STATEK CX9VSM_12

CX9VSM CRYSTAL
32 kHz to 250 kHz
Ultra-Miniature, Low Profile
Surface Mount Quartz Crystal
DESCRIPTION
Designed and manufactured in the USA, the CX9V quartz
crystal is available in frequencies from 32 kHz to 250 kHz.
Using micro-machining processes, this surface-mountable
crystal is hermetically sealed within a ultra-miniature ceramic
package to ensure high stability and low aging. Tight
calibration and custom laser tuning make the CX9V ideally
suited for all low frequency applications.
Glass Lid
Ceramic Lid
PACKAGE DIMENSIONS
FEATURES
Ultra-miniature, surface mount design (4.1mm x 1.5mm)
Low profile (typically 0.80mm)
Available with glass or ceramic lid
Hermetically sealed ceramic package
High shock and vibration survival
Excellent aging characteristics
Designed for low power applications
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
Medical
Pacemaker, defibrillator, and other implantables
Medical instruments
Industrial, Computer, & Communications
Smart card
Down hole instrumentation
Transponder / Animal migration
Process instrumentation
Military & Aerospace
Airborne hybrid
Navigational computer
Real time clock
A
TOP
BOTTOM
D
B
C
TYP.
MAX.
DIM
inches
mm
inches
mm
A
0.160
4.10
0.170
4.32
B
0.060
1.50
0.068
1.73
C
-
-
D
0.031
0.79
see below
0.038
0.97
THICKNESS (DIM C) MAXIMUM
GLASS LID
CERAMIC LID
MAX
inches
mm
inches
mm
SM1
0.034
0.87
0.035
0.90
SM2/SM4
0.034
0.87
0.035
0.90
SM3/SM5
0.036
0.91
0.037
0.94
SUGGESTED LAND PATTERN
0.048 (1.22)
EQUIVALENT CIRCUIT
C0
1
L1
C1
R1
0.080
(2.03)
2
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
inches (mm)
0.132 (3.35)
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10157 - Rev D
TYPICAL APPLICATION
FOR A PIERCE OSCILLATOR
SPECIFICATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Parameters
Fundamental
Overtone
Frequency, (kHz)
32.768
100
180
240
Motional Resistance R1(kΩ)
60
19
5
4
Motional Capacitance C1 (fF)
2.2
1.0
2.0
1.5
Quality Factor Q (k)
37
80
90
110
1.0
0.85
1.0
0.9
9
9
9
9
20
16
20
25
Shunt Capacitance C0 (pF)
Load Capacitance (pF)
1
Turning Point ( C)
o
Standard Calibration Tolerance for 32.768 kHz2
Glass Lid:
+
_
30 ppm
(0.003%)
+
_
Ceramic Lid:
+
_
+
_
100 ppm
(0.01%)
Drive Level
100 ppm
(0.01%)
+
_
1000 ppm
(0.1%)
1000 ppm
(0.1%)
+
_
10000 ppm
(1.0%)
0.5 µW MAX
Temperature Coefficient (k) -0.035 ppm/OC2
Note: Frequency f at temperature T is related to frequency f0 at
turning point temperature T0 by: f-f0 = k(T-T )2
0
f0
Aging, first year
3 ppm
Shock, survival3
5,000 g, 0.3 ms, 1/2 sine
Vibration, survival
20 g RMS, 10-2,000 Hz random
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
Storage Temp. Range
-55OC to +125OC
Max Process Temperature
260OC for 20 sec.
1. Other values available
2. Tighter tolerances available
Drive Level
RA is used to limit the crystal’s drive level by forming a
voltage divider between RA and CD. RA also stabilizes the
oscillator against changes in the amplifiers output
resistance (R0). RA should be increased for higher voltage
operation.
Load Capacitance
The CX9 crystal calibration tolerance is influenced by the
effective circuit capacitances, specified as the load
capacitance (CL). CL is approximately equal to:
CL =
3. Higher shock available
Termination
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
C
C = Ceramic Lid
Blank = Glass Lid
“S” if special or
custom design.
Blank if Std.
SM1
32.768K
Frequency
K = kHz
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
(1)
+ CS
[
f0 = fS 1 +
C1
2(C0 + CL)
]
(2)
= Series resonant frequency of the crystal
= Motional Capacitance
= Shunt Capacitance
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
Rf
BUFFER
AMPLIFIER
HOW TO ORDER CX9VSM CRYSTALS
S
CD + CG
The oscillation frequency (f0) is approximately equal to:
Max Process Temperature 260OC for 20 sec.
CX9V
CD x CG
NOTE: CD and CG include stray layout to ground and CS
is the stray shunt capacitance between the crystal
terminal. In practice, the effective value of CL will be less
than that calculated from CD, CG and CS values because
of the effect of the amplifier output resistance. CS should
be minimized.
Where f
S
C1
C0
TERMINATIONS
Designation
SM1
SM2
SM3
SM4
SM5
The CX9 family of surface mount crystals are ideal for
small, high density, battery operated portable products. The
CX9 crystal designed in a Pierce oscillator (single inverter)
circuit provides very low current consumption and high
stability. A conventional CMOS Pierce oscillator circuit is
shown below. The crystal is effectively inductive and in a PInetwork circuit with CD and CG provides the additional
phase shift necessary to sustain oscillation. The oscillation
frequency (f0) is 50 to 150 ppm above the crystal’s series
resonant frequency (fS).
,
100
Calibration
Tolerance
@ 25OC
(in ppm)
/
I
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S = Customer Specified
CG
CX9
RA
OSC
Freq (fO )
CD
PACKAGING OPTIONS
Tray Pack or 16mm tape, 7” or 13” reels
(Reference tape and reel data sheet 10109)
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10157 - Rev D