard. The motherboard adds features that enhance the ease of evaluating the many capabilities of the Si2493/57/34/15/04 ISOmodem®. 2.1. Motherboard The motherboard provides a convenient interface to the Si2493/57/34/15/04 DC (daughter card). The versatile power supply allows for a wide range of ac and dc voltages to power the board. RS-232 transceivers and a DB9 connector allow the Si2493/57/34/15/04-EVB to be easily connected to a PC or other terminal device. Jumper options allow direct access to the LVCMOS/TTL level serial inputs to the Si2493/57/34/15/04, bypassing the RS-232 transceivers or USB interface. This is particularly useful for directly connecting the Si2493/57/ 34/15/04 to embedded systems. The Si24xxURT-EVB motherboard connects to the daughter card through two connectors, JP101 and JP2. JP101 is an 8x2 header providing connection to all Si2493/57/34/15/04 digital signals and regulated 3.3 V power for the Si2493/57/34/15/04. The Si2493/57/34/ 15/04 digital signals appearing at JP101 (daughter card interface) are LVCMOS and TTL compatible. JP2 is a 4x1 socket providing connection between the daughter Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB card and the RJ-11 phone jack. 2.1.5. EEPROM Enable (FT Only) 2.1.1. Voltage Regulator/Power Supply Connecting JP34 and JP35 enables the optional EEPROM, U5. See “AN93: Si2457/Si2434/Si2415/ Si2404 Modem Designer’s Guide” for programming details. The input voltage to either J8 or J9 must be between 7.5 and 13.5 V dc or 7.5 and 13.5 VPEAK ac. The motherboard includes a diode bridge (D12) to guard against a polarity reversal of the dc voltage or to rectify an ac voltage. The power source must be capable of continuously supplying at least 100 mA. C44 serves as a filter cap for an ac input. The voltage regulator, U10, provides 5 V for the motherboard and the input for voltage regulator U3, which outputs 3.3 V for use on the motherboard and to power the daughter card. Si24xxDC power consumption can be measured by placing a meter across R59. Power is supplied to U2 through D5 from the USB. 2.1.2. Reset Circuitry The Si2493/57/34/15/04 requires a reset pulse to remain low for at least 5.0 ms after the power supply has stabilized during the powerup sequence or for at least 5.0 ms during a power-on reset. Most production Si2493/57/34/15/04 modem chipset applications require that RESET be controlled by the host processor. Certain Si2493/57/34/15/04 operation modes, including powerdown, require a hardware reset to recover. The Si2493/57/34/15/04-EVB contains two reset options, an automatic power-on reset device, U18 (DS1818) (default), and a manual reset switch (S1) to permit resetting the chip without removing power. A reset, regardless of the mechanism, causes all modem settings to revert to factory default values. 2.1.3. Automatic Reset (DS1818) The DS1818 is a small, low-cost device that monitors the voltage on VD and an external reset pushbutton. If VD drops below 3.0 V, the DS1818 provides a 220 ms active-low reset pulse. On powerup, the DS1818 also outputs an active low reset pulse for 220 ms after VD reaches 90% of the nominal 3.3 V value. The DS1818 outputs a 220 ms reset pulse any time the power supply voltage exceeds the 3.3 V ±10% window. 2.1.6. Interface Selection The serial interface of the Si2493/57/34/15/04-EVB can be connected to a computer, terminal, embedded system, or any other data terminal equipment (DTE) via a standard RS-232 interface, USB interface, or through a direct TTL serial interface. The Si2493/57/34/15/04 can be tested as a standard data modem by connecting the Si2493/57/34/15/04EVB to a personal computer or other DTE power supply and a phone line. A PC can communicate with the Si2493/57/34/15/04-EVB using a standard terminal program, such as HyperTerm or ProComm. Jumper settings determine how the Si2493/57/34/15/ 04-EVB is connected to the DTE. 2.1.7. RS-232 Interface This operation mode uses the standard factory jumper settings illustrated in Figure 1 on page 3. The Maxim MAX3237 transceiver interfaces directly with the TTL levels available at the serial interface of the Si2493/57/ 34/15/04 and, using internal charge pumps, makes these signals compatible with the RS-232 standard. The RS-232 transceiver on the Si2493/57/34/15/04-EVB can communicate at rates between 300 bps and 1 Mbps. This simplifies the connection to PCs and other data terminal equipment (DTE). The signals available on the Si2493/57/34/15/04-EVB serial interface (DB9 connector) are listed in Table 3. 2.1.8. USB Interface The USB cable connects to J10 on the motherboard and provides both data and power. Installing a jumper on JP23 enables the USB interface and disables the RS-232 interface. The USB interface is provided by U12. A USB driver for this chip is available for most PC and MAC operating systems on the CD. 2.1.4. Manual Reset The manual reset switch (S1) performs a power-on reset. This resets the Si2493/57/34/15/04 to factory defaults without turning off power. Pressing S1 activates the reset monitor in the DS1818 and produces a 220 ms active low reset pulse. Rev. 0.7 9 Si2493/57/34/15/04 Global ISOmodem-EVB 2.1.9. Direct Access Interface operation of the modem. See “AN93: Si3457/34/15/04 Modem Designer’s Guide” for more details on the features controlled by pin strapping. While the motherboard supplies power through J8, J9, or USB, power-on reset, and an RJ–11 jack for the modem, the direct access interface (J103) is used to connect the motherboard to an embedded system. J103 provides access to all Si2493/57/34/15/04 signals available on the daughter card. Since this PWM signal swings rail to rail and is simply filtered by a low pass filter to acquire the audio. It is important to keep the power supply to the modem free of noise in the audio spectrum. It is necessary to remove the jumper on JP23 to disable both the RS-232 and USB interface and prevent signal contention. 2.1.11.2. The Audio Output Amplifier (LM4819) The Power amplifier on the EVB is powered by a current limited 4.2 V supply. The current limit is implemented in the EVB because it is intended for HW/SW development and is not needed for a production design. This amplifier can drive an 8 speaker with 200 mW of Call progress audio (i.e., ISOmodem's call progress dialing and negotiation tones). 2.1.10. PCM Interface (24-Pin FT Only) The Si2493/57/34/15/04 PCM interface can be demonstrated using the voice motherboard, not with this EVB. 2.1.11. AOUT Call Progress Audio Output The power amplifier itself is a low cost, rugged H bridge type device. There are several pin compatible designs from multiple vendors that can provide alternate price/ power tradeoffs for this amplifier. This power amp can be shut down by removing jumper JP12. The signal at JP12 can also be tied to a control signal to allow the host to shut down the amplifier. The customer can change the values of R172 and R173 when integrating the EVB to his system, but should keep the RC formed by C37 and R173 at a 50 Hz or higher corner to avoid a power-on thump. Call progress audio output is provided by the Si2493/57/ 34/15/04 on the AOUT pin as a PWM signal. This signal allows the user to monitor call progress signals, such as dial tone, DTMF dialing, ring, busy signals, and modem negotiation. Control of this signal is provided by AT commands and register settings described in the introduction. The AOUT signal is connected to an on board amplifier, for a high-quality output. AOUT can also be connected to a summing amplifier or multiplexer in an embedded application as part of an integrated audio system. 2.1.11.3. The Call Progress Speaker 2.1.11.1. AOUT Audio Processing The Call progress speaker, Regal RE-2308-NL is connected to the amplifier via a jumper, JP14. If another speaker is to be connected then it is necessary to remove JP14 and connect the external speaker to JP11, Pins 1 and 4. It is important to remember that the speaker signal is differential. Both the output pins are driven outputs and must not be grounded. The AOUT signal discussed in this section leaves the Si2493/57/34/15/04 is processed (demodulated) by a high pass filter: (R133,134,135, and C24, C25, 26, C27). It is critically important to not put a dc load on the AOUT pin since the pin also acts as a modem feature control on reset and is internally weakly pulled up. Any unintentional dc load on AOUT prevents proper Table 3. DB9 Pin Connections J1 Name J1 Symbol J1 Pin Carrier Detect CD 1* See note DCD/EESD Received Data RXD 2 9 RXD Transmit Data TXD 3 10 TXD Data Terminal Ready DTR 4* See note ESC/RI SG 5 6 GND Data Set Ready DSR 6* See note INT/AOUT Ready to Send RTS 7* See note RTS/RXCLK Clear to Send CTS 8 11 CTS * 17 RI Signal Ground Ring Indicator RD 9 *Note: JP6 jumper option. 10 Rev. 0.7 Si2493/57/34/15/ Si2493/57/34/15/ 04 Pin 04 Name Si2493/57/34/15/04 Global ISOmodem-EVB 2.2. Modem Daughter Card Operation The Si2493/57/34/15/04URT-EVB daughter card is a complete modem solution perfectly suited for use in an embedded system. The daughtercard contains both the modem system-side chip and the isolated line interface (DAA). The daughter card requires a 3.3 V supply capable of providing at least 35 mA and communicates with the system via LVCMOS/TTL-compatible digital signals on JP1. The RJ-11 jack (TIP and RING) is connected via JP2. Be sure to provide the proper power-on reset pulse to the daughter card if it is used in the stand-alone mode. 2.2.1. Reset Requirements The Si2493/57/34/15/04 ISOmodem® daughter card must be properly reset at powerup. The reset pin (pin 8) of the Si2493/57/34/15/04 (JP103, J101 pin 13) must be held low for at least 5.0 ms after power is applied and stabilized to ensure the device is properly reset. 2.2.2. Crystal Requirements Clock accuracy and stability are important in modem applications. To ensure reliable communication between modems, the clock must remain within ±100 ppm of the design value over the life of the modem. The crystal selected for use in a modem application must have a frequency tolerance of less than ±100 ppm for the combination of initial frequency tolerance, drift over the normal operating temperature range, and five year aging. Other considerations, such as production variations in PC board capacitance and the tolerance of loading capacitors, must also be taken into account. 2.2.3. Protection The Si2493/57/34/15/04-EVB meets or exceeds all FCC and international PTT requirements and recommendations for high-voltage surge and isolation testing without any modification. The protection/isolation circuitry includes C1, C2, C8, C9, FB1, FB2, and RV1. The PCB layout is also a key “component” in the protection circuitry. The Si2493/57/34/15/04-EVB provides isolation to 3 kV. Contact Silicon Laboratories for information about designing to higher levels of isolation. Rev. 0.7 11 RTSb CTSb AOUT_INTb FSYNCH INTb RIb DCDb 12 8 9 10 11 U12 R101 R102 R103 R104 R105 R106 Rev. 0.7 No Yes No Yes No No No Yes Yes No Yes No X X Yes No Yes SPI 4.9252 MHz UART 32 kHz SPI 27 MHz SPI 32 kHz No Yes No No 2 OUT VCC 3 4 VDD C55 0.1uF X X No No No Yes Yes Yes X X No No Yes No Yes No X X Yes No X No X Yes Pin17 Pin23 RIb DCDb R105 R106 27 Mhz 32.768 kHz 4.9152 MHz Parallel 4.9152 MHz Parallel 27 Mhz UART 27 Mhz UART 4.9152 MHz UART 32.768 kHz SPI SPI SPI 8 XTALI VDD C54 1uF R18 FB5 U13 Si24xx-16 pin 33pF RIb R120 9 10 NI NI 1 3 5 7 9 11 13 15 1 3 5 7 9 11 13 15 2 4 6 8 10 12 14 16 2 4 6 8 10 12 14 16 SOCKET 8x2 J1 ESC SDI_EESD RIb INTb AOUT_INTb SDO_EECLK_RTSb DCDb These components are for internal Silabs use only. C2A C1A XTALO 2 SDI_EESD R121 C2A C1A XTALO XTALI C52 0.1uF 1 C50 0.1uF CLKIN/XTALI CLKOUT_EECSb_AO FSYNCH RTSb RXD R110 200 TXD R111 200 CTSb R112 200 RESETb C40 C41 33pF RESET C56 0.1uF 1.2K VDD RTSb_SPI_CSb RXD_SPI_MISO TXD_SPI_MOSI CTSb_SPI_SCLK DCDb ESC RIb INTb VA Y1B Y1 32.768KHz 4.9152MHz XTALO RESETb <<%<DUHDOWHUQDWHIRRWSULQWVDQGIUHTXHQFLHV 7KH9DOXHVRI&&YDU\6HH7KH%20 GND NC Y3 27 MHz C2A C1A 16 5 6 7 15 14 3 11 VDA 13 SDO_EECLK_RTSb RXD TXD CTSb DCDb ESC FSYNCH AOUT_INTb C51 0.22uF Figure 8. i2493/57/34/15/04 Schematic Yes Yes No No No No No No No No No No No No UART 27 MHz No No UART 4.9152 MHz No No No 13 Pin15 Pin16 AOUT_INTb INTb R102 R104 Pin11 Pin3 Pin15 AOUT_INTb FSYNCH(RI) DCDb R102 R103 R106 Pin11 CTSb R101 Pin7 CTSb R101 10K 10K 10K 10K 10K 10K 1 XTALO 2 14 XTALI 1 2QO\RQH6\VWHPVLGHSDUWLV VROGHUHGDWWLPH8RU8 24 pin system side strapping table C2A RESET C1A RTSb/SPI_CSb/D7 RXD/SPI_MISO/RDb TXD/SPI_MOSI/WRb CTS/SPI_SCLK/CSb XTALO CLKIN/XTALI Si2493 CLKOUT/EECSb/A0 INTb/D0 RIb/D1 SDI/EESD/D2 SDO/EECLK/D5 DCDb/D4 ESC/D3 AOUT/INTb FSYNCH/D6 VDB VDA 16 pin sys side strapping table PKG_16.7 & PKG_24.11 PKG_16.11 & PKG_24.15 PKG_16.3 & PKG_24.4 PKG_24.16 PKG_24.17 PKG_16.15 & PKG_24.23 RESETb RXD TXD CTSb 3 16 17 18 INTb RIb SDI_EESD CLKOUT_EECSb_AO 24 23 22 15 4 VDB 19 7 C53 0.22uF SDO_EECLK_RTSb DCDb ESC AOUT_INTb FSYNCH VDA VDD 4 VDD3.3 5 21 VD3.3 VD 3.3 GND GND 6 20 GND 12 12 :LUHVFRPPRQWR SLQSDUWV Si2493/57/34/15/04 Global ISOmodem-EVB 3. Design The following sections contain the schematics, bill of materials, and layout for the Si2493/57/34/15/04 including the daughter card and motherboard. C2A C1A 56.2 R13 56.2 R12 1M R9 Bias C2 C1 C6 10 7 4 6 5 0.1uF 0.1uF C0603 C0603 C5 33pF 33pF QB DCT2 DCT3 DCT RX VREG2 14 2 3 R1 1.07K 8 9 1 12 13 16 20M 20M R4 2.49K 100K R5 3.65K R3 Q1 MMBTA42LT1 I_GND Z1 43V 0.01uF C10 0.01uF C3 + - I_GND D1 HD04 Figure 9. Si3018/10 DAA Schematic Keep 5 mm creepage rules between this DAA section and all else. I_GND 100K R6 Place C3 near D1 Q3 MMBTA42LT1 Q2 MMBTA92LT1 Add 0.020 to 0.030 sq. inches of Cu at all transistor collectors Ring Detect/CID/Voltage monitoring No GND or I_GND copper planes in DAA section. R7 R8 150 R2 73.2 R11 DC Term 2.7nF Q4 MMBTA06LT1 R10 536 C4 1uF C7 Q5 MMBTA06LT1 I_GND RNG1 RNG2 QE QE2 Si3018 VREG IB C2B C1B U2 IGND 15 Rev. 0.7 SC + 11 1uF C4X X8R 25V C9 680pF 600 Ohm FB1 600 Ohm FB2 C8 680pF R15 0 P3100SB RV1 R16 0 TIP RING J2 TSM-104-01-T-SV 4X1 Header Si2493/57/34/15/04 Global ISOmodem-EVB 13 Si2493/57/34/15/04 Global ISOmodem-EVB 4. Bill of Materials: Si24xx Daughter Card Table 4. Si24xx Daughter Card Bill of Materials Item Qty Ref Value Rating 1 2 2 1 C1, C2 33 pF Y2 C3 0.01 µF Voltage Tol Type PCB Footprint Mfr Part Number Mfr 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata 3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic 4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel 5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel 6 2 C8, C9 680 pF 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone 7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel 8 2 C40, C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel 9 3 C50, C52, C56 0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel 10 2 C51, C53 0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel 11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel 12 1 D1 HD04 0.8 A BRIDGE MiniDIP4 HD04-T Diodes Inc. 13 3 FB1, FB2, FB5 600 200 mA SMT L0603 BLM18AG601SN1 Murata 14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec 15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg 16 2 Q1 Q3 MMBTA42LT1 SOT23-BEC MMBTA42LT1 On Semi Y2 400 V 200 mA 300 V NPN 17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi 18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi 19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse 20 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel 21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel 22 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel 23 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel 24 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel 25 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel 26 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel 27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel 28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel 29 2 R12, R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel 30 2 R15, R16 0 1A ThickFilm R0603 CR0603-16W-000 Venkel 31 2 R120, R121 0 1A ThickFilm R0603 CR0603-16W-000 Venkel 32 1 R18 1.2 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel 33 4 R101, R102, R103, R104, R106 10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel 14 Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB Table 4. Si24xx Daughter Card Bill of Materials (Continued) Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr 34 1 R105 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel 35 3 R110, R111, R112 200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel 36 1 U2 Si3018 LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs 37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs 38 1 U13 Si24xx-16 pin 16pin SOIC 2493 Silicon Laboratories 39 1 Y1B (Y1, Y3) 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS International 40 1 Z1 43 V SOD-123 BZT52C43-7-F Diodes Inc. 300 V 500 mW 43 V Zener Rev. 0.7 15 +3.3V R162 RED RED JP23 RS232 D53 10K 10K D52 USB 15 1 4 7 9 12 0.1uF 1uF C69 1A 2A 3A 4A Net names correspond to Si24xx. See table for Si2401 equivalents +3.3V 15 1 4 7 9 12 0.1uF RI_M DTR_M RTS_M DSR_M RXD TXD CTSb CD_M SPI mode SPI_CSb C70 560pF U13 IDT74CBTLV3257 ENABLE_MUXb SELECT BAV23A D54 R40 10K OE S Si2401 NC GPIO1 GPIO5 GPIO2 NC GND RXD GPIO3 TXD NC CTS NC RESETb NC VD GPIO4 1B2 2B2 3B2 4B2 1B1 2B1 3B1 4B1 C72 Select High Chooses +3.3V B2 port 1B2 2B2 3B2 4B2 1A 2A 3A 4A C71 OE S +3.3V Isense RED TP13 1B1 2B1 3B1 4B1 U14 IDT74CBTLV3257 3 6 10 13 2 5 11 14 3 6 10 13 2 5 11 14 1.0 Si24xx CLKOUT/EECS/A0 SDO/EECLK_RTSb/D5 FSYNCH/D6 DCDb/D4 RTSb/D7 GND RXD/RD ESC/D3 TXD/WR SDI/EESD/D2 CTSb/CS RIb/D1 RESETb INTb/D0 VD AOUT/INTb R163 R42 "RS232" "USB" R41 JP1/3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 681 681 RI_T DTR_T RTS_T DSR_T RI_U DTR_U RTS_U DSR_U RXD_T TXD_T CTS_T CD_T RXD_U TXD_U CTS_U CD_U To Host Interface Page RESETb +3.3V RED TP12 16 VCC GND 8 16 VCC GND 8 +3.3V G1 G2 A1 A2 A3 A4 A5 A6 A7 A8 +3.3V Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 C75 INTb RTSb ESC RIb DCD 24xx TSSOP24 U26 74LCX541 18 17 16 15 14 13 12 11 0.1uF ESC RIb RTSb RTS_M INTb DSR_M DTR_M RI_M CD_M DCDb Table on back silkscreen for JP6 +3.3V 2 4 6 8 10 12 14 16 2 4 6 8 10 12 14 16 2 4 6 8 10 12 14 16 Silk Screen Text 1 3 5 7 9 11 13 15 2 4 6 8 10 12 14 16 J103 8X2 Shrouded Header TP23 TP22 TP21 TP20 TP19 TP17 TP16 R170 R169 R160 R159 R158 R157 R156 R155 AOUT_INTb 681 681 681 681 681 681 681 681 DSR RTS DTR RI CD CTS TXD RXD D48 D47 D46 D45 D44 D43 D42 D41 RED AOUT/INTb INTb NC RIb NC 24xx SOIC16 RTSb RIb FSYNCH SDI/EESD 24xx TSSOP24 15 RIb FSYNCHb SDI_EESD 12 SDO_EECLK_RTSb SDO/EECLK 9 6 3 TP24 HEADER 5x3 J6 Leaded +3.3V INTb/AOUT GPIO1 NC RIb NC 2401 SOIC16 JP6 Right Pin Signals "SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15" "TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14" "Recommended J6 settings" CLKOUT_EECSb FSYNCHb ESC SDI_EESD RIb INTb AOUT_INTb SDO_EECLK_RTSb DCDb Si2401 LEFT RIGHT DCD or nc NC or RIb ESC or NC nc or GPIO1 nc or INTb/AOUT "SDO_EECLK_RTSb" "DCDb" "GND" "ESC" "SDI_EESD" "RIb" "INT" "AOUT_INTb" ESC SDI_EESD RIb INTb AOUT_INTb SDO_EECLK_RTSb DCDb RS-232 Si24xx 24 pin Si24xx 16 pin LEFT RIGHT LEFT RIGHT CD DCD or SDI/EESD DCD or NC RI RI or FSYNCH NC or RIb DTR ESC or RIb ESC or NC RTS RTS or SDO/EECLK NC or RTSb DSR INTb or AOUT/INTb NC or INTb "J6 Jumper Connectiveity" 1 2 4 5 7 8 10 11 13 14 CLKOUT_EECSb FSYNCHb RTSb RXD TXD CTSb RESETb 1 3 5 7 9 11 13 15 J101 HEADER 8x2 1 3 5 7 9 11 13 15 "CLKOUT_EECSb" 1 3 "FSYNCHb" 5 "RTSb" 7 "RXD" 9 "TXD" "CTSb" 11 13 "RESETb" 15 "+3.3V" CLKOUT_EECSb FSYNCHb RTSb RXD TXD CTSb RESETb VCC_Modem Connectors for ISOModem module. Figure 10. Motherboard Modem Interface Schematic 1 19 2 3 4 5 6 7 8 9 NC NC RXD TXD CTSb CD RIb DTRb RTSb DSRb NC NC ESC NC NC ESC DCD DCD 24xx SOIC16 JP6 Left Pin Signals NOPOP R39 10K C73 560pF 2401 SOIC16 +3.3V 1uF C74 20 VCC R43 SDI_EESD TP9 Turret TP8 Turret TP7 Turret TP25 Turret GND GND GND GND CLKOUT_EECSb 2 1 1 5 4 3 2 1 3 7 SILABS Internal Use Only NOPOP J7 5 4 3 2 1 /WP /HOLD +3.3V C98 0.1uF SCLK MOSI MISO /CS +3.3V EE Strap 1 Autobaud Dis. Strap JP33 JP34 U5 EEPROM 32K 6 5 2 1 2 2 AOUT_INTb CLKOUT_EECSb SDI_EESD FSYNCHb JP35 EE En. 10K 10K +3.3V SDO_EECLK_RTSb SDI_EESD R101 200 R48 10K R52 FSYNCHb J5A RJ-11 TELEPHONE 7 8 9 10 11 12 To AOUT circuit on Call Progress Page JP2 4X1 Socket 1 2 3 4 5 6 TIP PSTN LINE TP6 J5B BLUE RJ-11 RING TP5 BLUE 8 VCC R59 GND 10 Rev. 0.7 GND 16 4 FB11 Si2493/57/34/15/04 Global ISOmodem-EVB AOUT_INTb 0.1uF C24 0.1uF C25 R33 1K 0.1uF C26 R34 1K 0.1uF C27 R35 1K C37 1uF 10K 1uF R174 20.0K Pwr Amp En. R31 C23 20.0K JP12 1 2 3 4 C97 LM4819 SHUTDOWN BYPASS IN+ IN- U27 1nF 20.0K VO2 VO1 C21 1uF Figure 11. Audio Amplifier Schematic +4.7V R173 2 1 6 VDD GND 7 R172 8 5 R175 0 SPEAKER LS1 JP14 En. Lcl. Speaker "Do not gound speaker+ or Speaker - 2 1 +4.7V DIFF SPKR OUT JP11 Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 17 3 2 1 7-12V AC/DC PWR J9 7-12V AC/DC PWR 2 1 600 Ohm FB7 600 Ohm FB6 - 18 25V 0.01uF C51 R105 R103 Bridge Rectifier D12 0.01uF 25V + J8 C42 1.6 1.6 470uF C44 + OUT GND C49 10uF D13 D11 STPS140Z SOD-123 STPS140Z +4.7V C43 1uF IN OUT GND U3 LT1963A-3.3 V SOT223 Figure 12. Power Supply Schematic 0.1uF 50V C48 IN U10 LM2937ES-5.0 TO263-3N VCC_USB R57 0.05 C96 0.1uF C66 10uF D50 RED +3.3V PWR R161 3 2 RESET DS1818 RST GND VCC U18 681 1 S1 1.33K R102 D49 MMBD3004S-7-F +3.3V RESETb Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 SG DTR(I) TXD(I) RXD(O) RD(O) CTS(O) RTS(I) USB +V DD+ GND J11 USB Type B 0.01uF C60 RS-232, Female, Front View 5 4 3 MH MH 10 11 2 1 2 3 4 9 8 7 Keep Very Close D14 600 Ohm BLM18AG601SN1 FB9 D15 0.1uF C63 0.1uF C61 5 4 7 8 DD+ RST RI DCD DTR DSR TXD RXD RTS CTS SUSPEND SUSPEND CP2102 REGIN VBUS U12 FB8 9 2 1 28 27 26 25 24 23 11 12 R112 10K TXD_232 RTS_232 DTR_232 DSR_232 RD_232 CD_232 CTS_232 RXD_232 0.1uF 0.1uF C62 C55 1uF +3.3V C57 C56 14 15 11 9 8 12 10 7 6 5 0.1uF 4 0.1uF 27 Figure 13. RS-232 Interface and USB Interface Schematic VCC_USB 15V DN1 6 15V DN2 DSR(O) 15V DN3 DB9 15V DN4 CD(O) 15V DN5 560pF 15V DN7 1 R108 0 NOPOP 15V DN6 600 Ohm BLM18AG601SN1 C53 C52 15V DN8 10K R109 SHDN MBAUD R3IN R2IN R1IN T5OUT T4OUT T3OUT T2OUT T1OUT V- V+ 26 VCC GND 2 J10 C54 1uF GND 3 SH SH 6 5 6 VDD GND Rev. 0.7 EPAD 10K R111 MAX3237 EN R3OUT R2OUT R1OUT R1OUTB T5IN T4IN T3IN T2IN T1IN C2- C2+ C1- C1+ U11 13 18 20 21 16 17 19 22 23 24 3 1 25 28 C58 0.1uF 0.1uF C59 10K R110 +3.3V RI_U CD_U DTR_U DSR_U TXD_U RXD_U RTS_U CTS_U TXD_T RTS_T DTR_T DSR_T RI_T CD_T CTS_T RXD_T Si2493/57/34/15/04 Global ISOmodem-EVB 19 Si2493/57/34/15/04 Global ISOmodem-EVB 5. Bill of Materials: Si24xx Motherboard Table 5. Si24xx Motherboard Bill of Materials Item Qty Ref Value 1 8 C21, C23, C37, C43, C54, C55, C69, C74 2 17 3 Voltage Tol Type PCB Footprint Mfr Part Number Mfr 1 µF 10 V ±10% X7R C0603 C0603X7R100-105K Venkel C24, C25, C26, C27, C53, C56, C57, C58, C59, C61, C62, C63, C71, C72, C75, C96, C98 0.1 µF 10 V ±20% X7R C0402 C0402X7R100-104M Venkel 3 C42, C51, C60 0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel 4 1 C44 470 µF 25 V ±20% Alum_Ele c C10.3X10.3MM EMVE250ADA471MJA0G United Chemicon 5 1 C48 0.1 µF 50 V ±10% X7R C0603 C0603X7R500-104K Venkel 6 2 C49, C66 10 µF 16 V ±10% X5R C0805 C0805X5R160-106K Venkel 7 3 C52, C70, C73 560 pF 16 V ±10% X7R C0603 C0603X7R160-561K Venkel 8 1 C97 1 nF 100 V ±10% X7R C0603 C0603X7R101-102K Venkel 9 8 DN1, DN2, DN3, DN4, DN5, DN6, DN7, DN8 15 V 225 mW 15 V Zener, Dual SOT23-AAK MMBZ15VDLT1G On Semi 10 2 D11, D13 STPS140Z 1.0 A 40 V Schottky SOD-123 STPS140Z ST MICRO 11 1 D12 Bridge Rectifier 0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc. 12 3 D14, D15, D49 MMBD300 4S-7-F 225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc. 13 11 D41, D42, D43, D44, D45, D46, D47, D48, D50, D52, D53 RED 25 mA 1.9 V SMT, Chip LED LED-HSMXC170 HSMC-C170 Avago Technologies 14 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc. 15 5 FB6, FB7, FB8, FB9, FB11 600 Ohm 200 mA SMT L0603 BLM18AG601SN1 MuRata 16 4 HW1, HW2, HW3, HW4 spacer 2397 SPC Technology 17 4 HW5, HW6, HW7, HW8 screw NSS-4-4-01 Richco Plastic Co 20 Rating Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB Table 5. Si24xx Motherboard Bill of Materials (Continued) Item Qty Ref Value 18 1 JP11 19 2 20 Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr HEADER 4X1 Header CONN-1X4 TSW-104-07-T-S Samtec JP12, JP14 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec 1 JP23 HEADER 1x3 Header CONN-1X3 TSW-103-07-T-S Samtec 21 3 JP33, JP34, JP35 JUMPER Unshroud ed CONN-1X2 68000-402 Berg 22 1 J5 RJ-11 RJ-11 RJ11-DUALMTJG MTJG-2-64-2-2-1 ADAM TECH 23 1 J6 HEADER 5x3 Header TSW-105-07-S-T Samtec 24 1 J8 CONN TRBLK 2 TERM BLK CONN-1X2-TB 1729018 PHOENIX CONTACT 25 1 J9 Power Jack BARREL CONN-3-PWR ADC-002-1 Adam Tech 26 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI 27 1 J11 USB Type B USB CONN-USB-B 292304-1 Tyco 28 1 J101 HEADER 8x2 Header CONN2X8 16/80 pins of 9-146252-008 Tyco/AMP 29 1 J102 Socket 1x4 Header SSW-104-01-T-S Samtec 30 1 J103 8X2 Shrouded Header Shrouded CONN2X8-4W 5103309-3 Tyco 31 1 LS1 SPEAKER 0.5 W Max RE-2308-NL RE-2308-NL Regal 32 7 R31, R40, R41, R42, R43, R52, R109, R110, R111, R112 10 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel 33 3 R33, R34, R35 1 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel 34 1 R48 100 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel 35 1 R57 0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel 36 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel 37 1 R101 200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel 38 1 R102 1.33 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel 39 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel 40 11 R155, R156, R157, R158, R159, R160, R161, R162, R163, R169, R170 681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel 1A Rev. 0.7 21 Si2493/57/34/15/04 Global ISOmodem-EVB Table 5. Si24xx Motherboard Bill of Materials (Continued) Item Qty Ref Value Rating 41 3 R172, R173, R174 20.0 k 1/16 W 42 1 R175 0 2A 43 1 S1 SW PUSHBUTTON 50 mA 44 10 TP5, TP6, TP16, TP17, TP19, TP20, TP21, TP22, TP23, TP24 45 4 46 Voltage Tol Type PCB Footprint Mfr Part Number Mfr ±1% ThickFilm R0603 CR0603-16W-2002F Venkel ThickFilm R1206 CR1206-4W-000 Venkel Tactile SW4N6.5X4.5PB 101-0161-EV Mountain Switch BLUE Loop TESTPOINT 151-205-RC Kobiconn TP7, TP8, TP9, TP25 Turret Turret TP[12594] 2551-2-00-44-00-00-07-0 Mill-Max 1 TP11 RED Loop TESTPOINT 151-207-RC Kobiconn 47 1 U3 LT1963A3.3 V LDO SOT223 LT1963AEST-3.3#PBF Linear Technologies 48 1 U5 EEPROM 32K Serial TSSOP8N6.4P0. 65 25LC320A-I/ST Microchip Technology 49 1 U10 5 LDO TO263-3N LM2937ES-5.0 National Semiconductors 50 1 U11 MAX3237 RS232 TSSOP MAX3237EIPWR TI 51 1 U12 CP2102 MCU QFN28N5X5P0. 5 CP2102-GM SiLabs 52 2 U13, U14 IDT74CBT LV3257 TSSOP-16 IDT74CBTLV3257 IDT 53 1 U18 DS1818 SOT-23 DS1818-10 Dallas Semiconductor 54 1 U26 74LCX541 TSSOP20N6.4P 0.65 74LCX541MTC Fairchild 55 1 U27 LM4819 SO8N6.0P1.27 LM4819M National Semiconductor S5B-PH-SM4-TB JST 12 Vdc 1.5 A max 0.5 A max 5.5 V 3.3 V 10% Buffer 350 mW Unpopulated Components 56 1 J7 2MM, RT ANG 1 1 R39 10 k 1/10 W 1 1 R108 0 1A 22 SHROUD CONN1X5-S5BED PH-SM4-TB ±1% ThickFilm R0603 CR0603-10W-1002F Venkel ThickFilm R0603 CR0603-16W-000 Venkel Rev. 0.7 Figure 14. Daughter Card Primary Side Silkscreen Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 23 Figure 15. Daughter Card Secondary Side Silkscreen Si2493/57/34/15/04 Global ISOmodem-EVB 24 Rev. 0.7 Figure 16. Daughter Card Primary Side Layout Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 25 Figure 17. Daughter Card Secondary Side Layout Si2493/57/34/15/04 Global ISOmodem-EVB 26 Rev. 0.7 Figure 18. Motherboard Primary Side Silkscreen Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 27 Figure 19. Motherboard Silkscreen (Secondary Side) Si2493/57/34/15/04 Global ISOmodem-EVB 28 Rev. 0.7 Figure 20. Motherboard Primary Side Layout Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 29 Figure 21. Motherboard Secondary Side Layout Si2493/57/34/15/04 Global ISOmodem-EVB 30 Rev. 0.7 Figure 22. Motherboard Ground Plane Layout Si2493/57/34/15/04 Global ISOmodem-EVB Rev. 0.7 31 Figure 23. Motherboard Power Plane Layout Si2493/57/34/15/04 Global ISOmodem-EVB 32 Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB 6. Complete Design Package on CD (See Sales Representative for Details) Silicon Laboratories can provide a complete design package of the Si2493/57/34/15/04-EVB including the following: OrCad Schematics Gerber Files BOM Documentation Contact your local sales representative or Silicon Laboratories headquarters sales for ordering information. Rev. 0.7 33 Si2493/57/34/15/04 Global ISOmodem-EVB DOCUMENT CHANGE LIST Revision 0.2 to Revision 0.3 Updated Figure 15, “Daughter Card Secondary Side Silkscreen,” on page 24. Updated Figure 16, “Daughter Card Primary Side Layout,” on page 25. Updated Figure 17, “Daughter Card Secondary Side Layout,” on page 26. Updated “Bill of Materials: Si24xx Daughter Card” . Revision 0.3 to Revision 0.4 Changed from Rev.1.0 to Rev.1.1 Daughter Card. Revision 0.4 to Revision 0.5 Changed from Rev.3.1 to Rev.3.2 Motherboard. Revision 0.5 to Revision 0.6 Changed from Rev.1.1 to Rev.1.2 Daughter Card. Added FS (SOIC) Package Option. Revision 0.6 to Revision 0.7 34 Changed R1.2 to 2.0 daughtercard. Changed R32 to 5.0 motherboard. Changed power amplifier chip and speakers. Removed connector to SSI BUS. Changed regulator and power on reset circuit. Changed various jumper locations. Rev. 0.7 Si2493/57/34/15/04 Global ISOmodem-EVB NOTES: Rev. 0.7 35 Si2493/57/34/15/04 Global ISOmodem-EVB CONTACT INFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Please visit the Silicon Labs Technical Support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. Silicon Laboratories, Silicon Labs, and ISOmodem are trademarks of Silicon Laboratories Inc. Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. 36 Rev. 0.7