ETC NX8303BG-CC

DATA SHEET
LASER DIODE
NX8303BG-CC,NX8303CG-CC
1 310 nm InGaAsP MQW-DFB LASER DIODE
COAXIAL MODULE FOR 622 Mb/s
DESCRIPTION
The NX8303BG-CC and NX8303CG-CC are 1 310 nm Multiple Quantum Well (MQW) structured Distributed FeedBack (DFB) laser diode coaxial module with single mode fiber.
These modules are ideal as a light source for Synchronous Digital Hierarchy (SDH) system, STM-4, long-haul L4.1 ITU-T recommendations.
FEATURES
• Peak emission wavelength
λp = 1 310 nm
• Optical output power
Pf = 2.0 mW
• Wide operating temperature range
TC = −10 to +85°C
• Side Mode Suppression Ratio
SMSR = 40 dB
• InGaAs monitor PIN-PD
• With SC-UPC connector
• Based on Telcordia reliability
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PL10175EJ01V0DS (1st edition)
(Previous No. P15231EJ2V0DS00)
Date Published July 2002 CP(K)
Printed in Japan
The mark • shows major revised points.
 NEC Corporation 2001
 NEC Compound Semiconductor Devices 2002
NX8303BG-CC,NX8303CG-CC
PACKAGE DIMENSIONS (UNIT : mm)
NX8303CG-CC
6.0
15.0
6.0
27.6±1.0
0.5
7.3
0.5±0.2
20.4±1.0
φ 0.45±0.05
1.2±0.2
φ 2.2
8.0±0.3
20.0±1.0
3.2
2.2
4.0±0.2
8.0±0.3
φ 0.9
Optical Fiber (SMF)
Length: 0.5 m
With SC Connector
φ 7.0±0.2
28.3±1.0
φ 0.9
Optical Fiber (SMF)
Length: 0.5 m
With SC Connector
φ 7.0±0.2
19.5±1.0
NX8303BG-CC
φ 0.45±0.05
12.7±0.2
16.0
17.0±0.2
PIN CONNECTIONS
PIN CONNECTIONS
P.C.D. = φ 2.0
4–R1.25±0.2
3
1
2
4
PD
3
1
2
3
2
4
2– φ 2.5
LD
Case
1
7.0±0.2
4
7.2±0.3
PD
3.7±0.3
1.0±0.1
P.C.D. = φ 2.0
1
3
Case
4
8.5±0.2
2
LD
12.0±0.15
OPTICAL FIBER CHARACTERISTICS
Parameter
Specification
Unit
Mode Field Diameter
9.5±1
µm
Cladding Diameter
125±2
µm
2
%
1.6
%
0.9±0.1
mm
1 100 to 1 270
nm
30
mm
500±50
mm
Maximum Cladding Noncircularity
Maximum Core/Cladding Concentricity
Outer Diameter
Cut-off Wavelength
Minimum Fiber Bending Radius
Fiber Length
Flammability
UL1581 VW-1
SC-UPC Connector
Fiber Length: 500±50 mm
2
Data Sheet PL10175EJ01V0DS
8.99±0.5 mm
35±2 mm
NX8303BG-CC,NX8303CG-CC
ORDERING INFORMATION
Part Number
Flange Type
NX8303BG-CC
Flat Mount Flange
NX8303CG-CC
Vertical Mount Flange
Available Connector
With SC-UPC Connector
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Ratings
Unit
Optical Output Power from Fiber
Pf
5
mW
Forward Current of LD
IF
150
mA
Reverse Voltage of LD
VR
2.0
V
Forward Current of PD
IF
2.0
mA
Reverse Voltage of PD
VR
15
V
Operating Case Temperature
TC
−10 to +85
°C
Storage Temperature
Tstg
−40 to +85
°C
Lead Soldering Temperature
Tsld
260 (10 sec.)
°C
Relative Humidity (noncondensing)
RH
85
%
Data Sheet PL10175EJ01V0DS
3
NX8303BG-CC,NX8303CG-CC
ELECTRO-OPTICAL CHARACTERISTICS (TC = −10 to +85°°C, unless otherwise specified)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Optical Output Power from Fiber
Pf
CW
2.0
mW
Operating Voltage
Vop
Pf = 2.0 mW
1.2
1.6
V
Threshold Current
Ith
TC = 25°C
15
25
mA
55
Threshold Output Power
Pth
IF = Ith
Modulation Current
Imod
Pf = 2.0 mW, TC = 25°C
8
Pf = 2.0 mW
6
Differential Efficiency
ηd
Temperature Dependence of
Differential Efficiency
∆ηd
Kink (Refer to DEFINITIONS)
kink
Peak Emission Wavelength
Temperature Dependence of Peak
Emission Wavelength
Spectral Width
Side Mode Suppression Ratio
λp
Pf = 2.0 mW, TC = 25°C
0.070
Pf = 2.0 mW
0.040
∆ηd = 10 log
ηd (@ TC °C)
−3.5
SMSR
µW
30
mA
50
0.100
0.200
W/A
0.300
−2.2
dB
ηd (@ 25°C)
±20
%
1 310
1 335
nm
0.09
0.1
nm/°C
0.1
1.0
nm
Pf = Up to 2.4 mW
Pf = 2.0 mW
1 280
∆λ/∆T
∆λ
20
100
Pf = 2.0 mW, −20 dB down width
Pf = 2.0 mW
30
40
dB
GHz
Cutt-off Frequency
fC
−3 dB, VR = 5 V, Pf = 2.0 mW
2.0
Rise Time
tr
10-90%, Ppk = 2.0 mW, IF = Ith
0.15
0.5
ns
Fall Time
tf
90-10%, Ppk = 2.0 mW, IF = Ith
0.15
0.5
ns
Monitor Current
Im
VR = 5 V, Pf = 2.0 mW
700
1 500
µA
Monitor Dark Current
ID
VR = 5 V, TC = 25°C
0.1
50
nA
VR = 5 V
10
500
VR = 5 V, f = 1 MHz
1.0
20
pF
10
%
1.0
dB
Monitor PD Terminal Capacitance
Ct
Linearity
(Refer to DEFINITIONS)
LINm
Tracking Error
(Refer to DEFINITIONS)
γ
Relative Intensity Noise
RIN
4
200
VR = 5 V, Pf = 0.2 to 2.0 mW
Im = const.
Ref = −14 dB
Data Sheet PL10175EJ01V0DS
0.5
−135
dB/Hz
NX8303BG-CC,NX8303CG-CC
PARAMETER DEFINITIONS
Kink : kink
Pf
kink =
IF - P f
(mW)
2.4
dPK
× 100 [%]
PK
dPK = dPo MAX.
dPo
PK ≤ 2.4 (mW)
dPK
PK
IF - η d
IF
0
(mA)
Linearity : LINm
Pf
LINm =
(mW)
dPL
× 100 [%]
PL
2.0
dPL = dPo MAX.
0.2 < PL < 2.0 (mW)
PL
dPL
dPo
0.2
0
Im
(mA)
Tracking Error : γ
Pf
γ = 10 log
(mW)
Pf
2.0
[dB]
TC = 25˚C
2.0
TC = –10 to +85˚C
Pf
0
Im
Im
(mA)
Data Sheet PL10175EJ01V0DS
5
NX8303BG-CC,NX8303CG-CC
TYPICAL CHARACTERISTICS (TC = 25°°C, unless otherwise specified)
OPERATING CURRENT AND THRESHOLD
CURRENT vs. CASE TEMPERATURE
TEMPERATURE DEPENDENCE OF
PEAK EMISSION WAVELENGTH
1 320
Peak Emission Wavelength λp (nm)
Operating Current Iop (mA),
Threshold Current Ith (mA)
100
Iop@Pf = 2 mW
Ith
10
1
–40
–20
0
20
40
60
80
100
1 315
1 310
1 305
1 300
–40
40
60
80
TEMPERATURE DEPENEDENCE OF
DIFFERENTIAL EFFICIENCY
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.12
0.06
–20
0
20
40
60
80
80
60
40
20
100
Case Temperature TC (˚C)
10
0
–10
–20
–30
–40
–50
–60
1 310
0
0.5
1.0
1.5
Forward Voltage VF (V)
SPECTRUM
–70
1 300
100
100
Forward Current IF (mA)
Differential Efficiency η d (W/A)
20
Case Temperature TC (˚C)
0.00
–40
Relative Intensity (dB)
0
Case Temperature TC (˚C)
0.18
1 320
Wavelength λ (nm)
Remark The graphs indicate nominal characteristics.
6
–20
Data Sheet PL10175EJ01V0DS
2.0
2.5
NX8303BG-CC,NX8303CG-CC
DFB-LD FAMILY
Absolute Maximum
Ratings
Part Number
TC
(°C)
Tstg
(°C)
Electro-Optical Characteristics
(TC = 25°C)
Ith
(mA)
Pf
(mW)
λp
(nm)
TYP.
MIN.
TYP.
Application
Package
NX8300BE-CC
NX8300CE-CC
0 to +75
−40 to +85
15
2
*1
NX8303BG-CC
NX8303CG-CC
−10 to +85
−40 to +85
15
2
*1
1 310
622 Mb/s: STM-4 (L-4.1)
Coaxial
NX8304BE-CC
NX8304CE-CC
−40 to +85
−40 to +85
15
2
*1
1 310
For fiberoptic communications
Coaxial
NX8503BG-CC
NX8503CG-CC
−10 to +85
−40 to +85
15
2
*1
1 550
156 Mb/s: STM-1
(L-1.2, L-1.3)
Coaxial
1 310
2.5 Gb/s: STM-16
(S-16.1, L-16.1)
Coaxial
622 Mb/s: STM-4
(L-4.2, L-4.3)
NX8504BE-CC
NX8504CE-CC
−10 to +85
−40 to +85
15
2
NX8560LJ-CC
−20 to +70
−40 to +85
6
−1 dBm
1 550
NX8562LB
−20 to +65
−40 to +85
20
20
NX8563LB
−20 to +65
−40 to +85
20
10
NX8564LE-CC
−20 to +70
−40 to +85
7
NX8565LE-CC
−20 to +70
−40 to +85
7
NX8566LE-CC
−20 to +70
−40 to +85
7
0 dBm
1 550
NX8570 Series
−20 to +70
−40 to +85
20
20
NX8571 Series
−20 to +70
−40 to +85
20
10
*1
1 550
622 Mb/s: STM-4
(L-4.2, L-4.3)
Coaxial
*2
≤ 10 Gb/s: STM-64
BFY with GPO
1 550
*2
CW Light Source for external
modulator
BFY
1 550
*2
CW Light Source for external
modulator
BFY
−2 dBm *1 1 550 *2
2.5 Gb/s: STM-16, 360 km
EA modulator integrated
BFY
−2 dBm *1 1 550 *2
2.5 Gb/s: STM-16, 600 km
EA modulator integrated
BFY
*2
2.5 Gb/s: STM-16, 240 km
EA modulator integrated
BFY
1 550
*2
CW Light Source with λ
monitoring PD
BFY
1 550
*2
CW Light Source with λ
monitoring PD
BFY
TM
*1 TYP.
*2 Available for DWDM Wavelengths based on ITU-T recommendations
Data Sheet PL10175EJ01V0DS
7
NX8303BG-CC,NX8303CG-CC
REFERENCE
Document Name
Document No.
Optical semiconducrtor devices for fiberoptic communications Selection Guide
P12480E
Opto-Electronics Devices Pamphlet
P13623E
Opto-Electronics Devices (CD-ROM)
P12944X
NEC semiconductor device reliability/quality control system
Quality grades on NEC semiconductor devices
*1
C11159E
*1
C11531E
SEMICONDUCTOR SELECTION GUIDE −Products and Packages−
*1
*1 Published by NEC Corporation
8
Data Sheet PL10175EJ01V0DS
X13769E
NX8303BG-CC,NX8303CG-CC
GPO is a trademark of Gilbert Engineering Co., Inc.
• The information in this document is current as of July, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PL10175EJ01V0DS
9
NX8303BG-CC,NX8303CG-CC
SAFETY INFORMATION ON THIS PRODUCT
DANGER
SEMICONDUCTOR LASER
INVISIBLE LASER RADIATION
AVOID DIRECT EXPOSURE TO BEAM
OUTPUT POWER
mW MAX
WAVELENGTH
nm
CLASS lllb LASER PRODUCT
Warning
Laser Beam
AVOID EXPOSURE-Invisible
Laser Radiation is emitted from
this aperture
A laser beam is emitted from this diode during operation.
The laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of
eyesight.
• Do not look directly into the laser beam.
• Avoid exposure to the laser beam, any reflected or collimated beam.
Caution
GaAs Products
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
Caution
Optical Fiber
A glass-fiber is attached on the product. Handle with care.
• When the fiber is broken or damaged, handle carefully to avoid injury from the damaged part
or fragments.
Business issue
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected]
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
FAX: +852-3107-7309
TEL: +852-3107-7303
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
FAX: +82-2-528-0302
TEL: +82-2-528-0301
NEC Electron Devices European Operations
http://www.nec.de/
TEL: +49-211-6503-101 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Technical issue
NEC Compound Semiconductor Devices, Ltd.
http://www.csd-nec.com/
Sales Engineering Group, Sales Division
E-mail: [email protected] FAX: +81-44-435-1918
0110