ETC HYM71V32S755HCT4M

32Mx72 bits
PC100 SDRAM Registered DIMM
with PLL, based on 32Mx4 SDRAM with LVTTL, 4 banks & 4K Refresh
HYM71V32S755HCT4M Series
DESCRIPTION
The Hynix HYM71V32S755HCT4M Series are 32Mx72bits ECC Synchronous DRAM Modules. The modules are composed of eighteen 32Mx4bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on a
168pin glass-epoxy printed circuit board. One 0.22uF and one 0.0022uF decoupling capacitors per each SDRAM are mounted on the
PCB.
The Hynix HYM71V32S755HCT4M Series are Dual In-line Memory Modules suitable for easy interchange and addition of 256Mbytes
memory. The Hynix HYM71V32S755HCT4M Series are fully synchronous operation referenced to the positive edge of the clock . All
inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high
bandwidth.
FEATURES
•
PC100MHz support
•
SDRAM internal banks : four banks
•
168pin SDRAM Registered DIMM
•
Module bank : one physical bank
•
Serial Presence Detect with EEPROM
•
Auto refresh and self refresh
•
1.50” (38.10mm) Height PCB with double sided
components
•
4096 refresh cycles / 64ms
•
Programmable Burst Length and Burst Type
•
Single 3.3±0.3V power supply
•
All device pins are compatible with LVTTL interface
•
Data mask function by DQM
- 1, 2, 4 or 8 or Full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
•
Programmable CAS Latency ; 2, 3 Clocks
ORDERING INFORMATION
Part No.
Clock
Frequency
HYM71V32S755HCT4M-8
125MHz
HYM71V32S755HCT4M-P
100MHz
HYM71V32S755HCT4M-S
100MHz
Internal
Bank
Ref.
Power
SDRAM
Package
Plating
4 Banks
4K
Normal
TSOP-II
Gold
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.4/Dec. 01
2
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
PIN DESCRIPTION
PIN
PIN NAME
DESCRIPTION
CK0~CK3
Clock Inputs
The system clock input. All other inputs are registered to the SDRAM on the
rising edge of CLK
CKE0
Clock Enable
Controls internal clock signal and when deactivated, the SDRAM will be one
of the states among power down, suspend or self refresh
/S0, /S2
Chip Select
Enables or disables all inputs except CK, CKE and DQM
BA0, BA1
SDRAM Bank Address
Selects bank to be activated during /RAS activity
Selects bank to be read/written during /CAS activity
A0 ~ A11
Address
Row Address : RA0 ~ RA11, Column Address : CA0 ~ CA9, CA11
Auto-precharge flag : A10
/RAS, /CAS, /WE
Row Address Strobe, Column
Address Strobe, Write Enable
/RAS, /CAS and /WE define the operation
Refer function truth table for details
REGE
Register Enable
Register Enable pin which permits the DIMM to operateion in Buffered Mode
when REGE input is Low, in Registered Mode when REGE input is High
DQM0~DQM7
Data Input/Output Mask
Controls output buffers in read mode and masks input data in write mode
DQ0 ~ DQ63
Data Input/Output
Multiplexed data input / output pin
CB0 ~ CB7
Check Bit Input/Output
Check bits for ECC
VCC
Power Supply (3.3V)
Power supply for internal circuits and input buffers
VSS
Ground
Ground
SCL
SPD Clock Input
Serial Presence Detect Clock input
SDA
SPD Data Input/Output
Serial Presence Detect Data input/output
SA0~2
SPD Address Input
Serial Presence Detect Address Input
WP
Write Protect for SPD
Write Protect for Serial Presence Detect on DIMM
NC
No Connection
No connection
Rev. 0.4/Dec. 01
3
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
PIN ASSIGNMENTS
FRONT SIDE
PIN NO.
BACK SIDE
NAME
PIN NO.
NAME
FRONT SIDE
PIN NO.
NAME
BACK SIDE
PIN NO.
NAME
*CK1
1
VSS
85
VSS
41
VCC
125
2
DQ0
86
DQ32
42
CK0
126
NC
3
DQ1
87
DQ33
43
VSS
127
VSS
4
DQ2
88
DQ34
44
NC
128
CKE0
5
DQ3
89
DQ35
45
/S2
129
NC
6
VCC
90
VCC
46
DQM2
130
DQM6
7
DQ4
91
DQ36
47
DQM3
131
DQM7
8
DQ5
92
DQ37
48
NC
132
NC
9
DQ6
93
DQ38
49
VCC
133
VCC
10
DQ7
94
DQ39
50
NC
134
NC
51
NC
135
NC
52
CB2
136
CB6
Architecture Key
11
DQ8
95
DQ40
53
CB3
137
CB7
12
VSS
96
VSS
54
VSS
138
VSS
13
DQ9
97
DQ41
55
DQ16
139
DQ48
14
DQ10
98
DQ42
56
DQ17
140
DQ49
15
DQ11
99
DQ43
57
DQ18
141
DQ50
16
DQ12
100
DQ44
58
DQ19
142
DQ51
17
DQ13
101
DQ45
59
VCC
143
VCC
18
VCC
102
VCC
60
DQ20
144
DQ52
19
DQ14
103
DQ46
61
NC
145
NC
20
DQ15
104
DQ47
62
NC
146
NC
21
CB0
105
CB4
63
NC
147
REGE
22
CB1
106
CB5
64
VSS
148
VSS
23
VSS
107
VSS
65
DQ21
149
DQ53
24
NC
108
NC
66
DQ22
150
DQ54
25
NC
109
NC
67
DQ23
151
DQ55
26
VCC
110
VCC
68
VSS
152
VSS
27
/WE
111
/CAS
69
DQ24
153
DQ56
28
DQM0
112
DQM4
70
DQ25
154
DQ57
29
DQM1
113
DQM5
71
DQ26
155
DQ58
30
/S0
114
NC
72
DQ27
156
DQ59
31
NC
115
/RAS
73
VCC
157
VCC
32
VSS
116
VSS
74
DQ28
158
DQ60
33
A0
117
A1
75
DQ29
159
DQ61
34
A2
118
A3
76
DQ30
160
DQ62
35
A4
119
A5
77
DQ31
161
DQ63
36
A6
120
A7
78
VSS
162
VSS
37
A8
121
A9
79
*CK2
163
*CK3
38
A10/AP
122
BA0
80
NC
164
NC
39
BA1
123
A11
81
WP
165
SA0
40
VCC
124
VCC
82
SDA
166
SA1
83
SCL
167
SA2
84
VCC
168
VCC
Voltage Key
Note : * CK1 ~ CK3 are connected with termination R/C (Refer to the block diagram)
Rev. 0.4/Dec. 01
4
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
BLOCK DIAGRAM
Note : 1. The serial resistor values of DQs are 10ohms
2. The padding capacitance of termination R/C for CK1~CK3 is 12pF
Rev. 0.4/Dec. 01
5
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
SERIAL PRESENCE DETECT
BYTE
NUMBER
FUNCTION
DESCRIPTION
FUNCTION
-8
VALUE
-P
-S
-8
-P
BYTE0
# of Bytes Written into Serial Memory at Module
Manufacturer
128 Bytes
80h
BYTE1
Total # of Bytes of SPD Memory Device
256 Bytes
08h
BYTE2
Fundamental Memory Type
BYTE3
BYTE4
SDRAM
04h
# of Row Addresses on This Assembly
12
0Ch
# of Column Addresses on This Assembly
11
0Bh
-S
1
BYTE5
# of Module Banks on This Assembly
1 Bank
01h
BYTE6
Data Width of This Assembly
72 Bits
48h
BYTE7
Data Width of This Assembly (Continued)
-
00h
BYTE8
Voltage Interface Standard of This Assembly
LVTTL
01h
BYTE9
SDRAM Cycle Time @/CAS Latency=3
8ns
10ns
10ns
80h
A0h
A0h
BYTE10
Access Time from Clock @/CAS Latency=3
6ns
6ns
6ns
60h
60h
60h
BYTE11
DIMM Configuration Type
BYTE12
Refresh Rate/Type
BYTE13
BYTE14
ECC
02h
15.625us
/ Self Refresh Supported
80h
Primary SDRAM Width
x4
04h
Error Checking SDRAM Width
x4
04h
BYTE15
Minimum Clock Delay Back to Back Random Column
Address
BYTE16
Burst Lenth Supported
BYTE17
# of Banks on Each SDRAM Device
BYTE18
SDRAM Device Attributes, /CAS Lataency
BYTE19
SDRAM Device Attributes, /CS Lataency
tCCD = 1 CLK
01h
1,2,4,8,Full Page
8Fh
4 Banks
04h
/CAS Latency=2,3
06h
/CS Latency=0
01h
/WE Latency=0
01h
Registered inputs, with PLL
16h
+/- 10% voltage tolerence, Burst Read
Single Bit Write, Precharge All, Auto
Precharge, Early RAS Precharge
0Eh
2
BYTE20
SDRAM Device Attributes, /WE Lataency
BYTE21
SDRAM Module Attributes
BYTE22
SDRAM Device Attributes, General
BYTE23
SDRAM Cycle Time @/CAS Latency=2
8ns
10ns
12ns
A0h
A0h
C0h
BYTE24
Access Time from Clock @/CAS Latency=2
6ns
6ns
6ns
60h
60h
60h
BYTE25
SDRAM Cycle Time @/CAS Latency=1
-
-
-
00h
00h
00h
BYTE26
Access Time from Clock @/CAS Latency=1
-
-
-
00h
00h
00h
BYTE27
Minimum Row Precharge Time (tRP)
20ns
20ns
20ns
14h
14h
14h
BYTE28
Minimum Row Active to Row Active Delay (tRRD)
16ns
20ns
20ns
10h
14h
14h
BYTE29
Minimum /RAS to /CAS Delay (tRCD)
20ns
20ns
20ns
14h
14h
14h
BYTE30
Minimum /RAS Pulse Width (tRAS)
48ns
50ns
50ns
30h
32h
32h
BYTE31
Module Bank Density
BYTE32
Command and Address Signal Input Setup Time
2ns
2ns
2ns
20h
20h
20h
BYTE33
Command and Address Signal Input Hold Time
1ns
1ns
1ns
10h
10h
10h
BYTE34
Data Signal Input Setup Time
2ns
2ns
2ns
20h
20h
20h
BYTE35
Data Signal Input Hold Time
1ns
1ns
1ns
10h
10h
10h
BYTE36
~61
Superset Information (may be used in future)
BYTE62
SPD Revision
BYTE63
Checksum for Byte 0~62
BYTE64
Manufacturer JEDEC ID Code
BYTE65
~71
....Manufacturer JEDEC ID Code
BYTE72
Manufacturing Location
Rev. 0.4/Dec. 01
256MB
NOTE
40h
-
00h
Intel SPD 1.2A
-
12h
31h
57h
Hynix JEDED ID
ADh
Unused
FFh
HSI(Korea Area)
HSA (United States Area)
HSE (Europe Area)
HSJ (Japan Area)
HSS(Singapore)
Asia Area
0*h
1*h
2*h
3*h
4*h
5*h
3, 8
77h
9
6
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
Continued
BYTE
NUMBER
FUNCTION
DESCRIPTION
BYTE73
Manufacturer’s Part Number (Component)
BYTE74
Manufacturer’s Part Number (128Mb based)
BYTE75
Manufacturer’s Part Number (Voltage Interface)
BYTE76
BYTE77
FUNCTION
-8
-P
VALUE
-S
-8
-P
-S
NOTE
7 (SDRAM)
37h
4, 5
1
31h
4, 5
V (3.3V, LVTTL)
56h
4, 5
Manufacturer’s Part Number (Memory Width)
3
33h
4, 5
....Manufacturer’s Part Number (Memory Width)
2
32h
4, 5
BYTE78
Manufacturer’s Part Number (Module Type)
S
53h
4, 5
BYTE79
Manufacturer’s Part Number (Data Width)
7
37h
4, 5
BYTE80
....Manufacturer’s Part Number (Data Width)
5
35h
4, 5
BYTE81
Manufacturer’s Part Number (Refresh, SDRAM Bank)
5 (4K Refresh, 4Banks)
35h
4, 5
BYTE82
Manufacturer’s Part Number (Manufacturing Site)
H
48h
4, 5
BYTE83
Manufacturer’s Part Number (Generation)
C
43h
4, 5
BYTE84
Manufacturer’s Part Number (Package Type)
T
54h
4, 5
4 (x4 based)
34h
4, 5
M(1st Revsion)
4Dh
4, 5
BYTE85
Manufacturer’s Part Number (Component Configuration)
BYTE86
Manufacturer’s Part Number (Module Revision)
BYTE87
Manufacturer’s Part Number (Hyphent)
BYTE88
Manufacturer’s Part Number (Min. Cycle Time)
BYTE89
~90
Manufacturer’s Part Number
- (Hyphen)
8
P
2Dh
S
38h
50h
4, 5
53h
4, 5
Blanks
20h
4, 5
BYTE91
Revision Code (for Component)
Process Code
-
4, 6
BYTE92
....Revision Code (for PCB)
Process Code
-
4, 6
BYTE93
Manufacturing Date
BYTE94
....Manufacturing Date
BYTE95
~98
BYTE99
~125
Assembly Serial Number
Manufacturer Specific Data (may be used in future)
BYTE126
System Frequency Support
BYTE127
Intel Specification Details for 100MHz Support
BYTE128
~256
Unused Storage Locations
Year
-
3, 6
Work Week
-
3, 6
Serial Number
-
6
None
00h
100MHz
Refer to Note7
-
64h
8Fh
8Fh
7, 8
8Dh
7, 8
00h
Note :
1. The bank address is excluded
2. 1, 2, 4, 8 for Interleave Burst Type
3. BCD adopted
4. ASCII adopted
5. Basically Hynix writes Part No. except for ‘HYM’ in Byte 73~90 to use the limited 18 bytes from byte 73 to byte 90
6. Not fixed but dependent
7. CK0 connected to DIMM, TBD junction temp, CL2(3) support, Intel defined Concurrent Auto Precharge support
8. Refer to Intel SPD Specification 1.2B.
9. Refer to HSI Web site.
Rev. 0.4/Dec. 01
7
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Ambient Temperature
TA
0 ~ 70
°C
Storage Temperature
TSTG
-55 ~ 125
°C
Voltage on Any Pin relative to VSS
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD relative to VSS
VDD, VDDQ
-1.0 ~ 4.6
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD
18
W
Soldering Temperature ⋅ Time
TSOLDER
260 ⋅ 10
°C ⋅ Sec
Note : Operation at above absolute maximum rating can adversely affect device reliability.
DC OPERATING CONDITION (TA=0 to 70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Power Supply Voltage
VDD, VDDQ
3.0
3.3
3.6
V
1
Input High voltage
VIH
2.0
3.0
VDDQ + 0.3
V
1,2
Input Low voltage
VIL
-0.3
0
0.8
V
1,3
Note
Note :
1.All voltages are referenced to VSS = 0V
2.VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration.
3.VIL(min) is acceptable -2.0V AC pulse width with <=3ns of duration.
AC OPERATING TEST CONDITION (TA=0 to 70°C, VDD=3.3±0.3V, VSS=0V)
Parameter
Symbol
Value
Unit
AC Input High / Low Level Voltage
VIH / VIL
2.4/0.4
V
Vtrip
1.4
V
Input Rise / Fall Time
tR / tF
1
ns
Output Timing Measurement Reference Level Voltage
Voutref
1.4
V
CL
50
pF
Input Timing Measurement Reference Level Voltage
Output Load Capacitance for Access Time Measurement
1
Note :
1.Output load to measure access times is equivalent to two TTL gates and one capacitor (50pF). For details, refer to AC/DC output
load circuit
Rev. 0.4/Dec. 01
8
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
CAPACITANCE (TA=25°C, f=1MHz)
-8/P/S
Parameter
Pin
Input Capacitance
Data Input / Output Capacitance
Symbol
Unit
Min
Max
CK0
CI1
-
40
pF
CKE0
CI2
-
16
pF
/S0, /S2
CI3
-
16
pF
A0~11, BA0, BA1
CI4
-
16
pF
/RAS, /CAS, /WE
CI5
-
16
pF
DQM0~DQM7
CI6
-
16
pF
DQ0 ~ DQ63
CI/O
-
15
pF
OUTPUT LOAD CIRCUIT
Vtt=1.4V
RT=250 Ω
Output
Output
50pF
DC Output Load Circuit
Rev. 0.4/Dec. 01
50pF
AC Output Load Circuit
9
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
DC CHARACTERISTICS I (TA=0 to 70°C, VDD=3.3±0.3V)
Parameter
Symbol
Min.
Max
Unit
Note
Input Leakage Current
ILI
-10
10
uA
1
Output Leakage Current
ILO
-1
1
uA
2
Output High Voltage
VOH
2.4
-
V
IOH = -2mA
Output Low Voltage
VOL
-
0.4
V
IOL = +2mA
Note :
1.VIN = 0 to 3.6V, All other pins are not tested under VIN =0V
2.DOUT is disabled, VOUT=0 to 3.6
DC CHARACTERISTICS II
Parameter
Operating Current
Symbol
IDD1
Speed
Test Condition
Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA
-8
-P
-S
2500
2200
2200
CKE ≤ VIL(max), tCK = 15ns
356
CKE ≤ VIL(max), tCK = ∞
178
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns
Input signals are changed one time during
30ns. All other pins ≥ VDD-0.2V or ≤ 0.2V
570
IDD2NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
570
IDD3P
CKE ≤ VIL(max), tCK = 15ns
320
IDD3PS
CKE ≤ VIL(max), tCK = ∞
155
IDD3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns
Input signals are changed one time during
30ns. All other pins ≥ VDD-0.2V or ≤ 0.2V
840
IDD3NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
400
Burst Mode Operating
Current
IDD4
tCK ≥ tCK(min), IOL=0mA
All banks active
Auto Refresh Current
IDD5
tRRC ≥ tRRC(min), All banks active
Self Refresh Current
IDD6
CKE ≤ 0.2V
IDD2P
Precharge Standby Current
in Power Down Mode
IDD2PS
Precharge Standby Current
in Non Power Down Mode
Active Standby Current
in Power Down Mode
Active Standby Current
in Non Power Down Mode
Unit
Note
mA
1
mA
mA
mA
mA
CL=3
2900
2700
2700
CL=2
3200
2700
2700
mA
1
4800
mA
2
276
mA
Note :
1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open
2. Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
Rev. 0.4/Dec. 01
10
PC100 SDRAM Registered DIMM
AAC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
-8
Parameter
CAS Latency = 3
tCK3
Max
8
Min
Max
10
1000
CAS Latency = 2
-S
Symbol
Min
System Clock
Cycle Time
-P
HYM71V32S755HCT4M Series
Min
Unit
Note
1000
ns
1
Max
10
1000
tCK2
10
Clock High Pulse Width
tCHW
3
-
3
-
3
-
ns
2
Clock Low Pulse Width
tCLW
3
-
3
-
3
-
ns
2
CAS Latency = 3
tAC3
-
6
-
6
-
6
ns
CAS Latency = 2
tAC2
-
6
-
6
-
6
ns
Data-Out Hold Time
tOH
3
-
3
-
3
-
ns
Data-Input Setup Time
tDS
2
-
2
-
2
-
ns
2
Data-Input Hold Time
tDH
1
-
1
-
1
-
ns
2
Address Setup Time
tAS
2
-
2
-
2
-
ns
2
Address Hold Time
tAH
1
-
1
-
1
-
ns
2
CKE Setup Time
tCKS
2
-
2
-
2
-
ns
2
CKE Hold Time
tCKH
1
-
1
-
1
-
ns
2
Command Setup Time
tCS
2
-
2
-
2
-
ns
2
Command Hold Time
tCH
1
-
1
-
1
-
ns
2
CLK to Data Output in Low-Z Time
tOLZ
1
-
1
-
1
-
ns
CAS Latency = 3
tOHZ3
3
6
3
6
3
6
ns
CAS Latency = 2
tOHZ2
3
6
3
6
3
6
ns
Access Time
From Clock
CLK to Data
Output in High-Z
Time
10
12
3
Note :
1. In Registered DIMM, data is delayed an additional clock cycle due to the register (this is, Device CL + 1 = DIMM CL)
2.Assume tR / tF (input rise and fall time ) is 1ns, If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter
3.Access times to be measured with input signals of 1v/ns edge rate, from 0.8v to 2.0v
If tR > 1ns, then (tR/2-0.5)ns should be added to the parameter
Rev. 0.4/Dec. 01
11
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
AC CHARACTERISTICS II
-8
Parameter
-P
-S
Symbol
Unit
Min
Max
Min
Max
Min
Max
Note
Operation
tRC
68
-
70
-
70
-
ns
Auto Refresh
tRRC
68
-
70
-
70
-
ns
RAS to CAS Delay
tRCD
20
-
20
-
20
-
ns
RAS Active Time
tRAS
48
100K
50
100K
50
100K
ns
RAS Precharge Time
tRP
20
-
20
-
20
-
ns
RAS to RAS Bank Active Delay
tRRD
16
-
20
-
20
-
ns
CAS to CAS Delay
tCCD
1
-
1
-
1
-
CLK
Write Command to Data-In Delay
tWTL
1
-
1
-
1
-
CLK
1
Data-In to Precharge Command
tDPL
0
-
0
-
0
-
CLK
1
Data-In to Active Command
tDAL
3
-
2
-
2
-
CLK
1
DQM to Data-Out Hi-Z
tDQZ
3
-
3
-
3
-
CLK
1
DQM to Data-In Mask
tDQM
0
-
0
-
0
-
CLK
MRS to New Command
tMRD
2
-
2
-
2
-
CLK
CAS Latency = 3
tPROZ3
4
-
4
-
4
-
CAS Latency = 2
tPROZ2
3
-
3
-
3
-
Power Down Exit Time
tPDE
1
-
1
-
1
-
CLK
Self Refresh Exit Time
tSRE
1
-
1
-
1
-
CLK
Refresh Time
tREF
-
64
-
64
-
64
ms
RAS Cycle Time
Precharge to Data
Output Hi-Z
CLK
1
2
Note :
1. Timing delay due to the register is considered in a registered DIMM
2. A new command can be given tRRC after self refresh exit
Rev. 0.4/Dec. 01
12
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
DEVICE OPERATING OPTION TABLE
HYM71V32S755HCT4M-8
CAS Latency
tRCD
tRAS
tRC
tRP
tAC
tOH
125MHz(8ns)
3CLKs
3CLKs
6CLKs
9CLKs
3CLKs
6ns
3ns
100MHz(10ns)
2CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
83MHz(12ns)
2CLKs
2CLKs
4CLKs
6CLKs
2CLKs
6ns
3ns
HYM71V32S755HCT4M-P
CAS Latency
tRCD
tRAS
tRC
tRP
tAC
tOH
100MHz(10ns)
2CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
83MHz(12ns)
2CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
66MHz(15ns)
2CLKs
2CLKs
4CLKs
6CLKs
2CLKs
6ns
3ns
HYM71V32S755HCT4M-S
CAS Latency
tRCD
tRAS
tRC
tRP
tAC
tOH
100MHz(10ns)
3CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
83MHz(12ns)
2CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
66MHz(15ns)
2CLKs
2CLKs
4CLKs
6CLKs
2CLKs
6ns
3ns
Note : DIMM/CAS Latency = Device CL + 1 (Registered Mode)
Rev. 0.4/Dec. 01
13
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
COMMAND TRUTH TABLE
A10/
AP
BA
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
Mode Register Set
H
X
L
L
L
L
X
OP code
No Operation
H
X
H
X
X
X
L
H
H
H
X
X
Bank Active
H
X
L
L
H
H
X
H
X
L
H
L
H
X
CA
H
X
L
H
L
L
X
CA
H
X
L
L
H
L
X
X
Burst Stop
H
X
L
H
H
L
X
X
DQM
H
V
X
Auto Refresh
H
H
L
L
L
H
X
X
Burst-Read-Single-WRITE
H
X
L
L
L
L
X
A9 Pin High
(Other Pins OP code)
Entry
H
L
L
L
L
H
X
Exit
L
H
H
X
X
X
L
H
H
H
Entry
H
L
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
Command
Read
Read with Autoprecharge
Write
Write with Autoprecharge
Precharge All Banks
Precharge selected Bank
Self
Refresh1
X
Precharge
power down
Clock
Suspend
Exit
L
H
Entry
H
L
Exit
L
H
X
X
ADDR
RA
Note
V
L
H
L
H
V
V
H
X
L
V
MRS
Mode
X
X
X
X
X
X
X
Note :
1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high
2. X = Don′t care, H = Logic High, L = Logic Low. BA =Bank Address, RA = Row Address, CA = Column Address,
Opcode = Operand Code, NOP = No Operation
3. The burst read sigle write mode is entered by programming the Write burst mode bit (A9) in the mode register to a logic 1.
Rev. 0.4/Dec. 01
14
PC100 SDRAM Registered DIMM
HYM71V32S755HCT4M Series
PACKAGE DEMENSION
Rev. 0.4/Dec. 01
15