LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION KEY FEATURES DESCRIPTION W W W. Microsemi .COM Overall regulator efficiency has been improved with a minimized operating ground current (typ < 140µA per regulator). Further, this ground current is virtually eliminated in shutdown mode (typ < 1µA). Other safety features include channel independent Thermal and Short Circuit Current protection. Separate Enable pins allow each regulator to be switched on and off independently by applying a TTL logic level control signal to the Enable pin further enhancing system level power management. These features combined with a small footprint (i.e., 10-pin MSOP package) make the LX8221 especially useful for battery-operated equipment such as cellular telephones, laptop computers and PDA equipment. The LX8221 family of dual output linear regulators provide for the selection of either fixed or adjustable output voltages, and combine low dropout operation, fast transient performance, tight output voltage accuracy, and ultra-low ground current within a very small package footprint. The PMOS output transistor allows for an ultra-low dropout characteristic (e.g., typically less than 175mV at 100mA). The individual regulators can be powered from either separate supply voltages or the same supply voltage between 2.8V to 6V allowing for maximum system flexibility. An optional ceramic or tantalum type capacitor may be connected to each Bypass pin separately to improve performance in critical low-noise applications. ! Compact regulators with two 150 mA outputs ! Dropout Voltage typically 175mV @ 100mA ! Ultra low shutdown Current typically less than 1µA ! Output trimmed to 0.5% ! Small MSOP-10 package ! Over Current & Temperature protection ! Stable with ceramic or tantalum capacitors APPLICATIONS ! ! ! ! ! Battery Operated Systems Laptop, Notebook and PDA’s Cellular Telephones/pagers Instrumentation Linear post regulators for SMPS IMPORTANT: For the most current data, consult MICRO Semi’s website: http://www.microsemi.com PRODUCT HIGHLIGHT 5.0V N/C VIN2 EN1 VIN1 EN2 } To Control Logic 5.0V N/C On Off 3.3V VIN2 EN1 VIN1 EN2 ADJ1 VOUT1 } To Control Logic On Off 3.3V CB1 VOUT1 ADJ VOUT2 ADJ2 GND VOUT2 GND R1 R2 R1 R1 R2 R2 Adjustable / Adjustable Application Fixed / Adjustable Application PACKAGE ORDER INFO VOUT1 VOUT2 -40 to 125 -40 to 125 -40 to 125 -40 to 125 Adjustable 2.5V 2.7V 3.0V Adjustable Adjustable Adjustable Adjustable DU Plastic MSOP 10-Pin LX8221-AIDU LX8221-BIDU LX8221-DIDU LX8221-GIDU LX8221 TJ (°°C) Package Marking 8221 AIDU LX 8221 BIDU LX 8221 DIDU LX 8221 GIDU LX Contact Microsemi for additional / available options Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX8221-AIDUT) Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. VOUT1 1 10 CB1 2 9 EN1 NC 3 8 GND VIN1 EN2 4 7 ADJ VIN2 5 6 VOUT2 DU PACKAGE (Top View) “NC” = No Internal Connection THERMAL DATA DU W W W. Microsemi .COM Input Voltage (VIN1, VIN2) ..........................................................................-0.3V to +7V Output Current (IOUT1, IOUT2) ................................................................................. 150mA Operating Temperature Range..................................................................... -40 to +125 °C Maximum Junction Temperature (TJ).......................................................................150 °C Storage Temperature (TJ) ............................................................................ -65 to +150 °C FRONT MARKING Plastic MSOP 8-Pin THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA THERMAL RESISTANCE-JUNCTION TO CASE, θJC 206°°C/W 39°°C/W 8221 xIDU LX Junction Temperature Calculation: TJ = TA + (PD x θJC). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. x = Voltage Combination i.e. A = Adj/Adj FUNCTIONAL PIN DESCRIPTION PIN NAME DESCRIPTION VIN1/VIN2 Unregulated input supply voltage GND Ground Pin EN1/EN2 Enable control input: Logic high = Enable; logic low or open = Shutdown CB1 Reference bypass input. Adding an additional external capacitor reduces output noise. VOUT1/VOUT2 Regulated output voltage. Regulator stability is achieved with external capacitor of 1uF ADJ (1, 2) Adjust pin. Connect a resistor divider to this pin to establish preferred output voltage. BLOCK DIAGRAM VIN1 EN1 EN2 VIN2 VOUT2 VOUT1 + CB1 CURRENT LIM IT CURRENT LIMIT CONTROL LOGIC - THERMAL SENSOR + CONTROL LOGIC VREF PACKAGE DATA THERM AL SENSOR ADJ - VREF GND Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION RECOMMENDED OPERATING CONDITIONS Symbol Input Operating Voltage Range (Note 1) Enable Input Voltage Range Continuous Output Current Range Input Capacitor (VIN to GND) Output Capacitor (VOUT to GND) VIN1, VIN2 EN1/2 IOUT1, IOUT1 CIN COUT Min LX8221 Typ 2.5 Units Max 6 VIN + 0.3V 150 1.0* 1.0* W W W. Microsemi .COM Parameter 2.2 V V mA µF µF Note 1: The minimum VIN has to meet two conditions VIN > 2.5V and VIN > VOUT + VDROPOUT. * Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a lower ESR and larger value capacitor will improve the response to these load steps. ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA ≤ 125°C except where otherwise noted. Test conditions: VIN = VOUT + 0.5V; IOUT =10mA; CIN = 1µF; COUT = 1µF; TJ = TA using low duty cycle pulse testing methods. LX8221 Parameter Symbol Test Conditions Units Min Typ Max Output Voltage (2.5, 2.7, 3.0, ADJ) Adjust Reference Voltage ∆VO ∆VIN ∆VO Load Regulation ∆I O Line Regulation Dropout Voltage (VIN − VO ) (Note 2) Ground Pin Current Adjust Input Bias Current Enable Pin Current Enable Threshold VADJ TJ = 25°C 0mA ≤ IOUT1/2 ≤ 150mA, (VOUT1/2 + 0.5V) ≤ VIN ≤ 6V TJ = 25°C 0mA ≤ IOUT1/2 ≤ 150mA, 2.85V ≤ VIN ≤ 6V VRV (VOUT1/2 + 0.5V) ≤ VIN ≤ 6V, IOUT1/2 = 0.1mA VRI 0.5mA ≤ IOUT1/2 ≤ 100mA VDO IGND ISTBY IADJ IEN VEN(IH) VEN(IL) IOUT(SC) PSRR eN TSD -1 -2.5 1.163 1.152 1.175 0.04 ILOAD1/2 = 1mA, ∆VO = -1% ILOAD1/2 = 50mA, ∆VO = -1% ILOAD1/2 = 100mA, ∆VO = -1% ILOAD1/2 = 150mA, ∆VO = -1% EN1 = High, EN2 = High EN1 = Low, EN2 = Low VADJ = 1.25V VEN1/2 = VIN 0.175 0.25 280 1 2.5 1.187 1.200 %/V 1.5 %VNOM 0.050 0.175 0.3 0.4 440 1 100 100 0.4 400 50 50 170 V 0.15 2.0 VOUT1 = 0V, VOUT2 = 0V TJ = 25°C, f = 120Hz TJ = 25°C, COUT = 10uF,CBYPASS = 470 pF % V µA nA nA V mA dB µV °C Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% below the nominal value. Dropout voltage specification applies only to output voltages greater than 2.8 V. For output voltages below 2.8 V, the dropout voltage is nothing but the input to output differential, since the minimum input voltage is 2.8 V. Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 ELECTRICALS Short Circuit Current Limit Power Supply Rejection Ratio Output Noise Thermal Shutdown Temperature VOUT1/2 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION APPLICATIONS Input Capacitor To improve load transient response and noise rejection a bypass capacitor is recommended (but it is not required for stability). There are no requirements for the ESR (Equivalent Series Resistor) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting this capacitor to ensure that the capacitor’s value will be around 1µF over the entire operating temperature range. For the LX8221, a 1µF ceramic type capacitor may be connected between both VIN1/2 and ground. Output Capacitor The LX8221 uses an internal feedback loop to maintain a constant output voltage. This feedback loop induces a natural phase shift and the amount of phase shift determines the loop’s stability. Therefore, like any lowdropout regulator, an output capacitor with low ESR (Equivalent Series Resistance) is required between VOUT and GND to stabilize the internal control loop. A ceramic, tantalum or electrolytic capacitor with a minimum recommended capacitance value of 1.0 µF and ESR between 5mΩ and 1Ω will satisfy the stability for the entire operating range. Copyright 2000 Rev. 1.0, 2002-01-02 R VOUT = VADJ 1 + 1 R 2 Enable The Enable pin allows the LX8221 to be independently turned on and off. The Enable pins are compatible with standard TTL-CMOS levels. A logic zero (0.4V) on the En1/ En2 pins shuts the LX8221 off and reduces the supply current to less than 1µA (typ). Pulling the Enable inputs high (2.0V) causes normal operation to resume. If the Enable feature is not used, this pin can be connected to VIN. Minimum Load Requirement Although line regulation is improved with a minimum load of 100µA, the LX8221 does not have a minimum load current in order to maintain stability. This is an especially important feature in certain applications. Temperature Protection The thermal protection shuts the LX8221 down when the junction temperature exceeds approximately 1500C; there is no appreciable thermal hysteresis. Short Circuit Current Protection The LX8221 includes over-current protection, when the output load current exceeds about 400mA. When this occurs, the protection circuit forces the regulator to decrease its output current. Thermal Consideration Thermal shutdown protects the integrated circuit from thermal overload caused from a rise in junction temperature during power dissipation. This type of protection is intended for fault protection only and not as a means of current (or, power) limiting during normal application usage. Proper thermal evaluation should be done to ensure that the junction temperature dose not exceed it’s maximum rating. Operating at the maximum TJ of 150°C can impact reliability. Due to variation in individual device electrical characteristics and thermal resistance, the built in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. Power dissipation for each regulator can Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 APPLICATION Optional Bypass Capacitor The fixed/adjustable voltage version of the LX8221 includes a separate Bypass pin (CB1) for the fixed regulator that allows for further reduction of output noise. If the regulator’s output noise performance meets system design specifications without the capacitor, omit it. The bypass capacitor impacts the start up time, which is inversely proportional to the size of bypass capacitor. Further, the bypass capacitor reduces the regulator phase margin. Hence, implementing the bypass capacitor will require the use of a larger output capacitor to maintain the LDO’s stability. The LX8221-x adjustable regulator’s output voltage can be externally set by connecting the ADJ pin/s to an external resistor divider (See Figure 1 and 2). The output voltage can be calculated using the formula: W W W. Microsemi .COM Description The LX8221 family of LDO linear regulators is available in a 10-pin MSOP Package and provides a cost effective power management solution for battery driven applications. The regulator family includes both fixed/adjustable and adjustable/adjustable output voltage versions. The internal PMOS power device provides low dropout regulation with a fast line and load transient response. It also includes internal current limiting and thermal shutdown circuitry. In this section you will find information about capacitor, thermal, and layout design considerations. LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION APPLICATIONS calculate the temperature: PD = (VIN ( MAX ) − VOUT ( MIN ) )× I OUT ( MAX ) For the MSOP package, thermal resistance, θJA is 2200C/W when mounted on a FR4 copper clad PCB. Junction temperature of the integrated circuit can be calculated using: Where: TRISE = (PD × Θ JA ) Example: Given the following conditions: ! ! ! ! TA = 60°C VIN= 4.2V VOUT= 2.7V IOUT= 100mA power dissipation and junction Total Power Dissipation: (Note: power dissipation resulting from quiescent current is negligible) TJ = TA + TRISE total PD = (4.2V − 2.7 V ) × 0.1A = 0.15 W Junction Temperature: TJ = 60o C + (0.15W × 220o C / W ) = 93o C W W W. Microsemi .COM be calculated using the following equation: Layout Consideration: The layout must be implemented with low impedance paths for VIN, VOUT and Ground by creating sufficiently wide traces to avoid voltage drops and pick up noise. Adding an area of PCB copper to the GND pin (pin 8) will reduce the overall θJA since it is thermally connected to the device substrate. This will lower the device junction temperature improving overall output voltage accuracy. The input/output capacitors must be placed as close as possible to each voltage regulator output pin. APPLICATION Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION APPLICATION CIRCUITS W W W. Microsemi .COM Resistor Table 5.0V N/C VIN2 EN1 VIN1 EN2 R1 = 13.0k Ω R2 = 10.0k Ω 3.3V 3.0V CB1 VOUT1 ADJ VOUT2 2.7V GND R1 R2 Figure 1. Fixed / Adjustable Output Application 5.0V N/C VIN2 EN1 VIN1 EN2 ADJ1 VOUT1 ADJ2 VOUT2 Resistor Table VOUT1 R1 = 13.0k Ω R2 = 10.0k Ω VOUT2 R1 = 11.3k Ω R2 = 10.0k Ω 3.3V 2.7V 2.5V GND R2 R1 R1 R2 APPLICATIONS Figure 2 – Adjustable / Adjustable Output Application Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION OUTPUT VOLTAGE VS TEMPERATURE DROPOUT VOLTAGE VS TEMPERATURE W W W. Microsemi .COM 350 1.185 325 300 1.18 OUTPUT VOLTAGE (V) 275 IL =150mA 250 1.175 225 200 1.17 175 150 1.165 IL =100mA 125 100 1.16 75 1.155 50 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 TEMPERATURE ( °C) TEMPERATURE (°C) OUTPUT CURRENT VS SUPPLY VOLTAGE 75 100 125 SHORT CIRCUIT CURRENT VS TEMPERATURE - 340 0 - 350 - 50 - 360 - 370 - 100 - 380 -40°C - 390 25°C - 150 5V - 400 85°C 4V - 410 - 200 115°C 3V - 420 - 250 - 430 2.8 3.3 3.8 4.3 4.8 SUPPLY VOLTAGE ( V) 5.3 5.8 -40 6.3 PSRR VS FREQUENCY -25 0 25 85 SUPPLY VOLTAGE ( V) 100 115 125 PSRR VS FREQUENCY IN DROPOUT 0 0 50 50 100 0.1 1 10 100 Fr equency ( kHz) 0.1 1 10 100 Fr equency ( kHz) Typical performance characteristics, unless otherwise specified are: CIN = COUT = 1µF, CBY = 470pF, VIN = VOUT = 2.5V, TA = 25°C, ENABLE is tied to VIN. Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 PERFORMANCE 100 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION PACKAGE DIMENSIONS 10-Pin Plastic MSOP Dim G D A B C D F G H J P *LC B MILLIMETERS MIN MAX 2.85 3.05 2.90 3.10 1.10 0.16 0.31 0.40 0.60 0.50 BSC 0.050 0.150 0.10 4.75 5.05 0.10 INCHES MIN MAX 0.112 0.120 0.114 0.122 0.043 0.006 0.0124 0.015 0.023 0.019 BSC 0.002 0.006 0.004 0.187 0.198 0.004 W W W. Microsemi .COM DU *Lead Coplanarity A J C H F P Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. MECHANICALS Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 8 LX8221 Dual 150mA CMOS Low Dropout Regulator P RODUCTION W W W. Microsemi .COM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright 2000 Rev. 1.0, 2002-01-02 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 9