ETC XF2H-2015-1

0.5 mm-pitch Rotary-lock Type
XF2H
New rotary-lock concept achieves high
reliability and superior work efficiency.
The unique rotary lock construction significantly
improves work efficiency during FPC mounting.
Double-sided contacts maintain a stable contact force.
Discrimination between FPC upper and lower contacts
is unnecessary.
Low-profile, protruding only 2 mm on the PCB.
Specifications
Materials/Finish
Rated current
0.5 A
Housing
Rated voltage
50 VDC
Slider
Contact resistance
30 m max. (max. 20 mV, max. 100 mA)
Insulation resistance
100 M
Withstand voltage
250 VAC 1 min. (leakage current: 1 mA
max.)
Insertion tolerance
20 times
-30 to +85°C (No condensation at low
temperatures.)
Ambient temperature
XF2H-
Contact
Copper-alloy/nickel spring substrate (2 m)
plated with tin alloy (2 m)
Hold-down
Copper-alloy/copper substrate (2 m) plated with
tin alloy (2 m)
min. (at 250 VDC)
Dimensions
PA46 resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
A
B
15-1
0.5
3.2
7.3
1
(8.1)
6.74
C
D
3.44
(1.9)
6.35
2
Table of Dimensions
Poles
Model
A
B
C
D
10
XF2H-1015-1
9.1
4.5
5.6
8.5 6.5 10.1
20
XF2H-2015-1 14.1 9.5 10.6 13.5 11.5 15.1
24
XF2H-2415-1 16.1 11.5 12.6 15.5 13.5 17.1
30
XF2H-3015-1 19.1 14.5 15.6 18.5 16.5 20.1
35
XF2H-3515-1 21.6 17.0 18.1 21.0 19.0 22.6
40
XF2H-4015-1 24.1 19.5 20.6 23.5 21.5 25.1
45
XF2H-4515-1 26.6 22.0 23.1 26.0 24.0 27.6
50
XF2H-5015-1 29.1 24.5 25.6 28.5 26.5 30.1
E
Printed Circuit Board Matching
Dimensions (Top View)
F
B±0.05
0.5±0.05
4
Model
10
XF2H-1015-1
20
XF2H-2015-1
24
XF2H-2415-1
30
XF2H-3015-1
35
XF2H-3515-1
40
XF2H-4015-1
45
XF2H-4515-1
50
XF2H-5015-1
0.5±0.1
(0.25)
1.3
(C-0.1)±0.07
B±0.05
0.5±0.05
0.35±0.03
2.8MIN
1.5
2.2
E±0.1
F±0.1
Ordering Information
Poles
Applicable FPC Dimensions
Quantity per reel*
1,500
T=0.3±0.05
(Copper conductors)
* Order an integer multiple of the quantity per reel.
0.5 mm-pitch ZIF-Slide Type
XF2J
Top-entry ZIF Connector
Slider achieves secure locking.
Low-profile, protruding only 4.15 mm on the PCB.
Adhesion face on top of the connector suits automatic
mounting.
Specifications
Materials/Finish
Rated current
0.5 A
Housing
Rated voltage
50 VDC
Slider
Contact resistance
30 m max. (max. 20 mV, max. 100 mA)
Contact
Insulation resistance
100 M min. (at 100 VDC)
Copper-alloy/nickel spring substrate (2 m)
plated with tin alloy (2 m)
Withstand voltage
250 VAC 1 min. (leakage current: 1 mA
max.)
Hold-down
Copper-alloy/copper substrate (2 m) plated with
tin alloy (2 m)
Insertion tolerance
30 times
-30 to +85°C (No condensation at low
temperatures.)
Ambient temperature
PA46 resin (UL94V-0)/natural
PPS resin (UL94V-0)/black
Dimensions
XF2J-
24-11
A
1
0.5
2.95
B
C
D
4.15
2.4
3.4
0.8
1.3
Table of Dimensions
Poles
Model
0.2
A
B
C
D
Applicable FPC Dimensions
2.3
6
XF2J-0624-11
7.5
2.5
3.6
6.9
8
XF2J-0824-11
8.5
3.5
4.6
7.9
12
XF2J-1224-11 10.5 5.5
6.6
9.9
14
XF2J-1424-11 11.5 6.5
7.6 10.9
Printed Circuit Board Matching
16
XF2J-1624-11 12.5 7.5
8.6 11.9
Dimensions (Top View)
22
XF2J-2224-11 15.5 10.5 11.6 14.9
28
XF2J-2824-11 18.5 13.5 14.6 17.9
0.5±0.1
1.4 1
B±0.05
0.5±0.05
(C-0.1)±0.07
B±0.05
0.5±0.05
0.35±0.03
3MIN
1 1.4
1.6
4
2.9
1.6
T=0.3±0.05
(Copper conductors)
0.5±0.05
Ordering Information
Poles
Model
6
XF2J-0624-11
8
XF2J-0824-11
12
XF2J-1224-11
14
XF2J-1424-11
16
XF2J-1624-11
22
XF2J-2224-11
28
XF2J-2824-11
Quantity per reel*
* Order an integer multiple of the quantity per reel.
1,000
5
Ultra-low-profile Connector (SMT Terminal)
Side-entry Non-ZIF Type
XF2E
Optimum low-profile design.
Ultra-low-profile FPC/FFC connector only
1.5 mm above the PCB.
Ultra-low-profile only 1.5 mm on the PCB allows
mounting in spaces with restricted height.
0.8 mm-pitch SMT connectors allow high-density
mounting.
Modified-PA-resin housing is compatible with VPS, IR
reflow, etc.
Double-sided contacts maintain a stable contact force.
Standard tape packing compatible with automatic
mounting.
Specifications
Mounted Image
Rated current
0.5 A
Rated voltage
50 VDC
Contact resistance
30 m max.
(max. 20 mV, max. 100 mA)
Insulation resistance
100 M min. (at 100 VDC)
Withstand voltage
500 VAC 1 min.
(leakage current: 1 mA max.)
Poles x 2.0 N (200 gf) max.
Total insertion force
Total removal force
Insertion tolerance
Ambient temperature
Height 1.5 mm
FPC/FFC
Printed circuit board
Materials/Finish
Poles x 0.3 N (200 gf) max.
10 times
-30 to +85°C
(No condensation at low temperatures.)
Dimensions
XF2E-
15-1(SMT Terminal)
1.2
XF2E
0.8
A
C
Housing
Contact
Modified PA resin containing glass (UL94V-0)/opal
Copper-alloy/nickel spring substrate (2 m) plated
with tin alloy (2 m)
Table of Dimensions
0.2
5.6
4.9
2.85
0.3
0.6
B
D
1.5
0.1
Printed Circuit Board Matching
Dimensions (Top View)
C±0.05
0.8±0.05
A
7.6
8.4
9.2
10.0
10.8
11.6
13.2
15.6
17.2
19.6
B
4.9
5.7
6.5
7.3
8.1
8.9
10.5
12.9
14.5
16.9
C
3.2
4.0
4.8
5.6
6.4
7.2
8.8
11.2
12.8
15.2
D
6.2
7.0
7.8
8.6
9.4
10.2
11.8
14.2
15.8
18.2
Applicable FPC Dimensions
0.3 0-0.05
(1.4)
(0.25)
Poles
5
6
7
8
9
10
12
15
17
20
0.8±0.05
0.8±0.15
(B-0.1)±0.07
C±0.05
0.5±0.05
2.8
2.8
2.1
(D+0.1)±0.05
0.6 +0.1
0
Ordering Information
Poles
5
6
7
8
9
10
12
15
17
20
6
Model
XF2E-0515-1
XF2E-0615-1
XF2E-0715-1
XF2E-0815-1
XF2E-0915-1
XF2E-1015-1
XF2E-1215-1
XF2E-1515-1
XF2E-1715-1
XF2E-2015-1
Quantity per reel*
4,000
* Order an integer multiple of the quantity per reel.
Non-ZIF Type
XF2K/XF2G
XF2K 0.5 mm-pitch Non-ZIF Type
Low-profile, protruding only 1.5 mm on the PCB.
Double-sided contacts maintain a stable contact force.
Discrimination between FPC upper and lower contacts
is unnecessary.
Dimensions
Poles
A+3.8
A=0.5 x (N-1)
0.5
1.2
6
Quantity Per Reel
1
4,000
5.6
4.9
2.85
N=Poles
Applicable FPC Dimensions
0.5±0.1
0.6
A + 1.1
A + 2.4
(A+1)±0.07
A±0.05
0.5±0.05
0.35±0.03
2.8MIN
1.5
0.1
Printed Circuit Board Matching
Dimensions (Top View)
0.2
0.4
A
0.5
T=0.3±0.05
(Copper conductors)
0.3
1.4
0.25
2.8
2.1
0.6
A+2.4
XF2G 0.5 mm-pitch N-ZIF Type
Low-profile, protruding only 4.15 mm on the PCB.
Adhesion face on top of the connector suits automatic
mounting.
Dimensions
Poles
A + 2.4
A +1.1
16 , 20 , 30
0.5
Quantity Per Reel
N=Poles
1,000
2.95
2.4
A=0.5 x (N-1)
0.5±0.1
4.15
0.2
3.4
Printed Circuit Board Matching
Dimensions (Top View)
1.4 1
A±0.05
Applicable FPC Dimensions
(A+1)±0.07
A±0.05
0.5±0.05
0.35±0.03
2.8MIN
T=0.3±0.05
(Copper conductors)
1 1.4
0.5±0.05
1.6
4
2.9
1.6
0.5±0.05
7
XF2K/XF2G
XF2K/XF2G
Precautions
Recommended Reflow Conditions
Storage
Pre-heat
temperature:
Time:
Soldering
temperature:
Time:
Do not store under high humidity levels as this may cause
deterioration of the insulation.
150 ± 10°C
60 to 120 seconds
Handling the FPC
200 to 240°C
Not exceeding 30 seconds
(Not exceeding 10 seconds at 240°C
maximum temperature.)
Do not forcibly bend or pull an FPC which has been mounted and
locked. This may cause discontinuities in the FPC.
OMRON SALES OFFICES
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NOATH/SOUTH AMERICA
NOATH/SOUTH AMERICA
OMRON CORPORATION
OMRON ELECTRONICS INC.
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Osaka 540-6028 Japan
Phone:81-6-6949-6010 Fax:81-6-6949-6019
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ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. G011-E1-01
In the interest of product improvement, specifications are subject to change without notice.
OMRON Corporation
C&C Components Division H.Q.
Mechanical - Components Division
28th FI., Crystal Tower Bldg.,
1-2-27 , Shiromi, Chuo-ku,
Osaka 540-6028 Japan
Phone: (81)6-6949-6017 Fax: (81)6-6949-6034
Printed in Japan
0199-1M (0199) W