ETC SY88952L

3.3V, 2.7Gbps SDH/SONET
LASER DRIVER WITH AUTOMATIC
POWER CONTROL
FEATURES
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DESCRIPTION
Single 3.3V power supply
Up to 2.7Gbps operation
Rise/Fall times: < 75ps
Independent programmable laser modulation and
bias currents
Bias current to 100mA and modulation current to
90mA
Automatic average laser power control
Bias and modulation current monitors
Operating temperature range of –40°C to +85°C
Complies with ANSI, ITU, and Bellcore SDH/SONET
specifications
Available in DIE form and 32-pin (5mm × 5mm)
EPAD-MLF™ package
SY88952L is a highly integrated and programmable
laser driver for SONET/SDH application up to 2.7Gbps.
The device accepts differential PECL or LVDS data and
clock inputs. It provides programmable bias and
modulation currents for driving a laser. The modulation
output of SY88952L can be DC-coupled to drive the laser
diode, providing a significant power saving over ACcoupled operation. A synchronizing TTL input latch can
be used to reduce jitter if a clock signal is available. A
TTL enable is also incorporated in the device. EN only
enables/disables IMOD. It does not enable/disable IBIAS.
An automatic power controller (APC) is integrated into
SY88952L to maintain a constant average optical output
power over temperature and lifetime. The modulation
current can be externally temperature compensated to
minimize the variation of extinction ratio of the optical
output.
Several safety features will enable an alarm function
when the output signal is too high, or bias current is too
high.
There are two alarm conditions:
1. /FAIL asserts when bias current loop goes to
maximum of it's range. IBIAS and IMOD still flow under
this condition.
2. /FAIL asserts when IBIASMAX or IMODSET are too
high (implying IBIAS or IMOD will be too high). All currents
will shut off under this condition.
APPLICATIONS
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ADVANCE
SY88952L
OC-48 transceivers and transponders
SONET/SDH transmission system
Add drop mux
Metro area network
2.5Gbps optical transmitter
Fiber optical module
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
Rev.: A
1
Amendment: /0
Issue Date: November 2002
SY88952L
Micrel
PACKAGE/ORDERING INFORMATION
VCC
BIASMAX
MODSET
VEE
VEE
VEE
SLOW
MD
Ordering Information(Note 1)
1
2
3
4
5
6
7
8
32 3130 29 28 27 26 25
24
23
22
21
20
19
18
17
9 10 11 12 13 14 15 16
VCC
/Q
/Q
VCC
Q
Q
VCC
VEE
Package
Type
Operating
Range
Package
Marking
SY88952LMI
MLF-32
Industrial
SY88952L
SY88952LMITR*
MLF-32
Industrial
SY88952L
*Tape and Reel
Note 1. Dice are designed to operate from –40°C to +85°C, but are tested
and guaranteed to TA = +25°C only.
EN
VEE
BIASMON
MODMON
/FAIL
VEE
VEE
BIAS
VCC
D
/D
VCC
CLK
/CLK
VCC
LATCH
Part Number
32-Pin MLF™ (MLF-32)
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
16
BIAS
11
BIASMON
Bias Current Monitor: Sinks current that is proportional to IBIAS, (IBIAS /40). An external current
path must exist to VCC.
31
BIASMAX
A resistor (RBIASMAX) connected to ground sets the maximum bias current.
See “Typical Operating Characteristics” (IBIAS vs. RBIASMAX).
26
SLOW
5, 6
CLK,/CLK
2, 3
D, /D
9
EN
8
LATCH
25
MD
19, 20, 22, 23
Q, /Q
12
MODMON
Modulation Current Monitor: Sinks current that is proportional to IMOD, (IMOD /45). An external
current path must exist to VCC.
30
MODSET
A resistor (RMODSET) connected to ground sets the modulation current.
See “Typical Operating Characteristics” (IMOD vs. RMODSET).
13
/FAIL
TTL Open-Collector Output: Connect a 5kΩ resistor to VCC. Indicates APC failure when LOW.
1, 4, 7, 18, 21, 24, 32
VCC
Positive Power Supply.
10, 14, 15, 17,
27, 28, 29, EP
VEE
Device Ground: Ensure the exposed pad is also connected to ground.
Bias Current Output (IBIAS).
Connect a capacitor (CSLOW) to ground to provide a slow-start.
Differential Clock Input. 75KΩ pull-down on CLK, 75kΩ pull-up and 75kΩ pull-down on /CLK.
Differential Data Input. 75KΩ pull-down on D, 75kΩ pull-up and 75kΩ pull-down on /D.
TTL Input with 75kΩ pull-up: Default HIGH for normal operation; LOW to disable modulation
current.
TTL Input with 75kΩ pull-up: Default HIGH for latched (clocked) data; LOW for direct data.
Connect this pin to a monitor photodiode anode, a resistor (RAPCSET) and a capacitor (CAPCSET).
This sets the desired average optical power.
Differential Output: Modulation current output (IMOD).
TRUTH TABLE(Note 1)
D
/D
EN
OUT(Note 2)
Note 1.
Note 2.
/OUT
L
H
H
H
L
H
L
H
L
H
X
X
L
H
L
2
L = LOW, H = HIGH, X = don't care.
H = IOUT ≤ IMOD_OFF.
Micrel
SY88952L
Absolute Maximum Ratings(Note 1)
Operating Ratings(Note 2, 3)
Supply Voltage (VCC) ..................................... +0V to +7.0V
Input Voltage (VIN) ............................................ +0V to VCC
Output Current (IOUT) ............................................... 100mA
Lead Temperature (soldering, 10 sec.) ..................... 300°C
Storage Temperature (TS) ....................... –65°C to +150°C
Supply Voltage (VCC) .................................. +3.0V to +3.6V
Ambient Temperature (TA) ......................... –40°C to +85°C
Junction Temperature (TJ) ........................................ 120°C
Package Thermal Resistance
MLF™
(θJA) still-air ..................................................... 34°C/W
(ψJB) still-air ..................................................... 19°C/W
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG
conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
Devices are ESD sensitive. Handling precautions recommended.
DC ELECTRICAL CHARACTERISTICS
VCC = 3.0V to 3.6V; VEE = GND; RLOAD = 5Ω; TA = –40°C to +85°C
Symbol
Parameter
Condition
ICC
Supply Current
Note 1
IBIAS
Bias Current Range
Note 2
IMOD
Modulation Current Range
Note 2
IMOD_OFF
Modulation Off Current
Note 3
VID
Differential Input Voltage
VICMR
Common Mode Range
VIH
TTL Input HIGH Voltage
VIL
TTL Input LOW Voltage
VOL
/FAIL Output LOW Voltage
IOH
/FAIL Output Leakage Current
Note 1.
Note 2.
Note 3.
Note 4.
Note 5.
Min
Typ
Max
Units
85
mA
1
100
mA
1
90
mA
750
µA
200
1600
mVp-p
VCC –1.49
VCC –VID/4
V
2.0
VCC
V
0.8
V
Note 4
0.5
V
Note 5
100
µA
Excluding actual IBIAS and IMOD output currents.
Voltage at Q, /Q must not drop below VCC –1.5V. Voltage BIAS, MODMON and BIASMON must not drop below VCC –2V.
EN = LOW.
IOL = +2mA.
VOH = 3.6V.
3
SY88952L
Micrel
AC ELECTRICAL CHARACTERISTICS(NOTE 1)
VCC = 3.0V to 3.6V; VEE = GND; TA = –40°C to +85°C; typical values @VCC = 3.3V, TA = 25°C, IMOD = 40mA, IBIAS = 50mA, RLOAD = 5Ω
Symbol
Parameter
CID
Maximum Consecutive
Identical Digits
PWD
Pulse Width Distortion
tS
Latch Set-Up Time
40
ps
tH
Latch Hold Time
40
ps
t r, t f
Output Rise/Fall Time
(20% to 80%)
Note 1.
Note 2.
Note 3.
Condition
Min
Typ
Max
80
Note 2, 3
bits
50
75
AC characteristics are guaranteed by design and characterization.
Measured with 622Mbps 0-1 pattern, latch = HIGH.
PWD = (Wider pulse – narrower pulse) /2.
TIMING DIAGRAM
tCLK = 400ps
CLK
tS
tH
D
Setup/Hold Time Definition
4
Units
ps
ps
Micrel
SY88952L
TYPICAL OPERATING CHARACTERISTICS(NOTE 1)
VCC = 3.3V, TA = 25°C, unless otherwise stated.
160
140
140
120
120
100
100
80
60
60
40
20
20
10000
0
10
100
1000
RBIASMAX (Ω)
Bias-Current Monitor Gain
vs. Temperature
IMOD = 40mA,
IBIAS = 50mA
50
40
30 IMOD = 10mA,
IBIAS = 10mA
20
10
0
-40
10000
-20 0
20 40 60
TEMPERATURE (°C)
IAPCSET vs. RAPCSET
2
IMOD = 40mA,
IBIAS = 50mA
50
1.5
40
IAPCSET (mA)
GAIN (IBIAS/IBIASMON)
60
30 IMOD = 10mA,
IBIAS = 10mA
20
1
0.5
10
0
-40
Note 1.
80
40
100
1000
RMODSET (Ω)
60
GAIN (IMOD/IMODMON)
160
0
10
Modulation-Current Monitor Gain
vs. Temperature
IBIAS vs. RBIASMAX
IBIAS (mA)
IMOD (mA)
IMOD vs. RMODSET
-20 0
20 40 60
TEMPERATURE (°C)
0
1
80
IBIAS and IMOD must never exceed 100mA and 90mA, respectively.
5
10
RAPCSET (KΩ)
100
80
SY88952L
Micrel
BLOCK DIAGRAM
VCC
LATCH
/Q
0
RD
Q
D
D
MUX
Q
CLK
1
EN
VCC
100Ω
BIAS
BIASMON
X40
IBIAS
40
X40
VCC
MD
100Ω
IMOD
45
RAPCSET
Failure
Detect
MODSET
RBIAS MAX
SLOW
RMODSET
VREF
CSLOW
MODMON
/FAIL
BIASMAX
5kΩ
VCC
6
CAPCSET
Micrel
SY88952L
32 LEAD EPAD-Micro LEADFRAME™ (MLF-32)
Rev. 01
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 32-Pin MLF™ Package
(Always solder to equivalent or PCB)
7
SY88952L
Micrel
MICREL, INC. 1849 FORTUNE DRIVE
TEL
+ 1 (408) 944-0800
FAX
SAN JOSE, CA 95131 USA
+ 1 (408) 944-0970
WEB
http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc.
© 2002 Micrel, Incorporated.
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