ETC X28HC256P12

X28HC256
X28HC256
256K
32K x 8 Bit
5 Volt, Byte Alterable E2PROM
FEATURES
DESCRIPTION
•
•
The X28HC256 is a second generation high performance CMOS 32K x 8 E2PROM. It is fabricated with
Xicor’s proprietary, textured poly floating gate technology, providing a highly reliable 5 Volt only nonvolatile
memory.
•
•
•
•
•
Access Time: 70ns
Simple Byte and Page Write
—Single 5V Supply
— No External High Voltages or VPP Control
Circuits
—Self-Timed
— No Erase Before Write
— No Complex Programming Algorithms
—No Overerase Problem
Low Power CMOS:
—Active: 60mA
—Standby: 500µA
Software Data Protection
—Protects Data Against System Level
Inadvertent Writes
High Speed Page Write Capability
Highly Reliable Direct Write™ Cell
—Endurance: 100,000 Write Cycles
—Data Retention: 100 Years
Early End of Write Detection
— DATA Polling
—Toggle Bit Polling
The X28HC256 supports a 128-byte page write operation, effectively providing a 24µs/byte write cycle and
enabling the entire memory to be typically rewritten in
less than 0.8 seconds. The X28HC256 also features
DATA Polling and Toggle Bit Polling, two methods of
providing early end of write detection. The X28HC256
also supports the JEDEC standard Software Data Protection feature for protecting against inadvertent writes
during power-up and power-down.
Endurance for the X28HC256 is specified as a minimum
100,000 write cycles per byte and an inherent data
retention of 100 years.
PIN CONFIGURATION
PLASTIC DIP
CERDIP
FLAT PACK
SOIC
SOIC
26
4
25
A5
5
24
A4
6
A3
7
A2
8
A1
9
20
A0
10
19
I/O0
I/O1
11
12
17
I/O2
VSS
13
16
I/O5
I/04
14
15
I/O3
3
2
1 32 31 30
TSOP
A13
A8
A6
5
29
A8
A9
A11
A5
6
28
A9
23
A4
7
27
A11
22
OE
A3
8
26
NC
A2
9
25
OE
A1
10
24
A10
A0
NC
11
23
CE
12
22
I/O7
I/O6
3859 FHD F02
©Xicor, Inc. 1991, 1995 Patents Pending
3859-2.7 3/27/96 T0/C2/D1 NS
21
13
14 15 16 17 18 19 20
A2
A1
A0
I/O0
I/O1
I/O2
NC
VSS
NC
I/O3
I/O4
I/O5
I/O6
I/O7
CE
A10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
X28HC256
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A3
A4
A5
A6
A7
A12
A14
NC
VCC
NC
WE
A13
A8
A9
A11
OE
I/O5
I/O0
I/O3
I/O4
I/O7
I/O6
NC
18
A10
CE
VSS
21
X28HC256
I/O1
I/O2
X28HC256
A13
3
A6
4
WE
A7
VCC
WE
NC
27
A14
28
2
A12
1
A12
A7
A14
VCC
LCC
PLCC
3859 ILL F22
3859 FHD F03
1
Characteristics subject to change without notice
X28HC256
PIN DESCRIPTIONS
PIN NAMES
Addresses (A0–A14)
Symbol
Description
The Address inputs select an 8-bit memory location
during a read or write operation.
A0–A14
I/O0–I/O7
WE
CE
OE
VCC
VSS
NC
Address Inputs
Data Input/Output
Write Enable
Chip Enable
Output Enable
+5V
Ground
No Connect
CE
Chip Enable (CE
CE)
The Chip Enable input must be LOW to enable all read/
write operations. When CE is HIGH, power consumption
is reduced.
OE
Output Enable (OE
OE)
The Output Enable input controls the data output buffers
and is used to initiate read operations.
3859 PGM T01
PIN CONFIGURATION
Data In/Data Out (I/O0–I/O7)
PGA
Data is written to or read from the X28HC256 through
the I/O pins.
I/O1
I/O2
I/O3
I/O6
I/O5
12
13
15
18
17
WE
WE)
Write Enable (WE
I/O0
A0
11
10
The Write Enable input controls the writing of data to the
X28HC256.
9
A1
A3
7
A5
5
A6
4
VSS
I/O4
I/O7
14
16
19
A2
CE
20
A10
21
A4
OE
22
A11
23
8
6
A12
2
VCC
A9
28
24
A7
3
1
A14
WE
27
X28HC256
(BOTTOM VIEW)
FUNCTIONAL DIAGRAM
X BUFFERS
LATCHES AND
DECODER
A8
25
A13
26
3859 FHD F04
256K-BIT
E2PROM
ARRAY
A0–A14
ADDRESS
INPUTS
Y BUFFERS
LATCHES AND
DECODER
I/O BUFFERS
AND LATCHES
I/O0–I/O7
DATA INPUTS/OUTPUTS
CE
OE
WE
CONTROL
LOGIC AND
TIMING
VCC
VSS
3859 FHD F01
2
3859 FHD F01
X28HC256
DEVICE OPERATION
Write Operation Status Bits
Read
The X28HC256 provides the user two write operation
status bits. These can be used to optimize a system write
cycle time. The status bits are mapped onto the I/O bus as
shown in Figure 1.
Read operations are initiated by both OE and CE LOW.
The read operation is terminated by either CE or OE
returning HIGH. This two line control architecture eliminates bus contention in a system environment. The data
bus will be in a high impedance state when either OE or
CE is HIGH.
Figure 1. Status Bit Assignment
I/O
Write
Write operations are initiated when both CE and WE are
LOW and OE is HIGH. The X28HC256 supports both a
CE and WE controlled write cycle. That is, the address
is latched by the falling edge of either CE or WE,
whichever occurs last. Similarly, the data is latched
internally by the rising edge of either CE or WE,
whichever occurs first. A byte write operation, once
initiated, will automatically continue to completion, typically within 3ms.
DP
TB
5
4
3
2
1
0
RESERVED
TOGGLE BIT
DATA POLLING
3859 FHD F11
DATA Polling (I/O7)
The X28HC256 features DATA Polling as a method to
indicate to the host system that the byte write or page
write cycle has completed. DATA Polling allows a simple
bit test operation to determine the status of the
X28HC256, eliminating additional interrupt inputs or
external hardware. During the internal programming
cycle, any attempt to read the last byte written will
produce the complement of that data on I/O7 (i.e., write
data = 0xxx xxxx, read data = 1xxx xxxx). Once the
programming cycle is complete, I/O7 will reflect true
data.
Page Write Operation
The page write feature of the X28HC256 allows the
entire memory to be written in typically 0.8 seconds.
Page write allows up to one hundred twenty-eight bytes
of data to be consecutively written to the X28HC256
prior to the commencement of the internal programming
cycle. The host can fetch data from another device
within the system during a page write operation (change
the source address), but the page address (A7 through
A14) for each subsequent valid write cycle to the part
during this operation must be the same as the initial
page address.
Toggle Bit (I/O6)
The X28HC256 also provides another method for determining when the internal write cycle is complete. During
the internal programming cycle I/O6 will toggle from
HIGH to LOW and LOW to HIGH on subsequent
attempts to read the device. When the internal cycle is
complete the toggling will cease and the device will be
accessible for additional read and write operations.
The page write mode can be initiated during any write
operation. Following the initial byte write cycle, the host
can write an additional one to one hundred twentyseven bytes in the same manner as the first byte was
written. Each successive byte load cycle, started by the
WE HIGH to LOW transition, must begin within 100µs of
the falling edge of the preceding WE. If a subsequent
WE HIGH to LOW transition is not detected within
100µs, the internal automatic programming cycle will
commence. There is no page write window limitation.
Effectively the page write window is infinitely wide, so
long as the host continues to access the device within
the byte load cycle time of 100µs.
3
X28HC256
DATA POLLING I/O7
Figure 2. DATA Polling Bus Sequence
WE
LAST
WRITE
CE
OE
VIH
A0–A14
VOH
HIGH Z
I/O7
VOL
An
An
An
X28HC256
READY
An
An
An
An
3859 FHD F12
Figure 3. DATA Polling Software Flow
DATA Polling can effectively halve the time for writing to
the X28HC256. The timing diagram in Figure 2 illustrates the sequence of events on the bus. The software
flow diagram in Figure 3 illustrates one method of
implementing the routine.
WRITE DATA
NO
WRITES
COMPLETE?
YES
SAVE LAST DATA
AND ADDRESS
READ LAST
ADDRESS
IO7
COMPARE?
NO
YES
X28HC256
READY
3859 FHD F13
4
X28HC256
THE TOGGLE BIT I/O6
Figure 4. Toggle Bit Bus Sequence
WE
LAST
WRITE
CE
OE
VOH
I/O6
*
HIGH Z
VOL
*
X28HC256
READY
* I/O6 beginning and ending state of I/O6 will vary.
3859 FHD F14
Figure 5. Toggle Bit Software Flow
The Toggle Bit can eliminate the software housekeeping
chore of saving and fetching the last address and data
written to a device in order to implement DATA Polling.
This can be especially helpful in an array comprised of
multiple X28HC256 memories that is frequently updated. The timing diagram in Figure 4 illustrates the
sequence of events on the bus. The software flow
diagram in Figure 5 illustrates a method for polling the
Toggle Bit.
LAST WRITE
YES
LOAD ACCUM
FROM ADDR n
COMPARE
ACCUM WITH
ADDR n
COMPARE
OK?
NO
YES
X28HC256
READY
3859 FHD F15
5
X28HC256
HARDWARE DATA PROTECTION
circuits by employing the software data protection feature. The internal software data protection circuit is
enabled after the first write operation utilizing the software algorithm. This circuit is nonvolatile and will remain
set for the life of the device unless the reset command
is issued.
The X28HC256 provides two hardware features that
protect nonvolatile data from inadvertent writes.
• Default VCC Sense—All write functions are inhibited
when VCC is ≤ 3.5V Typically.
• Write Inhibit—Holding either OE LOW, WE HIGH, or
Once the software protection is enabled, the X28HC256
is also protected from inadvertent and accidental writes
in the powered-up state. That is, the software algorithm
must be issued prior to writing additional data to the
device.
CE HIGH will prevent an inadvertent write cycle during
power-up and power-down, maintaining data integrity.
SOFTWARE DATA PROTECTION
The X28HC256 offers a software controlled data protection feature. The X28HC256 is shipped from Xicor with
the software data protection NOT ENABLED; that is, the
device will be in the standard operating mode. In this
mode data should be protected during power-up/down
operations through the use of external circuits. The host
would then have open read and write access of the
device once VCC was stable.
SOFTWARE ALGORITHM
Selecting the software data protection mode requires
the host system to precede data write operations by a
series of three write operations to three specific addresses. Refer to Figure 6 and 7 for the sequence. The
three-byte sequence opens the page write window
enabling the host to write from one to one hundred
twenty-eight bytes of data. Once the page load cycle has
been completed, the device will automatically be returned to the data protected state.
The X28HC256 can be automatically protected during
power-up and power-down without the need for external
6
X28HC256
SOFTWARE DATA PROTECTION
Figure 6. Timing Sequence—Byte or Page Write
VCC
(VCC)
0V
DATA
ADDRESS
AA
5555
55
2AAA
A0
5555
WRITES
OK
CE
≤tBLC MAX
WE
tWC
WRITE
PROTECTED
BYTE
OR
PAGE
3859 FHD F16
Figure 7. Write Sequence for
Software Data Protection
Regardless of whether the device has previously been
protected or not, once the software data protection
algorithm is used and data has been written, the
X28HC256 will automatically disable further writes unless another command is issued to cancel it. If no further
commands are issued the X28HC256 will be write
protected during power-down and after any subsequent
power-up.
WRITE DATA AA
TO ADDRESS
5555
WRITE DATA 55
TO ADDRESS
2AAA
Note: Once initiated, the sequence of write operations
should not be interrupted.
WRITE DATA A0
TO ADDRESS
5555
BYTE/PAGE
LOAD ENABLED
WRITE DATA XX
TO ANY
ADDRESS
WRITE LAST
BYTE TO
LAST ADDRESS
OPTIONAL
BYTE OR
PAGE WRITE
ALLOWED
AFTER tWC
RE-ENTERS DATA
PROTECTED STATE
3859 FHD F06
7
X28HC256
RESETTING SOFTWARE DATA PROTECTION
Figure 8. Reset Software Data Protection Timing Sequence
VCC
DATA
ADDRESS
AA
5555
55
2AAA
80
5555
AA
5555
55
2AAA
20
5555
tWC
STANDARD
OPERATING
MODE
CE
WE
3859 FHD F18
Figure 9. Write Sequence for resetting
Software Data Protection
WRITE DATA AA
TO ADDRESS
5555
In the event the user wants to deactivate the software
data protection feature for testing or reprogramming in
an E2PROM programmer, the following six step algorithm will reset the internal protection circuit. After tWC,
the X28HC256 will be in standard operating mode.
WRITE DATA 55
TO ADDRESS
2AAA
Note: Once initiated, the sequence of write operations
should not be interrupted.
WRITE DATA 80
TO ADDRESS
5555
WRITE DATA AA
TO ADDRESS
5555
WRITE DATA 55
TO ADDRESS
2AAA
WRITE DATA 20
TO ADDRESS
5555
AFTER tWC,
RE-ENTERS
UNPROTECTED
STATE
3859 FHD F19
8
X28HC256
prime concern. Enabling CE will cause transient current
spikes. The magnitude of these spikes is dependent on
the output capacitive loading of the l/Os. Therefore, the
larger the array sharing a common bus, the larger the
transient spikes. The voltage peaks associated with the
current transients can be suppressed by the proper
selection and placement of decoupling capacitors. As a
minimum, it is recommended that a 0.1µF high frequency ceramic capacitor be used between VCC and
VSS at each device. Depending on the size of the array,
the value of the capacitor may have to be larger.
SYSTEM CONSIDERATIONS
Because the X28HC256 is frequently used in large
memory arrays it is provided with a two line control
architecture for both read and write operations. Proper
usage can provide the lowest possible power dissipation
and eliminate the possibility of contention where multiple I/O pins share the same bus.
To gain the most benefit it is recommended that CE be
decoded from the address bus and be used as the
primary device selection input. Both OE and WE would
then be common among all devices in the array. For a
read operation this assures that all deselected devices
are in their standby mode and that only the selected
device(s) is outputting data on the bus.
In addition, it is recommended that a 4.7µF electrolytic
bulk capacitor be placed between VCC and VSS for each
eight devices employed in the array. This bulk capacitor
is employed to overcome the voltage droop caused by
the inductive effects of the PC board traces.
Because the X28HC256 has two power modes, standby
and active, proper decoupling of the memory array is of
9
X28HC256
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias
X28HC256 .................................. –10°C to +85°C
X28HC256I, X28HC256M ......... –65°C to +135°C
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to VSS .................................. –1V to +7V
D.C. Output Current ........................................... 10mA
Lead Temperature (Soldering, 10 seconds) ...... 300°C
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
Max.
Supply Voltage
Limits
Commercial
Industrial
Military
0°C
–40°C
–55°C
+70°C
+85°C
+125°C
X28HC256
5V ±10%
3859 PGM T03.1
3859 PGM T02.1
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Typ.(7)
Max.
Units
Test Conditions
CE = OE = VIL, WE = VIH,
All I/O’s = Open, Address Inputs =
.4V/2.4V Levels @ f = 10MHz
CE = VIH, OE = VIL, All I/O’s =
Open, Other Inputs = VIH
CE = VCC – 0.3V, OE = GND,
All I/Os = Open,
Other Inputs = VCC – 0.3V
VIN = VSS to VCC
VOUT = VSS to VCC, CE = VIH
ICC
VCC Active Current
(TTL Inputs)
30
80
mA
ISB1
VCC Standby Current
(TTL Inputs)
VCC Standby Current
(CMOS Inputs)
1
2
mA
200
500
µA
10
10
0.8
VCC + 1
0.4
µA
µA
V
V
V
V
ISB2
ILI
ILO
VlL(2)
VIH(2)
VOL
VOH
Input Leakage Current
Output Leakage Current
Input LOW Voltage
Input HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
–1
2
2.4
IOL = 6mA
IOH = –4mA
3859 PGM T04.2
Notes: (1) Typical values are for TA = 25°C and nominal supply voltage.
(2) VIL min. and VIH max. are for reference only and are not tested.
10
X28HC256
POWER-UP TIMING
Symbol
Parameter
Max.
Units
tPUR(3)
tPUW(3)
Power-Up to Read
Power-Up to Write
100
5
µs
ms
3859 PGM T05
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V.
Symbol
Test
Max.
Units
Conditions
CI/O(9)
CIN(9)
Input/Output Capacitance
Input Capacitance
10
6
pF
pF
VI/O = 0V
VIN = 0V
3859 PGM T06.2
ENDURANCE AND DATA RETENTION
Parameter
Min.
Max.
Endurance
Data Retention
100,000
100
Units
Cycles
Years
3859 PGM T07.3
A.C. CONDITIONS OF TEST
Input Pulse Levels
Input Rise and
Fall Times
Input and Output
Timing Levels
0V to 3V
5ns
1.5V
3859 PGM T08.1
MODE SELECTION
CE
OE
WE
Mode
L
L
H
X
X
L
H
X
L
X
H
L
X
X
H
Read
Write
Standby and Write Inhibit
Write Inhibit
Write Inhibit
I/O
Power
DOUT
Active
DIN
Active
High Z Standby
—
—
—
—
3859 PGM T09
Note:
SYMBOL TABLE
(3) This parameter is periodically sampled and not 100%
tested.
WAVEFORM
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from LOW
to HIGH
Will change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
N/A
Changing:
State Not
Known
Center Line
is High
Impedance
EQUIVALENT A.C. LOAD CIRCUIT
5V
1.92KΩ
OUTPUT
1.37KΩ
30pF
3859 FHD F20.3
11
X28HC256
A.C. CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.)
Read Cycle Limits
X28HC256-70 X28HC256-90 X28HC256-12 X28HC256-15
Symbol
tRC(5)
tCE(5)
tAA(5)
tOE
tLZ (4)
tOLZ (4)
tHZ (4)
tOHZ (4)
tOH
Parameter
Min.
Read Cycle Time
Chip Enable Access Time
Address Access Time
Output Enable Access Time
CE LOW to Active Output
OE LOW to Active Output
CE HIGH to High Z Output
OE HIGH to High Z Output
Output Hold From Address Change
Max.
70
Min.
Max.
90
70
70
35
0
0
35
35
Max.
120
90
90
40
0
0
0
Min.
150
120
120
50
0
0
40
40
0
Min. Max. Units
150
150
50
0
0
50
50
0
50
50
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
3859 PGM T10.2
Read Cycle
tRC
ADDRESS
tCE
CE
tOE
OE
WE
VIH
tOLZ
tOHZ
tLZ
DATA I/O
HIGH Z
tOH
DATA VALID
DATA VALID
tAA
Notes: (4)
(5)
tHZ
3859 FHD F05
tLZ min., tHZ, tOLZ min. and tOHZ are periodically sampled and not 100% tested, tHZ and tOHZ are measured, with CL = 5pF,
from the point whin CE, OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven.
For faster 256K products, refer to X28VC256 product line.
12
X28HC256
Write Cycle Limits
Symbol
tWC(7)
tAS
tAH
tCS
tCH
tCW
tOES
tOEH
tWP
tWPH(8)
tDV
tDS
tDH
tDW(8)
tBLC
Parameter
Min.
Write Cycle Time
Address Setup Time
Address Hold Time
Write Setup Time
Write Hold Time
CE Pulse Width
OE HIGH Setup Time
OE HIGH Hold Time
WE Pulse Width
WE HIGH Recovery (page write only)
Data Valid
Data Setup
Data Hold
Delay to Next Write after Polling is True
Byte Load Cycle
Typ.(6)
Max.
Units
3
5
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
ns
µs
µs
0
50
0
0
50
0
0
50
50
1
50
0
10
0.15
100
3859 PGM T11.3
WE Controlled Write Cycle
tWC
ADDRESS
tAS
tAH
tCS
tCH
CE
OE
tOES
tOEH
tWP
WE
DATA IN
DATA VALID
tDS
DATA OUT
tDH
HIGH Z
3859 FHD F06
Notes: (6) Typical values are for TA = 25°C and nominal supply voltage.
(7) tWC is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
(8) tWPH and tDW are periodically sampled and not 100% tested.
13
X28HC256
CE Controlled Write Cycle
tWC
ADDRESS
tAS
tAH
tCW
CE
tOES
tOEH
OE
tCS
tCH
WE
DATA IN
DATA VALID
tDS
tDH
HIGH Z
DATA OUT
3859 FHD F07
Page Write Cycle
(9)
OE
CE
tWP
tBLC
WE
tWPH
(10)
ADDRESS
I/O
LAST BYTE
BYTE 0
BYTE 1
BYTE 2
BYTE n
*For each successive write within the page write operation, A7–A14 should be the same or
writes to an unknown address could occur.
Notes:
BYTE n+1
BYTE n+2
tWC
3859 FHD F08
Between successive byte writes within a page write operation, OE can be strobed LOW: e.g. this can be done with CE and
WE HIGH to fetch data from another memory device within the system for the next write; or with WE HIGH and CE LOW
effectively performing a polling operation.
(10) The timings shown above are unique to page write operations. Individual byte load operations within the page write must
conform to either the CE or WE controlled write cycle timing.
(9)
14
X28HC256
DATA Polling Timing Diagram(11)
ADDRESS
AN
AN
AN
CE
WE
tOEH
tOES
OE
tDW
I/O7
DIN=X
DOUT=X
DOUT=X
3859 FHD F09
tWC
Toggle Bit Timing Diagram(11)
CE
WE
tOES
tOEH
OE
tDW
I/O6
HIGH Z
*
*
tWC
*I/O6 beginning and ending state will vary, depending upon actual tWC.
Note:
(11) Polling operations are by definition read cycles and are therefore subject to read cycle timings.
15
3859 FHD F10
X28HC256
PACKAGING INFORMATION
28-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
1.460 (37.08)
1.400 (35.56)
0.550 (13.97)
0.510 (12.95)
PIN 1 INDEX
PIN 1
0.085 (2.16)
0.040 (1.02)
1.300 (33.02)
REF.
0.160 (4.06)
0.125 (3.17)
SEATING
PLANE
0.030 (0.76)
0.015 (0.38)
0.150 (3.81)
0.125 (3.17)
0.110 (2.79)
0.090 (2.29)
0.062 (1.57)
0.050 (1.27)
0.020 (0.51)
0.016 (0.41)
0.610 (15.49)
0.590 (14.99)
0°
15°
TYP. 0.010 (0.25)
3926 FHD F04
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
16
X28HC256
PACKAGING INFORMATION
28-LEAD HERMETIC DUAL IN-LINE PACKAGE TYPE D
1.490 (37.85)
1.435 (36.45)
0.610 (15.49)
0.500 (12.70)
PIN 1
0.100 (2.54)
0.035 (0.89)
1.30 (33.02)
REF.
0.225 (5.72)
0.140 (3.56)
SEATING
PLANE
0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
TYP. 0.100 (2.54)
0.070 (1.78)
0.030 (0.76)
TYP. 0.055 (1.40)
0.026 (0.66)
0.014 (0.36)
TYP. 0.018 (0.46)
0.620 (15.75)
0.590 (14.99)
TYP. 0.614 (15.60)
0°
15°
TYP. 0.010 (0.25)
3926 FHD F08
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
17
X28HC256
PACKAGING INFORMATION
32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J
0.420 (10.67)
0.050 (1.27) TYP.
0.045 (1.14) x 45°
0.021 (0.53)
0.013 (0.33)
TYP. 0.017 (0.43)
0.495 (12.57)
0.485 (12.32)
TYP. 0.490 (12.45)
0.453 (11.51)
0.447 (11.35)
TYP. 0.450 (11.43)
0.300 (7.62)
REF.
SEATING PLANE
±0.004 LEAD
CO – PLANARITY
—
0.015 (0.38)
0.095 (2.41)
0.060 (1.52)
0.140 (3.56)
0.100 (2.45)
TYP. 0.136 (3.45)
0.048 (1.22)
0.042 (1.07)
PIN 1
0.595 (15.11)
0.585 (14.86)
TYP. 0.590 (14.99)
0.553 (14.05)
0.547 (13.89)
TYP. 0.550 (13.97)
0.400
(10.16)REF.
3° TYP.
3926 FHD F13
3926 Fhd F13
NOTES:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY
18
X28HC256
PACKAGING INFORMATION
28-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.2980 (7.5692)
0.2920 (7.4168)
0.4160 (10.5664)
0.3980 (10.1092)
0.0192 (0.4877)
0.0138 (0.3505)
0.7080 (17.9832)
0.7020 (17.8308)
0.1040 (2.6416)
0.0940 (2.3876)
BASE PLANE
SEATING PLANE
0.0110 (0.2794)
0.0040 (0.1016)
0.050 (1.270)
BSC
0.0160 (0.4064)
X 45°
0.0100 (0.2540)
0.0125 (0.3175)
0.0090 (0.2311)
0° – 8°
0.0350 (0.8890)
0.0160 (0.4064)
3926 FHD F17
NOTES:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES
3. BACK EJECTOR PIN MARKED “KOREA”
4. CONTROLLING DIMENSION: INCHES (MM)
19
X28HC256
PACKAGING INFORMATION
32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E
0.150 (3.81) BSC
0.015 (0.38)
0.003 (0.08)
0.020 (0.51) x 45° REF.
0.095 (2.41)
0.075 (1.91)
PIN 1
0.022 (0.56)
0.006 (0.15)
0.055 (1.39)
0.045 (1.14)
TYP. (4) PLCS.
0.200 (5.08)
BSC
0.028 (0.71)
0.022 (0.56)
(32) PLCS.
0.050 (1.27) BSC
0.040 (1.02) x 45° REF.
TYP. (3) PLCS.
0.458 (11.63)
0.442 (11.22)
0.458 (11.63)
––
0.300 (7.62)
BSC
0.120 (3.05)
0.060 (1.52)
0.088 (2.24)
0.050 (1.27)
0.560 (14.22)
0.540 (13.71)
0.400 (10.16)
BSC
0.558 (14.17)
––
3926 FHD F14
32 1
PIN 1 INDEX CORDER
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. TOLERANCE: ±1% NTL ±0.005 (0.127)
20
3926 Fhd F14
X28HC256
PACKAGING INFORMATION
28-LEAD CERAMIC PIN GRID ARRAY PACKAGE TYPE K
12
13
15
17
18
11
10
14
16
19
A
0.008
9
8
20
21
7
6
22
23
0.050
A
5
2
28
24
25
4
3
1
27
26
0.080
0.070
TYP. 0.100
ALL LEADS
NOTE: LEADS 4,12,18 & 26
0.080 4 CORNERS
0.070
0.100
0.080
0.072
0.061
PIN 1 INDEX
0.020
0.016
0.660 (16.76)
0.640 (16.26)
A
A
0.185 (4.70)
0.175 (4.44)
0.561 (14.25)
0.541 (13.75)
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F15
21
X28HC256
PACKAGING INFORMATION
28-LEAD CERAMIC FLAT PACK
0.019 (0.48)
0.015 (0.38)
PIN 1 INDEX
1
28
0.050 (1.27) BSC
0.740 (18.80)
MAX.
0.045 (1.14) MAX.
0.440 (11.18)
MAX.
0.006 (0.15)
0.003 (0.08)
0.370 (9.40)
0.250 (6.35)
TYP. 0.300 2 PLCS.
0.180 (4.57)
MIN.
0.130 (3.30)
0.090 (2.29)
0.045 (1.14)
0.025 (0.66)
0.030 (0.76)
MIN.
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F16
22
X28HC256
PACKAGING INFORMATION
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) TYPE T
SEE NOTE 2
12.50 (0.492)
12.30 (0.484)
PIN #1 IDENT.
O 0.76 (0.03)
0.50 (0.0197) BSC
SEE NOTE 2
8.02 (0.315)
7.98 (0.314)
0.26 (0.010)
0.14 (0.006)
1.18 (0.046)
1.02 (0.040)
0.17 (0.007)
0.03 (0.001)
SEATING
PLANE
0.58 (0.023)
0.42 (0.017)
14.15 (0.557)
13.83 (0.544)
14.80 ± 0.05
(0.583 ± 0.002)
SOLDER PADS
0.30 ± 0.05
(0.012 ± 0.002)
TYPICAL
32 PLACES
15 EQ. SPC. 0.50 ± 0.04
0.0197 ± 0.016 = 7.50 ± 0.06
(0.295 ± 0.0024) OVERALL
TOL. NON-CUMULATIVE
0.17 (0.007)
0.03 (0.001)
1.30 ± 0.05
(0.051 ± 0.002)
0.50 ± 0.04
(0.0197 ± 0.0016)
FOOTPRINT
NOTE:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES).
23
3926 ILL F38.1
X28HC256
ORDERING INFORMATION
X28HC256
X
X
-X
Access Time
–70 = 70ns
–90 = 90ns
–12 = 120ns
–15 = 150ns
Device
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
M = Military = –55°C to +125°C
MB = MIL-STD-883
Package
P = 28-Lead Plastic DIP
D = 28-Lead Cerdip
J = 32-Lead PLCC
S = 28-Lead Plastic SOIC
E = 32-Pad LCC
K = 28-Pin Pin Grid Array
F = 28-Lead Flat Pack
T = 32-Lead TSOP
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and
prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are
implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;
4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and
additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error
detection and correction, redundancy and back-up features to prevent such an occurrence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant
injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
24
X28HC256
U.S. SALES OFFICES
Corporate Office
Xicor Inc.
1511 Buckeye Drive
Milpitas, CA 95035
Phone: 408/432-8888
Fax: 408/432-0640
E-mail: [email protected]
Mid-Atlantic Region
Xicor Inc.
50 North Street
Danbury, CT 06810
Phone: 203/743-1701
Fax: 203/794-9501
E-mail: [email protected]
Northeast Region
Xicor Inc.
1344 Main Street
Waltham, MA 02154
Phone: 617/899-5510
Fax: 617/899-6808
E-mail: [email protected]
North Central Region
Xicor Inc.
810 South Bartlett Road
Suite 103
Streamwood, IL 60107
Phone: 708/372-3200
Fax: 708/372-3210
E-mail: [email protected]
Southeast Region
Xicor Inc.
100 E. Sybelia Ave.
Suite 355
Maitland, FL 32751
Phone: 407/740-8282
Fax: 407/740-8602
E-mail: [email protected]
South Central Region
Xicor Inc.
11884 Greenville Ave.
Suite 102
Dallas, TX 75243
Phone: 214/669-2022
Fax: 214/644-5835
E-mail: [email protected]
Southwest Region
Xicor Inc.
4100 Newport Place Drive
Suite 710
Newport Beach, CA 92660
Phone: 714/752-8700
Fax: 714/752-8634
E-mail: [email protected]
Northwest Region
Xicor Inc.
2700 Augustine Drive
Suite 219
Santa Clara, CA 95054
Phone: 408/292-2011
Fax: 408/980-9478
E-mail: [email protected]
INTERNATIONAL SALES OFFICES
EUROPE
Northern Europe
Xicor Ltd.
Grant Thornton House
Witan Way
Witney
Oxford OX8 6FE
UK
Phone: (44) 1933.700544
Fax: (44) 1933.700533
E-mail: [email protected]
Central Europe
Xicor GmbH
Technopark Neukeferloh
Bretonischer Ring 15
85630 Grasbrunn bei Muenchen
Germany
Phone: (49) 8946.10080
Fax: (49) 8946.05472
E-mail: [email protected]
ASIA/PACIFIC
Japan
Xicor Japan K.K.
Suzuki Building, 4th Floor
1-6-8 Shinjuku, Shinjuku-ku
Tokyo 160, Japan
Phone: (81) 3322.52004
Fax: (81) 3322.52319
E-mail: [email protected]
Mainland China
Taiwan/Hong Kong
Xicor Inc.
4100 Newport Place Drive
Suite 710
Newport Beach, CA 92660
Phone: 714/752-8700
Fax: 714/752-8634
E-mail: [email protected]
Singapore/Malaysia/India
Xicor Inc.
2700 Augustine Drive
Suite 219
Santa Clara, CA 95054
Phone: 408/292-2011
Fax: 408/980-9478
E-mail: [email protected]
Korea
Xicor Korea
27th Fl., Korea World Trade Ctr.
159, Samsung-dong
Kangnam Ku
Seoul 135-729
Korea
Phone: (82) 2551.2750
Fax: (82) 2551.2710
E-mail: [email protected]
( ) = Country Code
Xicor product information is available at:
http://www.xicor.com
Xicor, Inc., Marketing Dept. 1511 Buckeye Drive, Milpitas, California 95035-7493 TEL 408/432-8888 FAX 408/432-0640 Rev. 4 3/96 Stock# XX-X-XXXX
25