NSC COP244C

COP224C/COP225C/COP226C/COP244C/COP245C
Single-Chip 1k and 2k CMOS Microcontrollers
General Description
Features
The COP224C, COP225C, COP226C, COP244C and
COP245C fully static, Single-Chip CMOS Microcontrollers
are members of the COPSTM family, fabricated using double-poly, silicon gate microCMOS technology. These Controller Oriented Processors are complete microcomputers
containing all system timing, internal logic, ROM, RAM, and
I/O necessary to implement dedicated control functions in a
variety of applications. Features include single supply operation, a variety of output configuration options, with an instruction set, internal architecture and I/O scheme designed to facilitate keyboard input, display output and BCD
data manipulation. The COP224C and COP244C are 28 pin
chips. The COP225C and COP245C are 24-pin versions (4
inputs removed) and COP226C is 20-pin version with 15 I/O
lines. Standard test procedures and reliable high-density
techniques provide the medium to large volume customers
with a customized microcontroller at a low end-product cost.
These microcontrollers are appropriate choices in many demanding control environments especially those with human
interface.
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Lowest power dissipation (600 mW typical)
Fully static (can turn off the clock)
Power saving IDLE state and HALT mode
4.4 ms instruction time
2k x 8 ROM, 128 x 4 RAM (COP244C/COP245C)
1k x 8 ROM, 64 x 4 RAM (COP224C/COP225C/
COP226C)
23 I/O lines (COP244C and COP224C)
True vectored interrupt, plus restart
Three-level subroutine stack
Single supply operation (4.5V to 5.5V)
Programmable read/write 8-bit timer/event counter
Internal binary counter register with MICROWIRETM
serial I/O capability
General purpose and TRI-STATEÉ outputs
LSTTL/CMOS output compatible
Software/hardware compatible with COP400 family
Military temperature (b55§ C to a 125§ C) operation
COPSTM , MicrobusTM , and MICROWIRETM are trademarks of National Semiconductor Corp.
TRI-STATEÉ is a registered trademark of National Semiconductor Corp.
Block Diagram
* Not available on COP226C
TL/DD/8422 – 1
FIGURE 1
C1995 National Semiconductor Corporation
TL/DD/8422
RRD-B30M105/Printed in U. S. A.
COP224C/COP225C/COP226C/COP244C/COP245C
Single-Chip 1k and 2k CMOS Microcontrollers
May 1992
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (VCC)
b 55§ C to a 125§ C
b 65§ C to a 150§ C
Lead Temperature
(soldering, 10 seconds)
300§ C
Note: Absolute maximum ratings indicate limits beyond
which damage to the device may occur. DC and AC electrical specifications are not ensured when operating the device at absolute maximum ratings.
6V
Voltage at any Pin
Total Allowable Source Current
Total Allowable Sink Current
Total Allowable Power Dissipation
Operating Temperature Range
Storage Temperature Range
b 0.3V to VCC a 0.3V
25 mA
25 mA
150 mW
DC Electrical Characteristics b55§ CsTAs a 125§ C, a 4.5VsVCCs a 5.5V unless otherwise specified
Parameter
Conditions
Operating Voltage
Power Supply Ripple (Notes 4, 5)
Peak to Peak
Supply Current
(Note 1)
VCC e 5.0V, tc e 4.4 ms
(tc is instruction cycle time)
HALT Mode Current (Note 2)
VCC e 5.0V, FIN e 0 kHz
Input Voltage Levels
RESET, CKI, D0 (clock input)
Logic High
Logic Low
All Other Inputs
Logic High
Logic Low
Min
Max
Units
4.5
5.5
0.25 VCC
V
V
5
mA
200
mA
0.1 VCC
V
V
0.2 VCC
V
V
a 10
mA
7
pF
0.6
V
V
0.2
V
V
0.9 VCC
0.7 VCC
Hi-Z Input Leakage
b 10
Input Capacitance (Note 4)
Output Voltage Levels (except CKO)
LSTTL Operation
Logic High
Logic Low
CMOS Operation
Logic High
Logic Low
CKO Current Levels (As Clock Out)
d4
Sink
d8
d 16
d4
Source
d8
d 16
(
(
Standard Outputs
VCC e 5.0V g 10%
IOH eb100 mA
IOL e 400 mA
IOH eb10 mA
IOL e 10 mA
2.7
VCCb0.2
CKI e VCC, VOUT e VCC
CKI e 0V, VOUT e 0V
0.2
0.4
0.8
b 0.2
b 0.4
b 0.8
mA
mA
mA
mA
mA
mA
Allowable Sink/Source Current per Pin
(Note 6)
5
mA
Allowable Loading on CKO (as HALT)
50
pF
2.0
3.0
mA
mA
a 10
mA
Current Needed to Over-Ride HALT
(Note 3)
To Continue
To Halt
VIN e 0.2 VCC
VIN e 0.7 VCC
TRI-STATE or Open Drain
Leakage Current
b 10
2
AC Electrical Characteristics b55§ CsTAs a 125§ C, a 4.5VsVCCs a 5.5V unless otherwise specified.
Parameter
Conditions
Min
Max
Instruction Cycle Time (tc)
4.4
DC
ms
Operating CKI
Frequency
DC
DC
DC
0.9
1.8
3.6
MHz
MHz
MHz
40
d 4 mode
d 8 mode
d 16 mode
Duty Cycle (Note 4)
(
f1 e 3.6 MHz
Units
60
%
Rise Time (Note 4)
f1 e 3.6 MHz External Clock
60
ns
Fall Time (Note 4)
f1 e 3.6 MHz External Clock
40
ns
Instruction Cycle Time
RC Oscillator (Note 4)
R e 30k g 5%
C e 82 pF g 5% ( d 4 Mode)
18
ms
Inputs: (See Figure 3 ) (Note 4)
tSETUP
6
G Inputs
SI Input
All Others
tc/4 a 0.8
0.33
1.9
0.4
tHOLD
Output Propagation Delay
tPD1, tPD0
ms
ms
ms
ms
VOUT e 1.5V, CL e 100 pF, RL e 5k
1.4
ms
Note 1: Supply current is measured after running for 2000 cycle times with a square-wave clock on CKI, CKO open, and all other pins pulled up to VCC with 5k
resistors. See current drain equation on page 13.
Note 2: The HALT mode will stop CKI from oscillating in the RC and crystal configurations. Test conditions: all inputs tied to VCC, L lines in TRI-STATE mode and
tied to ground, all outputs low and tied to ground.
Note 3: When forcing HALT, current is only needed for a short time (approx. 200 ns) to flip the HALT flip-flop.
Note 4: This parameter is not tested but guaranteed by design. Variation due to the device included.
Note 5: Voltage change must be less than 0.25 volts in a 1 ms period.
Note 6: SO output sink current must be limited to keep VOL less than 0.2 VCC when part is running in order to prevent entering test mode.
RETS COP244CX DC Parameters Test Conditions 5.3V s VCC s 3V Unless Otherwise Specified
Symbol
Parameter
(Note 1)
VCC
Conditions
SBGRP 1
a 25§ C
SBGRP 2
a 125§ C
SBGRP 3
b 55§ C
Min
Min
Min
TestÝ
Max
Max
Drift
Limits Units
Max (25§ C)
IDD1
Supply Current
VDD e 4V,
FIN e 64 kHz
85
155
85
mA
IDD2
Halt Current
VDD e 4V
35
125
35
mA
1 VCC
V
V
2 VCC
V
V
0.4
V
V
0.2
V
V
VIH1
VIL1
VIH2
VIL2
Input Voltage
Reset, CKI:
Logic High
Logic Low
All Other Inputs:
Logic High
Logic Low
VOH2
VOL2
Output Voltage
LSTTL Operation:
Logic High
Logic Low
CMOS Operation:
Logic High
Logic Low
IOH
IOL
Output Current
Logic High
Logic Low
VOH1
VOL1
IIN1
IIN2
9 VCC
7 VCC
4.75V IOH e b100 mA
4.75V IOL e 400 mA
2.7
4.75V IOH e b10 mA
4.75V IOL e 10 mA
VCC b 0.2
3V
3V
V e 0V
V e 3V
7 VCC
7 VCC
2 VCC
2.7
0.4
2.7
0.4
VCC b 0.2
0.2
VCC b 0.2
0.2
b 100
b 100
b 100
200
200
200
b 2.5
b4
DEVICE: COP244C-XXX/883
9 VCC
1 VCC
2 VCC
Input Leakage
High-Z
TRI-STATE or
Open Drain
RETS COP244CX
9 VCC
1 VCC
2.5
b 2.5
4
b4
2.5
b 2.5
2.5
mA
4
b4
4
mA
FUNCTION: 4-BIT CMOS MICROCONTROLLER
3
mA
mA
RETS COP244CX AC Parameters Test Conditions 5.3V s VCC s 3V Unless Otherwise Specified
SBGRP 9
a 25§ C
SBGRP 10
a 125§ C
SBGRP 11
b 55§ C
Min
Max
Min
Max
Min
Drift
Limits Units
Max (25§ C)
tCC
Instruction Cycle
Time (Note 1)
Mode Divided by 8,
VDD e 3V
80
125
80
125
80
125
FIN
Operating Clock
Frequency (Note 1)
VDD e 3V,
30% s Duty Cycle s 50%
64
100
64
100
64
100
Symbol
Parameter
VCC
Inputs
tSETUP (Note 2)
tSETUP-G Inputs
For SKGZ & SKGBZ
(Note 2)
tHOLD (Note 1)
tPD1
tPD2
Output Prop Delay
(Note 1)
RETS COP244CX
Conditions
TestÝ
V e 4.5V
2
32
2
32
0.6
R e 5k, CL e 100 pF
4.5V L
VOUT e 1.5V
0.6
6
6
DEVICE: COP244C-XXXD/883
2
32
ms
6
6
FUNCTION: 4-BIT CMOS MICROCONTROLLER
Note 1: Parameter tested go-no-go only.
Note 2: Guaranteed by design and not tested.
4
kHz
ms
ms
0.6
6
6
ms
ms
ms
Connection Diagrams
S.O. Wide and DIP
S.O. Wide and DIP
Top View
Top View
TL/DD/8422 – 3
Order Number COP225C-XXX/N
or COP245C-XXX/N
See NS Molded Package Number N24A
TL/DD/8422–2
Order Number COP226C-XXX/N
See NS Molded Package Number N20A
Order Number COP225C-XXX/D
or COP245C-XXX/D
See NS Hermetic Package Number D24C
Order Number COP226C-XXX/D
See NS Hermetic Package Number D20A
Order Number COP226C-XXX/WM
See NS Surface Mount Package Number M20B
DIP
28 PLCC
Top View
TL/DD/8422 – 13
TL/DD/8422–4
Order Number COP224C-XXX/V
or COP244C-XXX/V
See NS PLCC Package Number V28A
Order Number COP224C-XXX/N
or COP244C-XXX/N
See NS Molded Package Number N28B
Order Number COP224C-XXX/D
or COP244C-XXX/D
See NS Hermetic Package Number D28C
FIGURE 2
5
Pin Descriptions
Pin
Description
Pin
Description
L7 – L0
8-bit bidirectional
port with TRI-STATE
SK
Logic controlled
clock output
G3 – G0
4-bit bidirectional
I/O port
CKI
Chip oscillator input
CKO
Oscillator output,
HALT I/O port or
general purpose input
D3 – D0
4-bit output port
IN3 – IN0
4-bit input port
(28 pin package only)
RESET
Reset input
SI
Serial input or
counter input
VCC
Most positive
power supply
SO
Serial or general
purpose output
GND
Ground
Functional Description
The internal architecture is shown in Figure 1 . Data paths
are illustrated in simplified form to depict how the various
logic elements communicate with each other in implementing the instruction set of the device. Positive logic is used.
When a bit is set, it is a logic ‘‘1’’, when a bit is reset, it is a
logic ‘‘0’’.
Caution:
The output options available on the COP224C/225C/226C
and COP244C/245C are not the same as those available
on the COP324C/325C/326C, COP344C/345C, COP424C/
425C/426C and COP444C/445C. Options not available on
the COP224C/225C/226C and COP244C/245C are: Option
2 value 2; Option 4 value 0; Option 5 value 1; Option 9 value
0; Option 17 value 1; Option 30, Dual Clock, all values; Option 32, MicrobusTM , all values; Option 33 values 2, 4, and 6;
Option 34 all values; and Option 35 all values.
RAM addressing is implemented by a 7-bit B register whose
upper 3 bits (Br) select 1 of 8 data registers and lower 4 bits
(Bd) select 1 of 16 4-bit digits in the selected data register.
Data memory consists of a 256-bit RAM for the COP224C/
225C/226C, organized as 4 data registers of 16 c 4-bits
digits. The B register is 6 bits long. Upper 2 bits (Br) select 1
of 4 data registers and lower 4 bits (Bd) select 1 of 16 4-bit
digits in the selected data register. While the 4-bit contents
of the selected RAM digit (M) are usually loaded into or
from, or exchanged with, the A register (accumulator), it
may also be loaded into or from the Q latches or T counter
or loaded from the L ports. RAM addressing may also be
performed directly by the LDD and XAD instructions based
upon the immediate operand field of these instructions.
The Bd register also serves as a source register for 4-bit
data sent directly to the D outputs.
PROGRAM MEMORY
Program Memory consists of ROM, 1024 bytes for the
COP224C/225C/226C and 2048 bytes for the COP244C/
245C. These bytes of ROM may be program instructions,
constants or ROM addressing data.
ROM addressing is accomplished by an 11-bit PC register
which selects one of the 8-bit words contained in ROM. A
new address is loaded into the PC register during each instruction cycle. Unless the instruction is a transfer of control
instruction, the PC register is loaded with the next sequential 11-bit binary count value.
Three levels of subroutine nesting are implemented by a
three level deep stack. Each subroutine call or interrupt
pushes the next PC address into the stack. Each return
pops the stack back into the PC register.
INTERNAL LOGIC
The processor contains its own 4-bit A register (accumulator) which is the source and destination register for most I/O,
arithmetic, logic, and data memory access operations. It can
also be used to load the Br and Bd portions of the B register, to load and input 4 bits of the 8-bit Q latch or T counter,
to input 4 bits of L I/O ports data, to input 4-bit G, or IN
ports, and to perform data exchanges with the SIO register.
A 4-bit adder performs the arithmetic and logic functions,
storing the results in A. It also outputs a carry bit to the 1-bit
C register, most often employed to indicate arithmetic overflow. The C register in conjunction with the XAS instruction
and the EN register, also serves to control the SK output.
The 8-bit T counter is a binary up counter which can be
loaded to and from M and A using CAMT and CTMA instructions. This counter may be operated in two modes depending on a mask-programmable option: as a timer or as an
external event counter. When the T counter overflows, an
DATA MEMORY
Data memory consists of a 512-bit RAM for the COP244C/
245C, organized as 8 data registers of 16 c 4-bit digits.
6
Functional Description (Continued)
overflow flag will be set (see SKT and IT instructions below).
The T counter is cleared on reset. A functional block diagram of the timer/counter is illustrated in Figure 7 .
SIO. SO can be enabled to output the most significant bit
of SIO each cycle time. The SK outputs SKL ANDed with
the instruction cycle clock.
Four general-purpose inputs, IN3–IN0, are provided.
The D register provides 4 general-purpose outputs and is
used as the destination register for the 4-bit contents of Bd.
The G register contents are outputs to a 4-bit general-purpose bidirectional I/O port.
The Q register is an internal, latched, 8-bit register, used to
hold data loaded to or from M and A, as well as 8-bit data
from ROM. Its contents are outputted to the L I/O ports
when the L drivers are enabled under program control.
The 8 L drivers, when enabled, output the contents of
latched Q data to the L I/O port. Also, the contents of L may
be read directly into A and M.
The SIO register functions as a 4-bit serial-in/serial-out shift
register for MICROWIRE I/O and COPS peripherals, or as a
binary counter (depending on the contents of the EN register). Its contents can be exchanged with A.
The XAS instruction copies C into the SKL latch. In the
counter mode, SK is the output of SKL; in the shift register
mode, SK outputs SKL ANDed with the clock.
EN is an internal 4-bit register loaded by the LEI instruction.
The state of each bit of this register selects or deselects the
particular feature associated with each bit of the EN register:
0. The least significant bit of the enable register, EN0, selects the SIO register as either a 4-bit shift register or a
4-bit binary counter. With EN0 set, SIO is an asynchronous binary counter, decrementing its value by one upon
each low-going pulse (‘‘1’’ to ‘‘0’’) occurring on the SI
input. Each pulse must be at least two instruction cycles
wide. SK outputs the value of SKL. The SO output equals
the value of EN3. With EN0 reset, SIO is a serial shift
register left shifting 1 bit each instruction cycle time. The
data present at SI goes into the least significant bit of
1. With EN1 set, interrupt is enabled. Immediately following
an interrupt, EN1 is reset to disable further interrupts.
2. With EN2 set, the L drivers are enabled to output the data
in Q to the L I/O port. Resetting EN2 disables the L drivers, placing the L I/O port in a high-impedance input
state.
3. EN3, in conjunction with EN0, affects the SO output. With
EN0 set (binary counter option selected) SO will output
the value loaded into EN3. With EN0 reset (serial shift
register option selected), setting EN3 enables SO as the
output of the SIO shift register, outputting serial shifted
data each instruction time. Resetting EN3 with the serial
shift register option selected disables SO as the shift register output; data continues to be shifted through SIO and
can be exchanged with A via an XAS instruction but SO
remains set to ‘‘0’’.
INTERRUPT
The following features are associated with interrupt procedure and protocol and must be considered by the programmer when utilizing interrupts.
a. The interrupt, once recognized as explained below,
pushes the next sequential program counter address
(PC a 1) onto the stack. Any previous contents at the bottom of the stack are lost. The program counter is set to
hex address 0FF (the last word of page 3) and EN1 is
reset.
b. An interrupt will be recognized only on the following conditions:
1. EN1 has been set.
2. A low-going pulse (‘‘1’’ to ‘‘0’’) at least two instruction
cycles wide has occurred on the IN1 input.
3. A currently executing instruction has been completed.
TL/DD/8422 – 5
FIGURE 3. Input/Output Timing Diagrams (divide by 8 mode)
TABLE I. Enable Register Modes Ð Bits EN0 and EN3
EN0 EN3
0
0
0
1
1
0
1
1
SIO
Shift
Register
Shift
Register
Binary
Counter
Binary
Counter
SI
SO
SK
Input to Shift
0
If SKL e 1,SK e clock
Register
If SKL e 0,SK e 0
Input to Shift Serial If SKL e 1,SK e clock
Register
out If SKL e 0,SK e 0
Input to
0
SK e SKL
Counter
Input to
1
SK e SKL
Counter
7
Functional Description (Continued)
4. All successive transfer of control instructions and successive LBIs have been completed (e.g. if the main
program is executing a JP instruction which transfers
program control to another JP instruction, the interrupt
will not be acknowledged until the second JP instruction has been executed).
c. Upon acknowledgement of an interrupt, the skip logic
status is saved and later restored upon popping of the
stack. For example, if an interrupt occurs during the execution of ASC (Add with Carry, Skip on Carry) instruction
which results in carry, the skip logic status is saved and
program control is transferred to the interrupt servicing
routine at hex address 0FF. At the end of the interrupt
routine, a RET instruction is executed to pop the stack
and return program control to the instruction following the
original ASC. At this time, the skip logic is enabled and
skips this instruction because of the previous ASC carry.
Subroutines should not be nested within the interrupt
service routine, since their popping of the stack will enable any previously saved main program skips, interfering
with the orderly execution of the interrupt routine.
d. The instruction at hex address 0FF must be a NOP.
e. An LEI instruction may be put immediately before the
RET instruction to re-enable interrupts.
TIMER
There are two modes selected by mask option:
a. Time-base counter. In this mode, the instruction cycle frequency generated from CKI passes through a 2-bit divideby-4 prescaler. The output of this prescaler increments
the 8-bit T counter thus providing a 10-bit timer. The prescaler is cleared during execution of a CAMT instruction
and on reset.
For example, using a 3.58 MHz crystal with a divide-by-16
option, the instruction cycle frequency of 223.70 kHz increments the 10-bit timer every 4.47 ms. By presetting the
counter and detecting overflow, accurate timeouts between 17.88 ms (4 counts) and 4.577 ms (1024 counts)
are possible. Longer timeouts can be achieved by accumulating, under software control, multiple overflows.
b. External event counter. In this mode, a low-going pulse
(‘‘1’’ to ‘‘0’’) at least 2 instruction cycles wide on the IN2
input will increment the 8-bit T counter.
Note: The IT instruction is not allowed in this mode.
INITIALIZATION
The internal reset logic will initialize the device upon powerup if the power supply rise time is less than 1 ms and if the
operating frequency at CKI is greater than 32 kHz, otherwise the external RC network shown in Figure 4 must be
connected to the RESET pin (the conditions in Figure 4
must be met). The RESET pin is configured as a Schmitt
trigger input. If not used, it should be connected to VCC.
Initialization will occur whenever a logic ‘‘0’’ is applied to the
RESET input, providing it stays low for at least three instruction cycle times.
Note: If CKI clock is less than 32 kHz, the internal reset logic (option
Ý29 e 1) MUST be disabled and the external RC circuit must be used.
TL/DD/8422 – 7
Crystal or Resonator
Crystal
Value
R1
Component Values
R2
C1(pF)
C2(pF)
32 kHz
455 kHz
2.096 MHz
3.6 MHz
220k
5k
2k
1k
20M
10M
1M
1M
30
80
30
30
6 – 36
40
6 – 36
6 – 36
TL/DD/8422–6
FIGURE 4. Power-Up Circuit
RC Controlled Oscillator
Upon initialization, the PC register is cleared to 0 (ROM address 0) and the A, B, C, D, EN, IL, T and G registers are
cleared. The SKL latch is set, thus enabling SK as a clock
output. Data Memory (RAM) is not cleared upon initialization. The first instruction at address 0 must be a CLRA
(clear A register).
R
C
Cycle
Time
VCC
30k
82 pF
6 – 18 ms
t 4.5V
Note: 15k s R s 150k
50 pF s C s 150 pF
FIGURE 5. Oscillator Component Values
8
Functional Description (Continued)
the external driver returns to high impedance state.
By forcing a low level to CKO, the chip will continue
and CKO will stay low.
HALT MODE
The COP244C/245C/224C/225C/226C is a FULLY STATIC circuit; therefore, the user may stop the system oscillator
at any time to halt the chip. The chip may also be halted by
the HALT instruction or by forcing CKO high when it is
mask-programmed as a HALT I/O port. Once in the HALT
mode, the internal circuitry does not receive any clock signal and is therefore frozen in the exact state it was in when
halted. All information is retained until continuing. The chip
may be awakened by one of two different methods:
# As another option, CKO can be a general purpose input, read into bit 2 of A (accumulator) upon execution
of an INIL instruction.
OSCILLATOR OPTIONS
There are three basic clock oscillator configurations available as shown by Figure 5 .
a. Crystal Controlled Oscillator. CKI and CKO are connected to an external crystal. The instruction cycle time equals
the crystal frequency optionally divided by 4, 8 or 16.
b. External Oscillator. The external frequency is optionally
divided by 4, 8 or 16 to give the instruction cycle time.
CKO is the HALT I/O port or a general purpose input.
c. RC Controlled Oscillator. CKI is configured as a single pin
RC controlled Schmitt trigger oscillator. The instruction
cycle equals the oscillation frequency divided by 4. CKO
is the HALT I/O port or a general purpose input.
# Continue function: by forcing CKO low, if it mask-programmed as a HALT I/O port, the system clock is re-enabled and the circuit continues to operate from the point
where it was stopped.
# Restart: by forcing the RESET pin low (see Initialization).
The HALT mode is the minimum power dissipation state.
CKO PIN OPTIONS
a. Two-pin oscillatorÐ(Crystal). See Figure 6a .
In a crystal controlled oscillator system, CKO is used as
an output to the crystal network. The HALT mode may be
entered by program control (HALT instruction) which
forces CKO high, thus inhibiting the crystal network. The
circuit can be awakened only by forcing the RESET pin to
a logic ‘‘0’’ (restart).
b. One-pin oscillatorÐ(RC or external). See Figure 6b .
Figure 7 shows the clock and timer diagram.
COP245C AND COP225C 24-PIN PACKAGE OPTION
If the COP244C/224C is bonded in a 24-pin package, it becomes the COP245C/225C, illustrated in Figure 2 , Connection diagrams. Note that the COP245C/225C does not contain the four general purpose IN inputs (IN3 – IN0). Use of
this option precludes, of course, use of the IN options, interrupt feature, external event counter feature.
If a one-pin oscillator system is chosen, two options are
available for CKO:
Note: If user selects the 24-pin package, options 9, 10, 19 and 20 must be
selected as a ‘‘2’’. See option list.
# CKO can be selected as the HALT I/O port. In that
case, it is an I/O flip-flop which is an indicator of the
HALT status. An external signal can over-ride this pin
to start and stop the chip. By forcing a high level to
CKO, the chip will stop as soon as CKI is high and
CKO output will stay high to keep the chip stopped if
COP226C 20-PIN PACKAGE OPTION
If the COP225C is bonded as 20-pin device it becomes the
COP226C. Note that the COP226C contains all the
COP225C pins except D0, D1, G0, and G1.
Block Diagram
TL/DD/8422 – 8
FIGURE 6a. Halt ModeÐTwo-Pin Oscillator
9
Block Diagrams (Continued)
TL/DD/8422 – 9
FIGURE 6b. Halt ModeÐOne-Pin Oscillator
TL/DD/8422 – 10
FIGURE 7. Clock and Timer
10
Instruction Set
Table II is a symbol table providing internal architecture, instruction operand and operation symbols used in the instruction set table.
Instruction Operand Symbols
d
r
4-bit operand field, 0 – 15 binary (RAM digit select)
3(2)-bit operand field, 0 – 7(3) binary
(RAM register select)
a
11-bit operand field, 0 – 2047 (1023)
y
4-bit operand field, 0 – 15 (immediate data)
RAM(x) RAM addressed by variable x
ROM(x) ROM addressed by variable x
TABLE II. Instruction Set Table Symbols
Symbol
Definition
Internal Architecture Symbols
A
B
Br
4-bit accumulator
7-bit RAM address register (6-bit for COP224C)
Upper 3 bits of B (register address)
(2-bit for COP224C)
Bd
Lower 4 bits of B (digit address)
C
1-bit carry register
D
4-bit data output port
EN
4-bit enable register
G
4-bit general purpose I/O port
IL
two 1-bit (IN0 and IN3) latches
IN
4-bit input port
L
8-bit TRI-STATE I/O port
M
4-bit contents of RAM addressed by B
PC
11-bit ROM address program counter
Q
8-bit latch for L port
SA,SB,SC 11-bit 3-level subroutine stack
SIO
4-bit shift register and counter
SK
Logic-controlled clock output
SKL
1-bit latch for SK output
T
8-bit timer
Operational Symbols
a
b
x
Ý
e
A
Z
:
Plus
Minus
Replaces
Is exchanged with
Is equal to
One’s complement of A
Exclusive-or
Range of values
Table III provides the mnemonic, operand, machine code
data flow, skip conditions and description of each instruction.
TABLE III. COP244C/245C Instruction Set
Mnemonic
Operand
Hex
Code
Machine
Language
Code
(Binary)
Data Flow
Skip
Conditions
Description
ARITHMETIC INSTRUCTIONS
ASC
30
À 0011 À 0000 À
A a C a RAM(B) x A
Carry x C
Carry
Add with Carry, Skip on
Carry
ADD
31
À 0011 À 0001 À
A a RAM(B) x A
None
Add RAM to A
ADT
4A
À 0100 À 1010 À
A a 1010 x A
None
Add Ten to A
5b
À 0101 À
AayxA
Carry
Add Immediate. Skip on
Carry (y i 0)
CASC
10
À 0001 À 0000 À
A a RAM(B) a C x A
Carry x C
Carry
Complement and Add with
Carry, Skip on Carry
CLRA
00
À 0000 À 0000 À
0xA
None
Clear A
COMP
40
À 0100 À 0000 À
AxA
None
Ones complement of A to A
NOP
44
À 0100 À 0100 À
None
None
No Operation
RC
32
À 0011 À 0010 À
‘‘0’’ x C
None
Reset C
SC
22
À 0010 À 0010 À
‘‘1’’ x C
None
Set C
XOR
02
À 0000 À 0010 À
A Z RAM(B) x A
None
Exclusive-OR RAM with A
AISC
y
y
À
11
Instruction Set (Continued)
TABLE III. COP244C/245C Instruction Set (Continued)
Mnemonic
Operand
Hex
Code
Machine
Language
Code
(Binary)
Data Flow
Skip
Conditions
Description
TRANSFER CONTROL INSTRUCTIONS
JID
FF
À 1111 À 1111 À
ROM (PC10:8 A,M) x PC7:0
None
Jump Indirect (Notes 1, 3)
JMP
a
6b
bb
À 0110 À 0 À a10:8 À
À a7:0 À
a x PC
None
Jump
JP
a
bb
À 1 À a6:0 À
(pages 2, 3 only)
or
À 11 À a5:0 À
(all other pages)
a x PC6:0
None
Jump within Page (Note 4)
bb
a x PC5:0
JSRP
a
bb
À 10 À a5:0 À
PC a 1 x SA x SB x SC
00010 x PC10:6
a x PC5:0
None
Jump to Subroutine Page
(Note 5)
JSR
a
6b
bb
À 0110 À 1 À a10:8 À
À a7:0 À
PC a 1 x SA x SB x SC
a x PC
None
Jump to Subroutine
RET
48
À 0100 À 1000 À
SC x SB x SA x PC
None
Return from Subroutine
RETSK
49
À 0100 À 1001 À
SC x SB x SA x PC
Always Skip
on Return
Return from Subroutine
then Skip
HALT
33
38
33
39
À 0011 À 0011 À
À 0011 À 1000 À
À 0011 À 0011 À
À 0011 À 1001 À
None
HALT Processor
None
IDLE till Timer
Overflows then Continues
IT
MEMORY REFERENCE INSTRUCTIONS
CAMT
33
3F
À 0011 À 0011 À
À 0011 À 1111 À
A x T7:4
RAM(B) x T3:0
None
Copy A, RAM to T
CTMA
33
2F
À 0011 À 0011 À
À 0010 À 1111 À
T7:4 x RAM(B)
T3:0 x A
None
Copy T to RAM, A
CAMQ
33
3C
À 0011 À 0011 À
À 0011 À 1100 À
A x Q7:4
RAM(B) x Q3:0
None
Copy A, RAM to Q
CQMA
33
2C
À 0011 À 0011 À
À 0010 À 1100 À
Q7:4 x RAM(B)
Q3:0 x A
None
Copy Q to RAM, A
b5
À 00 À r À 0101 À
(r e 0:3)
RAM(B) x A
Br Z r x Br
None
Load RAM into A,
Exclusive-OR Br with r
23
À 0010 À 0011 À
À0 À r À d À
RAM(r,d) x A
None
bb
Load A with RAM pointed
to directly by r,d
BF
À 1011 À 1111 À
ROM(PC10:8,A,M) x Q
SB x SC
None
Load Q Indirect (Note 3)
LD
LDD
r
r,d
LQID
RMB
0
1
2
3
4C
45
42
43
À 0100 À 1100 À
À 0100 À 0101 À
À 0100 À 0010 À
À 0100 À 0011 À
0 x RAM(B)0
0 x RAM(B)1
0 x RAM(B)2
0 x RAM(B)3
None
Reset RAM Bit
SMB
0
1
2
3
4D
47
46
4B
À 0100 À 1101 À
À 0100 À 0111 À
À 0100 À 0110 À
À 0100 À 1011 À
1 x RAM(B)0
1 x RAM(B)1
1 x RAM(B)2
1 x RAM(B)3
None
Set RAM Bit
12
Instruction Set (Continued)
TABLE III. COP244C/245C Instruction Set (Continued)
Mnemonic
Operand
Hex
Code
Machine
Language
Code
(Binary)
Data Flow
Skip
Conditions
Description
MEMORY REFERENCE INSTRUCTIONS (Continued)
y x RAM(B)
Bd a 1 x Bd
None
Store Memory Immediate
1 and Increment Bd
À 00 À r À 0110 À
(r e 0:3)
RAM(B) Ý A
Br Z r x Br
None
Exchange RAM with A,
Exclusive-OR Br with r
À 0010 À 0011 À
À1À r À d À
RAM(r,d) Ý A
None
Exchange A with RAM
Pointed to Directly by r,d
STII
y
7b
À 0111 À
X
r
b6
23
XAD
r,d
bb
y
À
XDS
r
b7
À 00 À r À 0111 À
(r e 0:3)
RAM(B) Ý A
Bdb1 x Bd
Br Z r x Br
Bd
decrements
past 0
Exchange RAM with A
and Decrement Bd.
Exclusive-OR Br with r
XIS
r
b4
À 00 À r À 0100 À
(r e 0:3)
RAM(B) Ý A
Bd a 1 x Bd
Br Z r x Br
Bd
increments
past 15
Exchange RAM with A
and Increment Bd,
Exclusive-OR Br with r
REGISTER REFERENCE INSTRUCTIONS
CAB
50
À 0101 À 0000 À
A x Bd
None
Copy A to Bd
CBA
4E
À 0100 À 1110 À
Bd x A
None
Copy Bd to A
bb
À 00 À r À (d– 1) À
(r e 0:3:
d e 0,9:15)
or
À 0011 À 0011 À
À1À r À d À
(any r, any d)
r,d x B
Skip until
not a LBI
Load B Immediate with r,d
(Note 6)
33
6b
À 0011 À 0011 À
À 0110 À y À
y x EN
None
Load EN Immediate (Note 7)
12
À 0001 À 0010 À
A Ý Br
None
Exchange A with Br (Note 8)
SKC
20
À 0010 À 0000 À
C e ‘‘1’’
Skip if C is True
SKE
21
À 0010 À 0001 À
A e RAM(B)
Skip if A Equals RAM
33
21
À 0011 À 0011 À
À 0010 À 0001 À
G3:0 e 0
Skip if G is Zero
(all 4 bits)
0
1
2
3
33
01
11
03
13
À 0011 À 0011 À
À 0000 À 0001 À
À 0001 À 0001 À
À 0000 À 0011 À
À 0001 À 0011 À
0
1
2
3
01
11
03
13
À 0000 À 0001 À
À 0001 À 0001 À
À 0000 À 0011 À
À 0001 À 0011 À
RAM(B)0 e 0
RAM(B)1 e 0
RAM(B)2 e 0
RAM(B)3 e 0
Skip if RAM Bit is Zero
41
À 0100 À 0001 À
A time-base
counter carry
has occurred
since last test
Skip on Timer
(Note 3)
LBI
r,d
33
bb
LEI
y
XABR
TEST INSTRUCTIONS
SKGZ
SKGBZ
SKMBZ
SKT
1st byte
*
2nd byte
13
Skip if G Bit is Zero
G0 e 0
G1 e 0
G2 e 0
G3 e 0
Instruction Set (Continued)
TABLE III. COP244C/245C Instruction Set (Continued)
Mnemonic
Operand
Hex
Code
Machine
Language
Code
(Binary)
Data Flow
Skip
Conditions
Description
INPUT/OUTPUT INSTRUCTIONS
ING
33
2A
À 0011 À 0011 À
À 0010 À 1010 À
GxA
None
Input G Ports to A
ININ
33
28
À 0011 À 0011 À
À 0010 À 1000 À
IN x A
None
Input IN Inputs to A
(Note 2)
INIL
33
29
À 0011 À 0011 À
À 0010 À 1001 À
IL3, CKO,‘‘0’’, IL0 x A
None
Input IL Latches to A
(Note 3)
INL
33
2E
À 0011 À 0011 À
À 0010 À 1110 À
L7:4 x RAM(B)
L3:0 x A
None
Input L Ports to RAM,A
OBD
33
3E
À 0011 À 0011 À
À 0011 À 1110 À
Bd x D
None
Output Bd to D Outputs
33
5b
À 0011 À 0011 À
À 0101 À y À
yxG
None
Output to G Ports
Immediate
OMG
33
3A
À 0011 À 0011 À
À 0011 À 1010 À
RAM(B) x G
None
Output RAM to G Ports
XAS
4F
À 0100 À 1111 À
A Ý SIO, C x SKL
None
Exchange A with SIO
(Note 3)
OGI
y
Note 1: All subscripts for alphabetical symbols indicate bit numbers unless explicitly defined (e.g., Br and Bd are explicitly defined). Bits are numbered 0 to N where
0 signifies the least significant bit (low-order, right-most bit). For example, A3 indicates the most significant (left-most) bit of the 4-bit A register.
Note 2: The ININ instruction is not available on the 24-pin packages since these devices do not contain the IN inputs.
Note 3: For additional information on the operation of the XAS, JID, LQID, INIL, and SKT instructions, see below.
Note 4: The JP instruction allows a jump, while in subroutine pages 2 or 3, to any ROM location within the two-page boundary of pages 2 or 3. The JP instruction,
otherwise, permits a jump to a ROM location within the current 64-word page. JP may not jump to the last word of a page.
Note 5: A JSRP transfers program control to subroutine page 2 (0010 is loaded into the upper 4 bits of P). A JSRP may not be used when in pages 2 or 3. JSRP
may not jump to the last word in page 2.
Note 6: LBI is a single-byte instruction if d e 0, 9, 10, 11, 12, 13, 14, or 15. The machine code for the lower 4 bits equals the binary value of the ‘‘d’’ data minus 1 ,
e.g., to load the lower four bits of B(Bd) with the value 9 (10012), the lower 4 bits of the LBI instruction equal 8 (10002). To load 0, the lower 4 bits of the LBI
instruction should equal 15 (11112).
Note 7: Machine code for operand field y for LEI instruction should equal the binary value to be latched into EN, where a ‘‘1’’ or ‘‘0’’ in each bit of EN corresponds
with the selection or deselection of a particular function associated with each bit. (See Functional Description, EN Register.)
Note 8: For 2K ROM devices, A
Ý Br (0 x A3). For 1K ROM devices, A Ý Br (0,0 x A3, A2).
14
Description of Selected Instructions
pulse stays low for at least two instruction cycles. Execution
of an INIL inputs IL3 and IL0 into A3 and A0 respectively,
and resets these latches to allow them to respond to subsequent low-going pulses on the IN3 and IN0 lines. If CKO is
mask programmed as a general purpose input, an INIL will
input the state of CKO into A2. If CKO has not been so
programmed, a ‘‘1’’ will be placed in A2. A0 is input into A1.
IL latches are cleared on reset. IL latches are not available
on the COP245C/225C, and COP226C.
XAS INSTRUCTION
XAS (Exchange A with SIO) copies C to the SKL latch and
exchanges the accumulator with the 4-bit contents of the
SIO register. The contents of SIO will contain serial-in/serial-out shift register or binary counter data, depending on the
value of the EN register. If SIO is selected as a shift register,
an XAS instruction can be performed once every 4 instruction cycles to effect a continuous data stream.
LQID INSTRUCTION
LQID (Load Q Indirect) loads the 8-bit Q register with the
contents of ROM pointed to by the 11-bit word
PC10:PC8,A,M. LQID can be used for table lookup or code
conversion such as BCD to seven-segment. The LQID instruction ‘‘pushes’’ the stack (PC a 1 x SA x SB x SC)
and replaces the least significant 8 bits of the PC as follows:
A x PC7:4, RAM(B) x PC3:0, leaving PC10, PC9 and
PC8 unchanged. The ROM data pointed to by the new address is fetched and loaded into the Q latches. Next, the
stack is ‘‘popped’’ (SC x SB x SA x PC), restoring the
saved value of PC to continue sequential program execution. Since LQID pushes SB x SC, the previous contents
of SC are lost.
INSTRUCTION SET NOTES
a. The first word of a program (ROM address 0) must be a
CLRA (Clear A) instruction.
b. Although skipped instructions are not executed, they are
still fetched from the program memory. Thus program
paths take the same number of cycles whether instructions are skipped or executed except for JID, and LQID.
c. The ROM is organized into pages of 64 words each. The
Program Counter is a 11-bit binary counter, and will count
through page boundaries. If a JP, JSRP, JID, or LQID is
the last word of a page, it operates as if it were in the next
page. For example: a JP located in the last word of a
page will jump to a location in the next page. Also, a JID
or LQID located in the last word of every fourth page (i.e.
hex address 0FF, 1FF, 2FF, 3FF, 4FF, etc.) will access
data in the next group of four pages.
Note: LQID uses 2 instruction cycles if executed, one if skipped.
JID INSTRUCTION
JID (Jump Indirect) is an indirect addressing instruction,
transferring program control to a new ROM location pointed
to indirectly by A and M. It loads the lower 8 bits of the ROM
address register PC with the contents of ROM addressed by
the 11-bit word, PC10:8,A,M. PC10,PC9 and PC8 are not
affected by JID.
Note: The COP224C/225C/226C needs only 10 bits to address its ROM.
Therefore, the eleventh bit (P10) is ignored.
Power Dissipation
The lowest power drain is when the clock is stopped. As the
frequency increases so does current. Current is also lower
at lower operating voltages. Therefore, the user should run
at the lowest speed and voltage that his application will allow. The user should take care that all pins swing to full
supply levels to insure that outputs are not loaded down and
that inputs are not at some intermediate level which may
draw current. Any input with a slow rise or fall time will draw
additional current. A crystal or resonator generated clock
input will draw additional current. For example, a 500 kHz
crystal input will typically draw 100 mA more than a squarewave input. An R/C oscillator will draw even more current
since the input is a slow rising signal.
If using an external squarewave oscillator, the following
equation can be used to calculate operating current drain.
Note: JID uses 2 instruction cycles if executed, one if skipped.
SKT INSTRUCTION
The SKT (Skip On Timer) instruction tests the state of the T
counter overflow latch (see internal logic, above), executing
the next program instruction if the latch is not set. If the
latch has been set since the previous test, the next program
instruction is skipped and the latch is reset. The features
associated with this instruction allow the processor to generate its own time-base for real-time processing, rather than
relying on an external input signal.
Note: If the most significant bit of the T counter is a 1 when a CAMT instruction loads the counter, the overflow flag will be set. The following
sample of codes should be used when loading the counter:
CAMT ; load T counter
SKT
ICO e IQ a V c 70 c Fi a V c 2400 c Fi/Dv
where:
ICO e chip operating current drain in microamps
IQ e quiescent leakage current (from curve)
Fi e CKI frequency in MegaHertz
V e chip VCC in volts
Dv e divide by option selected
; skip if overflow flag is set and reset it
NOP
IT INSTRUCTION
The IT (idle till timer) instruction halts the processor and
puts it in an idle state until the time-base counter overflows.
This idle state reduces current drain since all logic (except
the oscillator and time base counter) is stopped. IT instruction is not allowed if the T counter is mask-programmed as
an external event counter (option Ý31 e 1).
For example at 5 volts VCC and 400 kHz (divide by 4)
ICO e 120 a 5 c 70 c 0.4 a 5 c 2400 c 0.4/4
ICO e 120 a 140 a 1200 e 1460 mA
INIL INSTRUCTION
INIL (Input IL Latches to A) inputs 2 latches, IL3 and IL0,
CKO and 0 into A. The IL3 and IL0 latches are set if a lowgoing pulse (‘‘1’’ to ‘‘0’’) has occurred on the IN3 and IN0
inputs since the last INIL instruction, provided the input
15
Power Dissipation (Continued)
If an IT instruction is executed, the chip goes into the IDLE
mode until the timer overflows. In IDLE mode, the current
drain can be calculated from the following equation:
I/O OPTIONS
Outputs have the following optional configurations, illustrated in Figure 8 :
a. Standard Ð A CMOS push-pull buffer with an N-channel
device to ground in conjunction with a P-channel device
to VCC, compatible with CMOS and LSTTL.
b. Open Drain Ð An N-channel device to ground only, allowing external pull-up as required by the user’s application.
c. Standard TRI-STATE L Output Ð A CMOS output buffer
similar to a. which may be disabled by program control.
d. Open-Drain TRI-STATE L Output Ð This has the N-channel device to ground only.
Ici e IQ a V c 70 c Fi
For example, at 5 volts VCC and 400 kHz
Ici e 120 a 5 c 70 c 0.4 e 260 mA
The total average current will then be the weighted average
of the operating current and the idle current:
Ita e ICO c
where:
To
Ti
a Ici c
To a Ti
To a Ti
Ita e total average current
ICO e operating current
Ici e idle current
To e operating time
Ti e idle time
All inputs have the following option:
e. Hi-Z input which must be driven by the users logic.
All output drivers use two common devices numbered 1 to
2. Minimum and maximum current (IOUT and VOUT) curves
are given in Figure 9 for each of these devices to allow the
designer to effectively use these I/O configurations.
b. Open-Drain Output
a. Standard Push-Pull Output
TL/DD/8422 – 11
c. Standard TRI-STATE ‘‘L’’ Output
d. Open Drain TRI-STATE
‘‘L’’ Output
FIGURE 8. Input/Output Configurations
16
e. Hi-Z Input
Power Dissipation (Continued)
Minimum Sink Current
(Except CKO)
Minimum Source Current
(Except CKO)
Maximum Quiescent Current
TL/DD/8422 – 12
FIGURE 9. Input/Output Characteristics
Option List
Option 4: RESET input
e 1: Hi-Z input
Option 5: L7 Driver
e 0: Standard TRI-STATE push-pull output
e 2: Open-drain TRI-STATE output
Option 6: L6 Driver Ð (same as option 5)
Option 7: L5 Driver Ð (same as option 5)
Option 8: L4 Driver Ð (same as option 5)
Option 9: IN1 input
e 1: Hi-Z input, mandatory for 28 Pin Package
e 2: Mandatory for 20 and 24 Pin Packages
Option 10: IN2 input Ð (same as option 9)
Option 11 e 0: VCC Pin Ð no option available
Option 12: L3 Driver Ð (same as option 5)
Option 13: L2 Driver Ð (same as option 5)
Option 14: L1 Driver Ð (same as option 5)
Option 15: L0 Driver Ð (same as option 5)
Option 16: SI input Ð (same as option 4)
Option 17: SO Driver
e 0: Standard push-pull output
e 2: Open-drain output
Option 18: SK Driver Ð (same as option 17)
Option 19: IN0 Input Ð (same as option 9)
Option 20: IN3 Input Ð (same as option 9)
Option 21: G0 I/O Port Ð (same as option 17)
Option 22: G1 I/O Port Ð (same as option 17)
Option 23: G2 I/O Port Ð (same as option 17)
Option 24: G3 I/O Port Ð (same as option 17)
Option 25: D3 Output Ð (same as option 17)
Option 26: D2 Output Ð (same as option 17)
Option 27: D1 Output Ð (same as option 17)
The COP244C/245C/224C/225C/COP226C mask-programmable options are assigned numbers which correspond with the COP244C/224C pins.
The following is a list of options. The options are programmed at the same time as the ROM pattern to provide
the user with the hardware flexibility to interface to various
I/O components using little or no external circuitry.
Caution:
The output options available on the COP224C/225C/226C
and COP244C/245C are not the same as those available
on the COP324C/325C/326C, COP344C/345C, COP424C/
425C/426C and COP444C/445C. Options not available on
the COP224C/225C/226C and COP244C/245C are: Option
2 value 2; Option 4 value 0; Option 5 value 1; Option 9 value
0; Option 17 value 1; Option 30, Dual Clock, all values; Option 32, Microbus, all values; Option 33 values 2 4, and 6;
Option 34 all values; and Option 35 all values.
PLEASE FILL OUT THE OPTION TABLE on the next page.
Photocopy the option data and send it in with your disk or
EPROM.
Option 1 e 0: Ground Pin Ð no options available
Option
e 0:
e 1:
e 3:
Option
e 0:
e 1:
e 2:
e 4:
e 5:
e 6:
e 7:
2: CKO Pin
clock generator output to crystal/resonator
HALT I/O port
general purpose input, high-Z
3: CKI input
Crystal controlled oscillator input divide by 4
Crystal controlled oscillator input divide by 8
Crystal controlled oscillator input divide by 16
Single-pin RC controlled oscillator (divide by 4)
External oscillator input divide by 4
External oscillator input divide by 8
External oscillator input divide by 16
17
Option List (Continued)
Option 33: COP bonding. See note.
Option 28: D0 Output Ð (same as option 17)
(1k and 2k Microcontroller)
Option 29: Internal Initialization Logic
e 0: Normal operation
e 1: No internal initialization logic
Option 30 e 0: No Option Available
Option 31: Timer
e 0: Time-base counter
e 1: External event counter
Option 32 e 0: No Option Available
e 0: 28-pin package
e 1: 24-pin package
(1k Microcontroller only)
e 3: 20-pin package
e 5: 24- and 20-pin package
Note:ÐIf opt. Ý33 e 0 then opt. Ý9, 10, 19, and 20
must e 1.
If opt. Ý33 e 1 then opt. Ý9, 10, 19 and 20 must e 2, and
option Ý31 must e 0.
If opt. Ý33 e 3 or 5 then opt. Ý9, 10, 19, 20 must e 2 and
opt. Ý21, 22, 31 must e 0.
Option 34 e 0: No Option Available
Option 35 e 0: No Option Available
Option Table
The following option information is to be sent to National along with the EPROM.
OPTION DATA
OPTION DATA
0
IS: GROUND PIN
OPTION 19 VALUE e
IS: IN0 INPUT
2 VALUE e
IS: CKO PIN
OPTION 20 VALUE e
IS: IN3 INPUT
OPTION
3 VALUE e
IS: CKI INPUT
OPTION 21 VALUE e
IS: G0 I/O PORT
OPTION
4 VALUE e
IS: RESET INPUT
OPTION 22 VALUE e
IS: G1 I/O PORT
OPTION
5 VALUE e
IS: L7 DRIVER
OPTION 23 VALUE e
IS: G2 I/O PORT
OPTION
6 VALUE e
IS: L6 DRIVER
OPTION 24 VALUE e
IS: G3 I/O PORT
OPTION
7 VALUE e
IS: L5 DRIVER
OPTION 25 VALUE e
IS: D3 OUTPUT
OPTION
8 VALUE e
IS: L4 DRIVER
OPTION 26 VALUE e
IS: D2 OUTPUT
OPTION
9 VALUE e
IS: IN1 INPUT
OPTION 27 VALUE e
IS: D1 OUTPUT
IS: IN2 INPUT
OPTION 28 VALUE e
IS: D0 OUTPUT
IS: VCC PIN
OPTION 29 VALUE e
OPTION
1 VALUE e
OPTION
1
OPTION 10 VALUE e
OPTION 11 VALUE e
0
OPTION 12 VALUE e
IS: L3 DRIVER
OPTION 30 VALUE e
OPTION 13 VALUE e
IS: L2 DRIVER
OPTION 31 VALUE e
OPTION 14 VALUE e
OPTION 15 VALUE e
OPTION 32 VALUE e
IS: L0 DRIVER
OPTION 33 VALUE e
IS: N/A
IS: COP BONDING
IS: SI INPUT
OPTION 34 VALUE e
OPTION 17 VALUE e
IS: SO DRIVER
OPTION 35 VALUE e
0
OPTION 18 VALUE e
IS: SK DRIVER
18
IS: N/A
IS: TIMER
0
0
OPTION 16 VALUE e
1
IS: L1 DRIVER
IS: INT INIT LOGIC
0
IS: N/A
IS: N/A
19
Physical Dimensions inches (millimeters)
20-Lead Hermetic Dual-In-Line Package (D)
Order Number COP226C-XXX/D
NS Package Number D20A
20
Physical Dimensions inches (millimeters) (Continued)
24-Lead Hermetic Dual-In-Line Package (D)
Order Number COP225C-XXX/D or COP245C-XXX/D
NS Package Number D24C
28-Lead Hermetic Dual-In-Line Package (D)
Order Number COP224C-XXX/D or COP244C-XXX/D
NS Package Number D28C
21
Physical Dimensions inches (millimeters) (Continued)
20-Lead Surface Mount Package (M)
Order Number COP226C-XXX/WM
NS Package Number M20B
20-Lead Molded Dual-In-Line Package (N)
Order Number COP226C-XXX/N
NS Package Number N20A
22
Physical Dimensions inches (millimeters) (Continued)
24-Lead Molded Dual-In-Line Package (N)
Order Number COP225C-XXX/N or COP245C-XXX/N
NS Package Number N24A
28-Lead Molded Dual-In-Line Package (N)
Order Number COP224C-XXX/N or COP244C-XXX/N
NS Package Number N28B
23
COP224C/COP225C/COP226C/COP244C/COP245C
Single-Chip 1k and 2k CMOS Microcontrollers
Physical Dimensions inches (millimeters) (Continued)
Plastic Leaded Chip Carrier (V)
Order Number COP224C-XXX/V or COP244C-XXX/V
NS Package Number V28A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
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failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
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to the user.
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2. A critical component is any component of a life
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effectiveness.
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