ETC AM486DXPGA

486pga_temp4 Comparision
Ceramic Packages Only
AMD486DE2, DX2, DX4 & DX5
in PGA Packages
with Heat Sink
degrees C
80.0
100.0
84.8
63.2
69.8
DE2
DX2 (Commercial)
DX2 (Industrial)
DX4 (Commercial)
DX4 (Industrial)
DX5 (Commercial)
76.9
61.9
54.3
60.0
40.0
20.0
65.4
62.1
52.3
60.0
50.4
38.9
40.0
20.0
0.0
0.0
Max. Ambient Temp. at 3.3V
Equations:
Max. Ambient Temp. at 3.3V
Tj = Tcase + P * ThetaJC
TA = Tj - P * ThetaJA
Tcase = TA + P * (ThetaJA - ThetaJC)
TA = Tcase - P * (ThetaJA - ThetaJC)
Enhanced Am486DX Data Sheet Specifications
168 Pin Ceramic PGA without Heat Spreader
Voltage Icc Spec. Frequency Total Icc
Power
Case Temp.
Theta JC
Junction
Theta JA
Ambient
(3.0-3.6V) (mA/MHz)
(MHz)
(mA)
(Watts)
(degrees C) (deg. C/Watt) Temp.(C) (deg. C/Watt)
Temp.(C)
AMD
Am486
DE2
DX2 (Commercial)
DX2 (Industrial)
DX4 (Commercial)
DX4 (Industrial)
DX5 (Commercial)
77.1
80.0
degrees C
100.0
AMD486DE2, DX2, DX4 & DX5
in PGA Packages
without Heat Sink
168 Pin Ceramic PGA with Heat Sink
Theta JC
Junction
Theta JA
(deg. C/Watt) Temp.(C) (deg. C/Watt)
Ambient
Temp.(C)
DE2
Commercial
Typ.
Max.
Max.
3.3
3.3
3.6
8.0
10.0
10.0
66
66
66
528.0
660.0
660.0
1.74
2.18
2.38
85
85
85
1.5
1.5
1.5
87.6
88.3
88.6
16.5
16.5
16.5
58.9
52.3
49.4
2.0
2.0
2.0
88.5
89.4
89.8
12.0
12.0
12.0
67.6
63.2
61.2
DX2
Industrial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
66
66
66
409.2
462.0
462.0
1.35
1.52
1.66
100
100
100
1.5
1.5
1.5
102.0
102.3
102.5
16.5
16.5
16.5
79.7
77.1
75.1
2.0
2.0
2.0
102.7
103.0
103.3
12.0
12.0
12.0
86.5
84.8
83.4
DX2
Commercial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
66
66
66
409.2
462.0
462.0
1.35
1.52
1.66
85
85
85
1.5
1.5
1.5
87.0
87.3
87.5
16.5
16.5
16.5
64.7
62.1
60.1
2.0
2.0
2.0
87.7
88.0
88.3
12.0
12.0
12.0
71.5
69.8
68.4
DX4
Industrial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
100
100
100
620.0
700.0
700.0
2.05
2.31
2.52
100
100
100
1.5
1.5
1.5
103.1
103.5
103.8
16.5
16.5
16.5
69.3
65.4
62.2
2.0
2.0
2.0
104.1
104.6
105.0
12.0
12.0
12.0
79.5
76.9
74.8
DX4
Commercial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
100
100
100
620.0
700.0
700.0
2.05
2.31
2.52
85
85
85
1.5
1.5
1.5
88.1
88.5
88.8
16.5
16.5
16.5
54.3
50.4
47.2
2.0
2.0
2.0
89.1
89.6
90.0
12.0
12.0
12.0
64.5
61.9
59.8
DX5
Industrial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
133
133
133
824.6
931.0
931.0
2.72
3.07
3.35
100
100
100
DX5
Commercial
Typ.
Max.
Max.
3.3
3.3
3.6
6.2
7.0
7.0
133
133
133
824.6
931.0
931.0
2.72
3.07
3.35
85
85
85
DX5 is Not Supported in Industrial Temp,,
168 PGA package
1.5
1.5
1.5
89.1
89.6
90.0
Table #1
Page 1
16.5
16.5
16.5
44.2
38.9
34.7
DX5 is Not Supported in Industrial Temp,,
168 PGA package
2.0
2.0
2.0
90.4
91.1
91.7
12.0
12.0
12.0
57.8
54.3
51.5
486pga_temp4 Comparision
Ceramic Packages Only
Note:
AMD's PDE-208 Standard SQFP Package Thermal Resistance
Cooling
Theta JA vs. Airflow in Linear ft/min. (m/sec)
Mechanism
Psi JT
0 (0)
200 (1.01) 400 (2.03)
600 (3.04)
800 (4.06)
No Heat Sink
1.5
14.0
8.7
7.4
6.4
5.8
Note 2.
AMD's PDH-208 Low-Cost SQFP Package Thermal Resistance
Cooling
Theta JA vs. Airflow in Linear ft/min. (m/sec)
Mechanism
Psi JT
0 (0)
200 (1.01) 400 (2.03)
600 (3.04)
800 (4.06)
No Heat Sink
5.5
22.5
15.4
13.4
11.9
10.9
Note 2.
AMD's 168 Pin PGA Package Thermal Resistance
Cooling
Theta JA vs. Airflow in Linear ft/min. (m/sec)
Mechanism
Theta JC
0 (0)
200 (1.01) 400 (2.03)
600 (3.04)
800 (4.06)
No Heat Sink
1.5
16.5
14.0
12.0
10.5
9.5
Note 2.
1.) All data shown in Table #1 is based on No Airflow.
2.) Theta JA thermal resistance with Airflow is based on an average of measured values.
Page 2