www.fairchildsemi.com RC1117 1A Adjustable/Fixed Low Dropout Linear Regulator Features Description • • • • • • The RC1117 and RC1117-2.5, -2.85, -3.3 and -5 are low dropout three-terminal regulators with 1A output current capability. These devices have been optimized for low voltage where transient response and minimum input voltage are critical. The 2.85V version is designed specifically to be used in Active Terminators for SCSI bus. Low dropout voltage Load regulation: 0.05% typical Trimmed current limit On-chip thermal limiting Standard SOT-223, TO-263, and TO-252 packages Three-terminal adjustable or fixed 2.5V, 2.85V, 3.3V, 5V Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and ambient temperatures that would create excessive junction temperatures. Applications • • • • • • Active SCSI terminators High efficiency linear regulators Post regulators for switching supplies Battery chargers 5V to 3.3V linear regulators Motherboard clock supplies Unlike PNP type regulators where up to 10% of the output current is wasted as quiescent current, the quiescent current of the RC1117 flows into the load, increasing efficiency. The RC1117 series regulators are available in the industrystandard SOT-223, TO-263 (D2PAK), and TO-252 (DPAK) power packages. Typical Applications RC1117 VIN = 3.3V VIN + VOUT 10µF R1 124Ω ADJ 1.5V at 1A + 22µF R2 24.9Ω VOUT = VREF(1 + R2/R1) + IAdj • R2 RC1117-2.85 VIN = 5V + VIN VOUT 10µF 2.85V at 1A + 22µF GND REV. 1.2.9 12/7/01 PRODUCT SPECIFICATION RC1117 Pin Assignments Tab is VOUT Front View Tab is VOUT Tab is VOUT 3 IN 2 OUT 1 ADJ/GND 1 2 3 1 2 3 4-Lead Plastic SOT-223 ΘJC = 15°C/W* ADJ/ GND IN ADJ/ GND 3-Lead Plastic TO-252 ΘJC = 3°C/W* IN 3-Lead Plastic TO-263 ΘJC = 3°C/W* *With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., ΘJA can vary from 30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W. Absolute Maximum Ratings Parameter Min. Max. 7.5 V 0 125 °C -65 150 °C 300 °C VIN Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec.) 2 Unit REV. 1.2.9 12/7/01 RC1117 PRODUCT SPECIFICATION Electrical Characteristics Operating Conditions: VIN ≤ 7V, TJ = 25°C unless otherwise specified. The • denotes specifications which apply over the specified operating temperature range. Parameter Min. Typ. Max. Units • 1.225 (-2%) 1.250 1.275 (+2%) V 10mA ≤ IOUT ≤ 1A RC1117-2.5, 4V ≤ VIN ≤ 7V RC1117-2.85, 4.35V ≤ VIN ≤ 7V RC1117-3.3, 4.8V ≤ VIN ≤ 7V RC1117-5, 6.5V ≤ VIN ≤ 7V • • • • 2.450 2.793 3.234 4.900 2.5 2.85 3.3 5.0 2.550 2.907 3.366 5.100 V V V V (VOUT + 1.5V) ≤ VIN ≤ 7V, IOUT = 10mA • 0.005 0.2 % Load Regulation (VIN – VOUT) = 2V, 10mA ≤ IOUT ≤ 1A • 0.05 0.5 % Dropout Voltage ∆VREF = 1%, IOUT = 1A • 1.100 1.200 V Current Limit (VIN – VOUT) = 2V • Reference Voltage, VREF Conditions 3 Output Voltage Line Regulation1,2 1,2 1.5V ≤ (VIN - VOUT) ≤ 5.75V, 10mA ≤ IOUT ≤ 1A Adjust Pin Current, IAdj3 µA 0.2 5 µA • Minimum Load Current 1.5V ≤ (VIN – VOUT) ≤ 5.75 • • VIN = VOUT + 1.25V f = 120Hz, COUT = 22µF Tantalum, (VIN – VOUT) = 3V, IOUT = 1A Thermal Regulation TA = 25°C, 30ms pulse 10 mA 4 60 13 72 0.004 • Temperature Stability A 120 1.5V ≤ (VIN – VOUT) ≤ 5.75, 10mA ≤ IOUT ≤ 1A Quiescent Current 1.5 35 Adjust Pin Current Change3 Ripple Rejection 1.1 • mA dB 0.02 0.5 %/W % Long-Term Stability TA = 125°C, 1000hrs. 0.03 RMS Output Noise (% of VOUT) TA = 25°C, 10Hz ≤ f ≤ 10kHz 0.003 % Thermal Resistance, Junction SOT-223 to Case TO-252, TO-263 15 °C/W 3 °C/W Thermal Shutdown 155 °C 10 °C Thermal Shutdown Hysteresis Junction Temperature 1.0 % Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/ output voltage range. 3. RC1117 only. REV. 1.2.9 12/7/01 3 PRODUCT SPECIFICATION RC1117 Typical Performance Characteristics 0.10 DROPOUT VOLTAGE DEVIATION (%) DROPOUT VOLTAGE (V) 1.5 1.4 1.3 1.2 1.1 TJ = 0°C 1.0 0.9 TJ = 25°C 0.8 TJ = 125°C 0.7 0.6 0.5 0 0 0.2 0.4 0.6 0.8 0.05 0 -0.05 -0.10 -0.15 -0.20 -75 -50 -25 0 1.0 OUTPUT CURRENT (A) Figure 2. Load Regulation vs. Temperature 1.250 3.70 1.245 3.65 1.240 1.235 1.230 1.225 1.220 1.215 1.210 VOUT = 3.6V1 3.60 3.55 3.50 3.45 3.40 3.35 VOUT = 3.3V 3.30 3.25 1.200 -75 -50 -25 0 3.20 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 4. Output Voltage vs. Temperature 100 Note: 1. RC1117 Only 90 ADJUST PIN CURRENT (µA) MINIMUM LOAD CURRENT (mA) Note: 1. RC1117 Only 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) 5 4 3 2 1 80 70 60 50 40 30 20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 5. Minimum Load Current vs. Temperature 4 VOUT SET WITH 1% RESISTORS 1.205 Figure 3. Reference Voltage vs. Temperature 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) REFERENCE VOLTAGE (V) REFERENCE VOLTAGE (V) Figure 1. Dropout Voltage vs. Output Current ∆I = 1A 0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 6. Adjust Pin Current vs. Temperature REV. 1.2.9 12/7/01 RC1117 PRODUCT SPECIFICATION Typical Performance Characteristics (continued) 90 80 RIPPLE REJECTION (dB) SHORT-CIRCUIT CURRENT (A) 2.0 1.75 1.5 1.25 70 60 50 40 30 (VIN - VOUT) = 3V 0.5 < VRIPPLE < 2V IOUT = 1A 20 10 1.0 -75 -50 -25 0 0 10 25 50 75 100 125 150 175 100 JUNCTION TEMPERATURE (°C) 1K 10K 100K FREQUENCY (Hz) Figure 7. Short-Circuit Current vs. Temperature Figure 8. Ripple Rejection vs. Frequency 10 POWER (W) 7.5 TO-252 & TO-263 5 SOT-223 2.5 0 25 45 65 85 105 125 CASE TEMPERATURE (°C) Figure 9. Maximum Power Dissipation REV. 1.2.9 12/7/01 5 PRODUCT SPECIFICATION RC1117 Mechanical Dimensions 4-Lead SOT-223 Package Inches Symbol Millimeters Min. Max. Min. Max. A A1 B c D — — .025 — .248 .071 .181 1.80 4.80 E e F H I J K L M N .130 .148 — — .640 — 6.30 3.30 .840 2.29 6.71 3.71 .115 .033 .264 .012 — 10° .0008 10° .010 .124 .041 .287 — 10° 16° .0040 16° .014 2.95 .840 6.71 .310 — 10° .0203 10° .250 3.15 1.04 7.29 — 10° 16° .1018 16° .360 .033 .090 .264 Notes D e K A H E N J M B I L A1 c 6 F REV. 1.2.9 12/7/01 RC1117 PRODUCT SPECIFICATION Mechanical Dimensions 3-Lead TO-252 Package Inches Symbol Min. A b b2 b3 c c2 D E e H L L1 L3 L4 Max. Millimeters Min. Notes: Notes Max. .086 .094 .025 .035 .030 .045 .205 .215 .018 .024 .018 .023 .210 .245 .250 .265 .090 BSC .370 .410 2.19 2.39 0.64 0.89 0.76 1.14 5.21 5.46 0.46 0.61 0.46 0.58 5.33 6.22 6.35 6.73 2.29 BSC 9.40 10.41 .055 .070 .108 REF .035 .080 .025 .040 1.40 1.78 2.74 REF 0.89 2.03 0.64 1.02 4 1. Dimensions are exclusive of mold flash and metal burrs. 2. Stand off-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface. 4. Thermal pad contour optional within dimensions b3 and L3 5. Formed leads to be planar with respect to one another at seating plane -C-. 6. Dimensions and tolerances per ASME Y14.5M-1994. 1 1 3 4 E @PKG/ @HEATSINK L3 b3 c2 D E-PIN L4 H b2 L1 L c b e -B- α = 0°–10° -A- A -C- REV. 1.2.9 12/7/01 7 PRODUCT SPECIFICATION RC1117 Mechanical Dimensions 3-Lead TO-263 Package Symbol Inches Millimeters Notes Min. Max. Min. Max. A b b2 c2 D E e .160 .020 .190 .039 4.06 0.51 4.83 0.99 L L1 L2 R α .575 .090 — .017 0° .049 .051 .045 .055 .340 .380 .380 .405 .100 BSC .625 .110 .055 .019 8° 1.25 1.30 1.14 1.40 8.64 9.65 9.65 10.29 2.54 BSC 14.61 2.29 — 0.43 0° Notes: 1. Dimensions are exclusive of mold flash and metal burrs. 2. Standoff-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface (at inner R). 4. Dimensiuon exclusive of dambar protrusion or intrusion. 5. Formed leads to be planar with respect to one another at seating place -C-. 15.88 2.79 1.40 0.78 8° E @PKG/ @HEATSINK L2 c2 D E-PIN L R (2 PLCS) b2 L1 b e -B- -A- A -C- 8 REV. 1.2.9 12/7/01 PRODUCT SPECIFICATION RC1117 Ordering Information Product Number Output Package RC1117DX Adjustable TO-252 in tape and reel RC1117M Adjustable TO-263 RC1117MT Adjustable TO-263 in tape and reel RC1117ST Adjustable SOT-223 in tape and reel RC1117D25X 2.5 volt TO-252 in tape and reel RC1117M25 2.5 volt TO-263 RC1117M25T 2.5 volt TO-263 in tape and reel RC1117S25T 2.5 volt SOT-223 in tape and reel RC1117M285 2.85 volt TO-263 RC1117M285T 2.85 volt TO-263 in tape and reel RC1117S285T 2.85 volt SOT-223 in tape and reel RC1117D33X 3.3 volt TO-252 in tape and reel RC1117M33 3.3 volt TO-263 RC1117M33T 3.3 volt TO-263 in tape and reel RC1117S33T 3.3 volt SOT-223 in tape and reel RC1117D5X 5 volt TO-252 in tape and reel RC1117M5 5 volt TO-263 RC1117M5T 5 volt TO-263 in tape and reel RC1117S5T 5 volt SOT-223 in tape and reel DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 12/7/01 0.0m 005 Stock#DS30001117 2001 Fairchild Semiconductor Corporation