ETC AT45DB081B-CNI

Features
•
•
•
•
•
•
•
•
•
•
•
•
Single 2.5V - 3.6V or 2.7V - 3.6V Supply
Serial Peripheral Interface (SPI) Compatible
20 MHz Max Clock Frequency
Page Program Operation
– Single Cycle Reprogram (Erase and Program)
– 4096 Pages (264 Bytes/Page) Main Memory
Supports Page and Block Erase Operations
Two 264-byte SRAM Data Buffers – Allows Receiving of Data
while Reprogramming of Nonvolatile Memory
Continuous Read Capability through Entire Array
– Ideal for Code Shadowing Applications
Low Power Dissipation
– 4 mA Active Read Current Typical
– 2 µA CMOS Standby Current Typical
Hardware Data Protection Feature
100% Compatible to AT45DB081 and AT45DB081A
5.0V-tolerant Inputs: SI, SCK, CS, RESET and WP Pins
Commercial and Industrial Temperature Ranges
8-megabit
2.5-volt Only or
2.7-volt Only
DataFlash®
AT45DB081B
Description
The AT45DB081B is a 2.5-volt or 2.7-volt only, serial interface Flash memory ideally
suited for a wide variety of digital voice-, image-, program code- and data-storage
applications. Its 8,650,752 bits of memory are organized as 4096 pages of 264 bytes
each. In addition to the main memory, the AT45DB081B also contains two SRAM
data buffers of 264 bytes each. The buffers allow receiving of data while a page in the
main memory is being reprogrammed, as well as writing a continuous data stream.
Pin Configurations
Pin Name
Function
CS
Chip Select
SCK
Serial Clock
SI
Serial Input
SO
Serial Output
WP
Hardware Page Write
Protect Pin
RESET
Chip Reset
RDY/BUSY
Ready/Busy
CASON
Top View through Package
SI
SCK
RESET
CS
1
2
3
4
SO
7 GND
6 VCC
5 WP
8
TSOP Top View
Type 1
RDY/BUSY
RESET
WP
NC
NC
VCC
GND
NC
NC
NC
CS
SCK
SI
SO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SOIC
GND
NC
NC
CS
SCK
SI
SO
NC
NC
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
28
27
26
25
24
23
22
21
20
19
18
17
16
15
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CBGA Top View
through Package
VCC
NC
NC
WP
RESET
RDY/BUSY
NC
NC
NC
NC
NC
NC
NC
NC
1
2
3
NC
NC
SCK
GND
VCC
A
B
C
CS RDY/BSY WP
D
SO
SI
RESET
NC
NC
NC
E
Rev. 2225E–DFLSH–11/02
1
EEPROM emulation (bit or byte alterability) is easily handled with a self-contained three
step Read-Modify-Write operation. Unlike conventional Flash memories that are
accessed randomly with multiple address lines and a parallel interface, the DataFlash
uses a SPI serial interface to sequentially access its data. DataFlash supports SPI mode
0 and mode 3. The simple serial interface facilitates hardware layout, increases system
reliability, minimizes switching noise, and reduces package size and active pin count.
The device is optimized for use in many commercial and industrial applications where
high density, low pin count, low voltage, and low power are essential. The device operates at clock frequencies up to 20 MHz with a typical active read current consumption of
4 mA.
To allow for simple in-system reprogrammability, the AT45DB081B does not require
high input voltages for programming. The device operates from a single power supply,
2.5V to 3.6V or 2.7V to 3.6V, for both the program and read operations. The
AT45DB081B is enabled through the chip select pin (CS) and accessed via a three-wire
interface consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock
(SCK).
All programming cycles are self-timed, and no separate erase cycle is required before
programming.
When the device is shipped from Atmel, the most significant page of the memory array
may not be erased. In other words, the contents of the last page may not be filled with
FFH.
Block Diagram
FLASH MEMORY ARRAY
WP
PAGE (264 BYTES)
BUFFER 1 (264 BYTES)
SCK
CS
RESET
VCC
GND
RDY/BUSY
Memory Array
2
BUFFER 2 (264 BYTES)
I/O INTERFACE
SI
SO
To provide optimal flexibility, the memory array of the AT45DB081B is divided into three
levels of granularity comprising of sectors, blocks, and pages. The Memory Architecture
Diagram illustrates the breakdown of each level and details the number of pages per
sector and block. All program operations to the DataFlash occur on a page-by-page
basis; however, the optional erase operations can be performed at the block or page
level.
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Memory Architecture Diagram
SECTOR 1 = 248 Pages
65,472 bytes (62K + 1984)
SECTOR 2 = 256 Pages
67,584 bytes (64K + 2K)
SECTOR 0
BLOCK 0
BLOCK 1
SECTOR 1
SECTOR 0 = 8 Pages
2112 bytes (2K + 64)
BLOCK ARCHITECTURE
BLOCK 2
PAGE ARCHITECTURE
8 Pages
PAGE 0
BLOCK 0
SECTOR ARCHITECTURE
PAGE 8
SECTOR 8 = 512 Pages
135,168 bytes (128K + 4K)
SECTOR 9 = 512 Pages
135,168 bytes (128K + 4K)
SECTOR 2
SECTOR 4 = 512 Pages
135,168 bytes (128K + 4K)
BLOCK 33
PAGE 9
PAGE 14
PAGE 15
BLOCK 62
PAGE 16
BLOCK 63
PAGE 17
BLOCK 64
PAGE 18
BLOCK 65
PAGE 4093
BLOCK 510
BLOCK 511
Block = 2112 bytes
(2K + 64)
Device Operation
BLOCK 1
BLOCK 31
BLOCK 32
PAGE 6
PAGE 7
BLOCK 30
SECTOR 3 = 512 Pages
135,168 bytes (128K + 4K)
PAGE 1
PAGE 4094
PAGE 4095
Page = 264 bytes
(256 + 8)
The device operation is controlled by instructions from the host processor. The list of
instructions and their associated opcodes are contained in Tables 1 through 4. A valid
instruction starts with the falling edge of CS followed by the appropriate 8-bit opcode
and the desired buffer or main memory address location. While the CS pin is low, toggling the SCK pin controls the loading of the opcode and the desired buffer or main
memory address location through the SI (serial input) pin. All instructions, addresses
and data are transferred with the most significant bit (MSB) first.
Buffer addressing is referenced in the datasheet using the terminology BFA8 - BFA0 to
denote the nine address bits required to designate a byte address within a buffer. Main
memory addressing is referenced using the terminology PA11 - PA0 and BA8 - BA0
where PA11 - PA0 denotes the 12 address bits required to designate a page address
and BA8 - BA0 denotes the nine address bits required to designate a byte address
within the page.
Read Commands
By specifying the appropriate opcode, data can be read from the main memory or from
either one of the two data buffers. The DataFlash supports two categories of read
modes in relation to the SCK signal. The differences between the modes are in respect
to the inactive state of the SCK signal as well as which clock cycle data will begin to be
output. The two categories, which are comprised of four modes total, are defined as
Inactive Clock Polarity Low or Inactive Clock Polarity High and SPI Mode 0 or SPI
Mode 3. A separate opcode (refer to Table 1 on page 10 for a complete list) is used to
select which category will be used for reading. Please refer to the “Detailed Bit-level
Read Timing” diagrams in this datasheet for details on the clock cycle sequences for
each mode.
CONTINUOUS ARRAY READ: By supplying an initial starting address for the main
memory array, the Continuous Array Read command can be utilized to sequentially
read a continuous stream of data from the device by simply providing a clock signal; no
additional addressing information or control signals need to be provided. The DataFlash
incorporates an internal address counter that will automatically increment on every clock
3
2225E–DFLSH–11/02
cycle, allowing one continuous read operation without the need of additional address
sequences. To perform a continuous read, an opcode of 68H or E8H must be clocked
into the device followed by 24 address bits and 32 don’t care bits. The first three bits of
the 24-bit address sequence are reserved for upward and downward compatibility to
larger and smaller density devices (see Notes under “Command Sequence for
Read/Write Operations” diagram). The next 12 address bits (PA11 - PA0) specify which
page of the main memory array to read, and the last nine bits (BA8 - BA0) of the 24-bit
address sequence specify the starting byte address within the page. The 32 don’t care
bits that follow the 24 address bits are needed to initialize the read operation. Following
the 32 don’t care bits, additional clock pulses on the SCK pin will result in serial data
being output on the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bits, the don’t
care bits, and the reading of data. When the end of a page in main memory is reached
during a Continuous Array Read, the device will continue reading at the beginning of the
next page with no delays incurred during the page boundary crossover (the crossover
from the end of one page to the beginning of the next page). When the last bit in the
main memory array has been read, the device will continue reading back at the beginning of the first page of memory. As with crossing over page boundaries, no delays will
be incurred when wrapping around from the end of the array to the beginning of the
array.
A low-to-high transition on the CS pin will terminate the read operation and tri-state the
SO pin. The maximum SCK frequency allowable for the Continuous Array Read is
defined by the fCAR specification. The Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged.
MAIN MEMORY PAGE READ: A Main Memory Page Read allows the user to read data
directly from any one of the 4096 pages in the main memory, bypassing both of the data
buffers and leaving the contents of the buffers unchanged. To start a page read, an
opcode of 52H or D2H must be clocked into the device followed by 24 address bits and
32 don’t care bits. The first three bits of the 24-bit address sequence are reserved bits,
the next 12 address bits (PA11 - PA0) specify the page address, and the next nine
address bits (BA8 - BA0) specify the starting byte address within the page. The 32 don’t
care bits which follow the 24 address bits are sent to initialize the read operation. Following the 32 don’t care bits, additional pulses on SCK result in serial data being output
on the SO (serial output) pin. The CS pin must remain low during the loading of the
opcode, the address bits, the don’t care bits, and the reading of data. When the end of a
page in main memory is reached during a Main Memory Page Read, the device will continue reading at the beginning of the same page. A low-to-high transition on the CS pin
will terminate the read operation and tri-state the SO pin.
BUFFER READ: Data can be read from either one of the two buffers, using different
opcodes to specify which buffer to read from. An opcode of 54H or D4H is used to read
data from buffer 1, and an opcode of 56H or D6H is used to read data from buffer 2. To
perform a Buffer Read, the eight bits of the opcode must be followed by 15 don’t care
bits, nine address bits, and eight don’t care bits. Since the buffer size is 264 bytes, nine
address bits (BFA8 - BFA0) are required to specify the first byte of data to be read from
the buffer. The CS pin must remain low during the loading of the opcode, the address
bits, the don’t care bits, and the reading of data. When the end of a buffer is reached,
the device will continue reading back at the beginning of the buffer. A low-to-high transition on the CS pin will terminate the read operation and tri-state the SO pin.
STATUS REGISTER READ: The status register can be used to determine the device’s
Ready/Busy status, the result of a Main Memory Page to Buffer Compare operation, or
the device density. To read the status register, an opcode of 57H or D7H must be
4
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
loaded into the device. After the last bit of the opcode is shifted in, the eight bits of the
status register, starting with the MSB (bit 7), will be shifted out on the SO pin during the
next eight clock cycles. The five most significant bits of the status register will contain
device information, while the remaining three least-significant bits are reserved for future
use and will have undefined values. After bit 0 of the status register has been shifted
out, the sequence will repeat itself (as long as CS remains low and SCK is being toggled) starting again with bit 7. The data in the status register is constantly updated, so
each repeating sequence will output new data.
Status Register Format
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RDY/BUSY
COMP
1
0
0
1
X
X
Ready/Busy status is indicated using bit 7 of the status register. If bit 7 is a 1, then the
device is not busy and is ready to accept the next command. If bit 7 is a 0, then the
device is in a busy state. The user can continuously poll bit 7 of the status register by
stopping SCK at a low level once bit 7 has been output. The status of bit 7 will continue
to be output on the SO pin, and once the device is no longer busy, the state of SO will
change from 0 to 1. There are eight operations which can cause the device to be in a
busy state: Main Memory Page to Buffer Transfer, Main Memory Page to Buffer Compare, Buffer to Main Memory Page Program with Built-in Erase, Buffer to Main Memory
Page Program without Built-in Erase, Page Erase, Block Erase, Main Memory Page
Program, and Auto Page Rewrite.
The result of the most recent Main Memory Page to Buffer Compare operation is indicated using bit 6 of the status register. If bit 6 is a 0, then the data in the main memory
page matches the data in the buffer. If bit 6 is a 1, then at least one bit of the data in the
main memory page does not match the data in the buffer.
The device density is indicated using bits 5, 4, 3 and 2 of the status register. For the
AT45DB081B, the four bits are 1, 0, 0 and 1. The decimal value of these four binary bits
does not equate to the device density; the three bits represent a combinational code
relating to differing densities of Serial DataFlash devices, allowing a total of sixteen different density configurations.
Program and Erase
Commands
BUFFER WRITE: Data can be shifted in from the SI pin into either buffer 1 or buffer 2.
To load data into either buffer, an 8-bit opcode, 84H for buffer 1 or 87H for buffer 2, must
be followed by 15 don’t care bits and nine address bits (BFA8 - BFA0). The nine
address bits specify the first byte in the buffer to be written. The data is entered following
the address bits. If the end of the data buffer is reached, the device will wrap around
back to the beginning of the buffer. Data will continue to be loaded into the buffer until a
low-to-high transition is detected on the CS pin.
BUFFER TO MAIN MEMORY PAGE PROGRAM WITH BUILT-IN ERASE: Data written
into either buffer 1 or buffer 2 can be programmed into the main memory. To start the
operation, an 8-bit opcode, 83H for buffer 1 or 86H for buffer 2, must be followed by the
three reserved bits, 12 address bits (PA11 - PA0) that specify the page in the main
memory to be written, and nine additional don’t care bits. When a low-to-high transition
occurs on the CS pin, the part will first erase the selected page in main memory to all 1s
and then program the data stored in the buffer into the specified page in the main memory. Both the erase and the programming of the page are internally self-timed and
should take place in a maximum time of tEP. During this time, the status register will indicate that the part is busy.
5
2225E–DFLSH–11/02
BUFFER TO MAIN MEMORY PAGE PROGRAM WITHOUT BUILT-IN ERASE: A
previously erased page within main memory can be programmed with the contents of
either buffer 1 or buffer 2. To start the operation, an 8-bit opcode, 88H for buffer 1 or
89H for buffer 2, must be followed by the three reserved bits, 12 address bits
(PA11 - PA0) that specify the page in the main memory to be written, and nine additional don’t care bits. When a low-to-high transition occurs on the CS pin, the part will
program the data stored in the buffer into the specified page in the main memory. It is
necessary that the page in main memory that is being programmed has been previously
erased. The programming of the page is internally self-timed and should take place in a
maximum time of tP. During this time, the status register will indicate that the part is
busy.
Successive page programming operations without doing a page erase are not recommended. In other words, changing bytes within a page from a “1” to a “0” during multiple
page programming operations without erasing that page is not recommended.
PAGE ERASE: The optional Page Erase command can be used to individually erase
any page in the main memory array allowing the Buffer to Main Memory Page Program
without Built-in Erase command to be utilized at a later time. To perform a Page Erase,
an opcode of 81H must be loaded into the device, followed by three reserved bits,
12 address bits (PA11 - PA0), and nine don’t care bits. The 12 address bits are used to
specify which page of the memory array is to be erased. When a low-to-high transition
occurs on the CS pin, the part will erase the selected page to 1s. The erase operation is
internally self-timed and should take place in a maximum time of tPE. During this time,
the status register will indicate that the part is busy.
BLOCK ERASE: A block of eight pages can be erased at one time allowing the Buffer
to Main Memory Page Program without Built-in Erase command to be utilized to reduce
programming times when writing large amounts of data to the device. To perform a
Block Erase, an opcode of 50H must be loaded into the device, followed by three
reserved bits, nine address bits (PA11 - PA3), and 12 don’t care bits. The nine address
bits are used to specify which block of eight pages is to be erased. When a low-to-high
transition occurs on the CS pin, the part will erase the selected block of eight pages to
1s. The erase operation is internally self-timed and should take place in a maximum
time of tBE. During this time, the status register will indicate that the part is busy.
Block Erase Addressing
6
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Block
0
0
0
0
0
0
0
0
0
X
X
X
0
0
0
0
0
0
0
0
0
1
X
X
X
1
0
0
0
0
0
0
0
1
0
X
X
X
2
0
0
0
0
0
0
0
1
1
X
X
X
3
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1
1
1
1
1
1
1
0
0
X
X
X
508
1
1
1
1
1
1
1
0
1
X
X
X
509
1
1
1
1
1
1
1
1
0
X
X
X
510
1
1
1
1
1
1
1
1
1
X
X
X
511
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
MAIN MEMORY PAGE PROGRAM THROUGH BUFFER: This operation is a combination of the Buffer Write and Buffer to Main Memory Page Program with Built-in Erase
operations. Data is first shifted into buffer 1 or buffer 2 from the SI pin and then programmed into a specified page in the main memory. To initiate the operation, an 8-bit
opcode, 82H for buffer 1 or 85H for buffer 2, must be followed by the three reserved bits
and 21 address bits. The 12 most significant address bits (PA11 - PA0) select the page
in the main memory where data is to be written, and the next nine address bits
(BFA8 - BFA0) select the first byte in the buffer to be written. After all address bits are
shifted in, the part will take data from the SI pin and store it in one of the data buffers. If
the end of the buffer is reached, the device will wrap around back to the beginning of the
buffer. When there is a low-to-high transition on the CS pin, the part will first erase the
selected page in main memory to all 1s and then program the data stored in the buffer
into the specified page in the main memory. Both the erase and the programming of the
page are internally self-timed and should take place in a maximum of time tEP. During
this time, the status register will indicate that the part is busy.
Additional Commands
MAIN MEMORY PAGE TO BUFFER TRANSFER: A page of data can be transferred
from the main memory to either buffer 1 or buffer 2. To start the operation, an 8-bit
opcode, 53H for buffer 1 and 55H for buffer 2, must be followed by the three reserved
bits, 12 address bits (PA11 - PA0) which specify the page in main memory that is to be
transferred, and nine don’t care bits. The CS pin must be low while toggling the SCK pin
to load the opcode, the address bits, and the don’t care bits from the SI pin. The transfer
of the page of data from the main memory to the buffer will begin when the CS pin transitions from a low to a high state. During the transfer of a page of data (tXFR), the status
register can be read to determine whether the transfer has been completed or not.
MAIN MEMORY PAGE TO BUFFER COMPARE: A page of data in main memory can
be compared to the data in buffer 1 or buffer 2. To initiate the operation, an 8-bit opcode,
60H for buffer 1 and 61H for buffer 2, must be followed by 24 address bits consisting of
the three reserved bits, 12 address bits (PA11 - PA0) which specify the page in the main
memory that is to be compared to the buffer, and nine don’t care bits. The CS pin must
be low while toggling the SCK pin to load the opcode, the address bits, and the don’t
care bits from the SI pin. On the low-to-high transition of the CS pin, the 264 bytes in the
selected main memory page will be compared with the 264 bytes in buffer 1 or buffer 2.
During this time (tXFR), the status register will indicate that the part is busy. On completion of the compare operation, bit 6 of the status register is updated with the result of the
compare.
AUTO PAGE REWRITE: This mode is only needed if multiple bytes within a page or
multiple pages of data are modified in a random fashion. This mode is a combination of
two operations: Main Memory Page to Buffer Transfer and Buffer to Main Memory Page
Program with Built-in Erase. A page of data is first transferred from the main memory to
buffer 1 or buffer 2, and then the same data (from buffer 1 or buffer 2) is programmed
back into its original page of main memory. To start the rewrite operation, an 8-bit
opcode, 58H for buffer 1 or 59H for buffer 2, must be followed by the three reserved bits,
12 address bits (PA11 - PA0) that specify the page in main memory to be rewritten, and
nine additional don’t care bits. When a low-to-high transition occurs on the CS pin, the
part will first transfer data from the page in main memory to a buffer and then program
the data from the buffer back into same page of main memory. The operation is internally self-timed and should take place in a maximum time of tEP. During this time, the
status register will indicate that the part is busy.
7
2225E–DFLSH–11/02
If a sector is programmed or reprogrammed sequentially page-by-page, then the programming algorithm shown in Figure 1 on page 26 is recommended. Otherwise, if
multiple bytes in a page or several pages are programmed randomly in a sector, then
the programming algorithm shown in Figure 2 on page 27 is recommended. Each page
within a sector must be updated/rewritten at least once within every 10,000 cumulative
page erase/program operations in that sector.
Operation Mode
Summary
The modes described can be separated into two groups – modes which make use of the
Flash memory array (Group A) and modes which do not make use of the Flash memory
array (Group B).
Group A modes consist of:
1. Main Memory Page Read
2. Main Memory Page to Buffer 1 (or 2) Transfer
3. Main Memory Page to Buffer 1 (or 2) Compare
4. Buffer 1 (or 2) to Main Memory Page Program with Built-in Erase
5. Buffer 1 (or 2) to Main Memory Page Program without Built-in Erase
6. Page Erase
7. Block Erase
8. Main Memory Page Program through Buffer
9. Auto Page Rewrite
Group B modes consist of:
1. Buffer 1 (or 2) Read
2. Buffer 1 (or 2) Write
3. Status Register Read
If a Group A mode is in progress (not fully completed) then another mode in Group A
should not be started. However, during this time in which a Group A mode is in
progress, modes in Group B can be started.
This gives the Serial DataFlash the ability to virtually accommodate a continuous data
stream. While data is being programmed into main memory from buffer 1, data can be
loaded into buffer 2 (or vice versa). See application note AN-4 (“Using Atmel’s Serial
DataFlash”) for more details.
Pin Descriptions
SERIAL INPUT (SI): The SI pin is an input-only pin and is used to shift data into the
device. The SI pin is used for all data input including opcodes and address sequences.
SERIAL OUTPUT (SO): The SO pin is an output-only pin and is used to shift data out
from the device.
SERIAL CLOCK (SCK): The SCK pin is an input-only pin and is used to control the flow
of data to and from the DataFlash. Data is always clocked into the device on the rising
edge of SCK and clocked out of the device on the falling edge of SCK.
CHIP SELECT (CS): The DataFlash is selected when the CS pin is low. When the
device is not selected, data will not be accepted on the SI pin, and the SO pin will
remain in a high-impedance state. A high-to-low transition on the CS pin is required to
start an operation, and a low-to-high transition on the CS pin is required to end an
operation.
8
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
WRITE PROTECT: If the WP pin is held low, the first 256 pages of the main memory
cannot be reprogrammed. The only way to reprogram the first 256 pages is to first drive
the protect pin high and then use the program commands previously mentioned. The
WP pin is internally pulled high; therefore, connection of the WP pin is not necessary if
this pin and feature will not be utilized. However, it is recommended that the WP pin be
driven high externally whenever possible.
RESET: A low state on the reset pin (RESET) will terminate the operation in progress
and reset the internal state machine to an idle state. The device will remain in the reset
condition as long as a low level is present on the RESET pin. Normal operation can
resume once the RESET pin is brought back to a high level.
The device incorporates an internal power-on reset circuit, so there are no restrictions
on the RESET pin during power-on sequences. The RESET pin is also internally pulled
high; therefore, connection of the RESET pin is not necessary if this pin and feature will
not be utilized. However, it is recommended that the RESET pin be driven high externally whenever possible.
READY/BUSY: This open drain output pin will be driven low when the device is busy in
an internally self-timed operation. This pin, which is normally in a high state (through
a 1 kW external pull-up resistor), will be pulled low during programming operations, compare operations, and during page-to-buffer transfers.
The busy status indicates that the Flash memory array and one of the buffers cannot be
accessed; read and write operations to the other buffer can still be performed.
Power-on/Reset State
When power is first applied to the device, or when recovering from a reset condition, the
device will default to SPI Mode 3. In addition, the SO pin will be in a high-impedance
state, and a high-to-low transition on the CS pin will be required to start a valid instruction. The SPI mode will be automatically selected on every falling edge of CS by
sampling the inactive clock state.
9
2225E–DFLSH–11/02
Table 1. Read Commands
Command
SCK Mode
Opcode
Inactive Clock Polarity Low or High
68H
SPI Mode 0 or 3
E8H
Inactive Clock Polarity Low or High
52H
SPI Mode 0 or 3
D2H
Inactive Clock Polarity Low or High
54H
SPI Mode 0 or 3
D4H
Inactive Clock Polarity Low or High
56H
SPI Mode 0 or 3
D6H
Inactive Clock Polarity Low or High
57H
SPI Mode 0 or 3
D7H
Continuous Array Read
Main Memory Page Read
Buffer 1 Read
Buffer 2 Read
Status Register Read
Table 2. Program and Erase Commands
Command
SCK Mode
Opcode
Buffer 1 Write
Any
84H
Buffer 2 Write
Any
87H
Buffer 1 to Main Memory Page Program with Built-in Erase
Any
83H
Buffer 2 to Main Memory Page Program with Built-in Erase
Any
86H
Buffer 1 to Main Memory Page Program without Built-in Erase
Any
88H
Buffer 2 to Main Memory Page Program without Built-in Erase
Any
89H
Page Erase
Any
81H
Block Erase
Any
50H
Main Memory Page Program through Buffer 1
Any
82H
Main Memory Page Program through Buffer 2
Any
85H
SCK Mode
Opcode
Main Memory Page to Buffer 1 Transfer
Any
53H
Main Memory Page to Buffer 2 Transfer
Any
55H
Main Memory Page to Buffer 1 Compare
Any
60H
Main Memory Page to Buffer 2 Compare
Any
61H
Auto Page Rewrite through Buffer 1
Any
58H
Auto Page Rewrite through Buffer 2
Any
59H
Table 3. Additional Commands
Command
Note:
10
In Tables 2 and 3, an SCK mode designation of “Any” denotes any one of the four modes of operation (Inactive Clock Polarity
Low, Inactive Clock Polarity High, SPI Mode 0, or SPI Mode 3).
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Table 4. Detailed Bit-level Addressing Sequence
Address Byte
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
BA8
BA7
BA6
BA5
BA4
BA3
BA2
BA1
BA0
Additional
Don’t Care
Bytes
Required
Reserved
Address Byte
Reserved
Reserved
Address Byte
50H
0 1 0 1 0 0 0 0 r
r
r
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
x
x
x
N/A
52H
0 1 0 1 0 0 1 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
4 Bytes
53H
0 1 0 1 0 0 1 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
54H
0 1 0 1 0 1 0 0 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
1 Byte
55H
0 1 0 1 0 1 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
56H
0 1 0 1 0 1 1 0 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
1 Byte
57H
0 1 0 1 0 1 1 1
58H
0 1 0 1 1 0 0 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
59H
0 1 0 1 1 0 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
60H
0 1 1 0 0 0 0 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
61H
0 1 1 0 0 0 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
68H
0 1 1 0 1 0 0 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
4 Bytes
81H
1 0 0 0 0 0 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
82H
1 0 0 0 0 0 1 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
N/A
83H
1 0 0 0 0 0 1 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
84H
1 0 0 0 0 1 0 0 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
N/A
85H
1 0 0 0 0 1 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
N/A
86H
1 0 0 0 0 1 1 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
87H
1 0 0 0 0 1 1 1 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
N/A
88H
1 0 0 0 1 0 0 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
89H
1 0 0 0 1 0 0 1 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
x
x
x
x
x
x
x
x
x
N/A
D2H
1 1 0 1 0 0 1 0 r
r
r
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
4 Bytes
D4H
1 1 0 1 0 1 0 0 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
1 Byte
D6H
1 1 0 1 0 1 1 0 x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
B
B
B
B
B
B
B
B
B
1 Byte
D7H
1 1 0 1 0 1 1 1
Opcode
E8H
Note:
Opcode
1 1 1 0 1 0 0 0 r
N/A
N/A
N/A
r
r
P
P
N/A
N/A
P
P
P
P
P
P
P
P
N/A
N/A
P
P
B
B
B
B
B
B
N/A
B
B
B
4 Bytes
r = Reserved Bit
P = Page Address Bit
B = Byte/Buffer Address Bit
x = Don’t Care
11
2225E–DFLSH–11/02
Absolute Maximum Ratings*
*NOTICE:
Temperature under Bias ................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
DC and AC Operating Range
Operating Temperature
(Case)
AT45DB081B (2.5V Version)
AT45DB081B
0°C to 70°C
0°C to 70°C
–
-40°C to 85°C
2.5V to 3.6V
2.7V to 3.6V
Com.
Ind.
(1)
VCC Power Supply
Note:
1. After power is applied and VCC is at the minimum specified datasheet value, the system should wait 20 ms before an operational mode is started.
DC Characteristics
Symbol
Parameter
Condition
ISB
Standby Current
ICC1(1)
Typ
Max
Units
CS, RESET, WP = VCC, all inputs
at CMOS levels
2
10
µA
Active Current, Read
Operation
f = 20 MHz; IOUT = 0 mA;
VCC = 3.6V
4
10
mA
ICC2
Active Current,
Program/Erase Operation
VCC = 3.6V
15
35
mA
ILI
Input Load Current
VIN = CMOS levels
1
µA
ILO
Output Leakage Current
VI/O = CMOS levels
1
µA
VIL
Input Low Voltage
0.6
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 1.6 mA; VCC = 2.7V
VOH
Output High Voltage
IOH = -100 µA
Note:
12
Min
2.0
V
0.4
VCC - 0.2V
V
V
1. Icc1 during a buffer read is 20mA maximum.
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
AC Characteristics
AT45DB081B
(2.5V Version)
AT45DB081B
Min
Min
Max
Max
Units
15
20
MHz
15
20
MHz
Symbol
Parameter
fSCK
SCK Frequency
fCAR
SCK Frequency for Continuous Array Read
tWH
SCK High Time
30
22
ns
tWL
SCK Low Time
30
22
ns
tCS
Minimum CS High Time
250
250
ns
tCSS
CS Setup Time
250
250
ns
tCSH
CS Hold Time
250
250
ns
tCSB
CS High to RDY/BUSY Low
tSU
Data In Setup Time
10
5
ns
tH
Data In Hold Time
15
10
ns
tHO
Output Hold Time
0
0
ns
tDIS
Output Disable Time
20
18
ns
tV
Output Valid
25
20
ns
tXFR
Page to Buffer Transfer/Compare Time
300
250
µs
tEP
Page Erase and Programming Time
20
20
ms
tP
Page Programming Time
14
14
ms
tPE
Page Erase Time
8
8
ms
tBE
Block Erase Time
12
12
ms
tRST
RESET Pulse Width
tREC
RESET Recovery Time
200
10
200
10
1
ns
µs
1
µs
13
2225E–DFLSH–11/02
Input Test Waveforms and Measurement Levels
AC
DRIVING
LEVELS
2.4V
2.0
0.8
0.45V
AC
MEASUREMENT
LEVEL
tR, tF < 3 ns (10% to 90%)
Output Test Load
DEVICE
UNDER
TEST
30 pF
AC Waveforms
Two different timing diagrams are shown below. Waveform 1 shows the SCK signal
being low when CS makes a high-to-low transition, and Waveform 2 shows the SCK signal being high when CS makes a high-to-low transition. Both waveforms show valid
timing diagrams. The setup and hold times for the SI signal are referenced to the low-tohigh transition on the SCK signal.
Waveform 1 shows timing that is also compatible with SPI Mode 0, and Waveform 2
shows timing that is compatible with SPI Mode 3.
Waveform 1 – Inactive Clock Polarity Low and SPI Mode 0
tCS
CS
tWH
tCSS
tWL
tCSH
SCK
tHO
tV
SO
HIGH IMPEDANCE
VALID OUT
tSU
SI
tDIS
HIGH IMPEDANCE
tH
VALID IN
Waveform 2 – Inactive Clock Polarity High and SPI Mode 3
tCS
CS
tCSS
tWL
tWH
tCSH
SCK
tV
SO
HIGH Z
tHO
VALID OUT
tSU
SI
14
tDIS
HIGH IMPEDANCE
tH
VALID IN
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Reset Timing (Inactive Clock Polarity Low Shown)
CS
tREC
tCSS
SCK
tRST
RESET
HIGH IMPEDANCE
HIGH IMPEDANCE
SO
SI
Note:
The CS signal should be in the high state before the RESET signal is deasserted.
Command Sequence for Read/Write Operations (except Status Register Read)
SI
MSB
r r r XXXXX
Reserved for
larger densities
Notes:
CMD
8 bits
XXXX
Page Address
(PA11-PA0)
8 bits
XXXX
8 bits
XXXX XXXX
LSB
Byte/Buffer Address
(BA8-BA0/BFA8-BFA0)
1. “r” designates bits reserved for larger densities.
2. It is recommended that “r” be a logical “0” for densities of 8M bits or smaller.
3. For densities larger than 8M bits, the “r” bits become the most significant Page Address bit for the appropriate density.
15
2225E–DFLSH–11/02
Write Operations
The following block diagram and waveforms illustrate the various write sequences
available.
FLASH MEMORY ARRAY
PAGE (264 BYTES)
BUFFER 1 TO
MAIN MEMORY
PAGE PROGRAM
MAIN MEMORY
PAGE PROGRAM
THROUGH BUFFER 2
BUFFER 1 (264 BYTES)
BUFFER 2 TO
MAIN MEMORY
PAGE PROGRAM
BUFFER 2 (264 BYTES)
MAIN MEMORY PAGE
PROGRAM THROUGH
BUFFER 1
BUFFER 1
WRITE
BUFFER 2
WRITE
I/O INTERFACE
SI
Main Memory Page Program through Buffers
· Completes writing into selected buffer
· Starts self-timed erase/program operation
CS
SI
CMD
r r r , PA11-7
PA6-0, BFA8
BFA7-0
n
n+1
Last Byte
Buffer Write
· Completes writing into selected buffer
CS
SI
CMD
X
X···X, BFA8
BFA7-0
n
n+1
Last Byte
Buffer to Main Memory Page Program (Data from Buffer Programmed into Flash Page)
Starts self-timed erase/program operation
CS
SI
Each transition represents
8 bits and 8 clock cycles
16
CMD
r r r , PA11-7
PA6-0, X
X
n = 1st byte read
n+1 = 2nd byte read
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Read Operations
The following block diagram and waveforms illustrate the various read sequences
available.
FLASH MEMORY ARRAY
PAGE (264 BYTES)
MAIN MEMORY
PAGE TO
BUFFER 2
MAIN MEMORY
PAGE TO
BUFFER 1
BUFFER 1 (264 BYTES)
BUFFER 2 (264 BYTES)
BUFFER 1
READ
BUFFER 2
READ
MAIN MEMORY
PAGE READ
I/O INTERFACE
SO
Main Memory Page Read
CS
SI
r r r , PA11-7
CMD
BA7-0
PA6-0, BA8
X
X
X
X
SO
n
n+1
Main Memory Page to Buffer Transfer (Data from Flash Page Read into Buffer)
Starts reading page data into buffer
CS
SI
CMD
r r r , PA11-7
PA6-0, X
X
SO
Buffer Read
CS
SI
SO
Each transition represents
8 bits and 8 clock cycles
CMD
X
X···X, BFA8
BFA7-0
X
n
n+1
n = 1st byte read
n+1 = 2nd byte read
17
2225E–DFLSH–11/02
Detailed Bit-level Read Timing – Inactive Clock Polarity Low
Continuous Array Read (Opcode: 68H)
CS
SCK
1
2
63
64
0
1
X
X
65
66
67
68
tSU
SI
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
D6
D5
D2
D1
LSB
MSB
D0
D7
BIT 2111
OF
PAGE n
D6
D5
BIT 0
OF
PAGE n+1
Main Memory Page Read (Opcode: 52H)
CS
SCK
1
2
3
4
5
60
61
62
63
64
0
X
X
X
X
X
65
66
67
tSU
COMMAND OPCODE
SI
0
1
0
1
tV
SO
18
HIGH-IMPEDANCE
DATA OUT
D7
MSB
D6
D5
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Detailed Bit-level Read Timing – Inactive Clock Polarity Low (Continued)
Buffer Read (Opcode: 54H or 56H)
CS
SCK
1
2
3
4
5
36
37
38
39
40
0
X
X
X
X
X
41
42
43
tSU
COMMAND OPCODE
SI
1
0
1
0
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
MSB
D6
D5
Status Register Read (Opcode: 57H)
CS
SCK
1
2
0
1
3
4
5
6
7
8
1
1
9
10
11
12
16
17
tSU
COMMAND OPCODE
SI
0
1
0
1
tV
SO
HIGH-IMPEDANCE
STATUS REGISTER OUTPUT
D7
MSB
D6
D5
D1
D0
LSB
D7
MSB
19
2225E–DFLSH–11/02
Detailed Bit-level Read Timing – Inactive Clock Polarity High
Continuous Array Read (Opcode: 68H)
CS
SCK
1
2
63
64
65
66
67
tSU
SI
1
0
X
X
X
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
D6
D5
D2
D1
LSB
MSB
D0
D7
BIT 2111
OF
PAGE n
D6
D5
BIT 0
OF
PAGE n+1
Main Memory Page Read (Opcode: 52H)
CS
SCK
1
2
3
4
5
61
62
63
64
65
66
67
68
tSU
COMMAND OPCODE
SI
0
1
0
1
0
X
X
X
X
X
tV
SO
20
HIGH-IMPEDANCE
DATA OUT
D7
MSB
D6
D5
D4
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Detailed Bit-level Read Timing – Inactive Clock Polarity High (Continued)
Buffer Read (Opcode: 54H or 56H)
CS
SCK
1
2
3
4
5
37
38
39
40
41
42
44
43
tSU
COMMAND OPCODE
SI
1
0
1
0
0
X
X
X
X
X
tV
DATA OUT
HIGH-IMPEDANCE
SO
D7
MSB
D6
D5
D4
Status Register Read (Opcode: 57H)
CS
SCK
1
2
3
4
5
6
7
8
9
10
11
12
17
18
tSU
COMMAND OPCODE
SI
0
1
0
1
0
1
1
1
tV
SO
HIGH-IMPEDANCE
STATUS REGISTER OUTPUT
D7
MSB
D6
D5
D4
D0
LSB
D7
MSB
D6
21
2225E–DFLSH–11/02
Detailed Bit-level Read Timing – SPI Mode 0
Continuous Array Read (Opcode: E8H)
CS
SCK
1
2
62
63
64
1
1
X
X
X
65
66
67
tSU
SI
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
D6
D5
D2
D1
LSB
MSB
D0
D7
BIT 2111
OF
PAGE n
D6
D5
BIT 0
OF
PAGE n+1
Main Memory Page Read (Opcode: D2H)
CS
SCK
1
2
3
4
5
60
61
62
63
64
0
X
X
X
X
X
65
66
67
tSU
COMMAND OPCODE
SI
1
1
0
1
tV
SO
HIGH-IMPEDANCE
DATA OUT
D7
D6
D5
D4
MSB
22
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Detailed Bit-level Read Timing – SPI Mode 0
Buffer Read (Opcode: D4H or D6H)
CS
SCK
1
2
3
4
5
36
37
38
39
40
0
X
X
X
X
X
41
42
43
tSU
COMMAND OPCODE
SI
1
1
1
0
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
D6
D4
D5
MSB
Status Register Read (Opcode: D7H)
CS
SCK
1
2
3
4
5
6
7
8
1
1
9
10
D7
MSB
D6
11
12
16
17
tSU
COMMAND OPCODE
SI
1
1
0
1
0
1
tV
SO
HIGH-IMPEDANCE
STATUS REGISTER OUTPUT
D5
D4
D1
D0
LSB
D7
MSB
23
2225E–DFLSH–11/02
Detailed Bit-level Read Timing – SPI Mode 3
Continuous Array Read (Opcode: E8H)
CS
SCK
1
2
63
64
65
66
67
tSU
SI
1
1
X
X
X
tV
HIGH-IMPEDANCE
SO
DATA OUT
D7
D6
D5
D2
D1
LSB
MSB
D0
D7
BIT 2111
OF
PAGE n
D6
D5
BIT 0
OF
PAGE n+1
Main Memory Page Read (Opcode: D2H)
CS
SCK
1
2
3
4
5
61
62
63
64
65
66
67
68
tSU
COMMAND OPCODE
SI
1
1
0
1
0
X
X
X
X
X
tV
SO
24
HIGH-IMPEDANCE
DATA OUT
D7
MSB
D6
D5
D4
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Detailed Bit-level Read Timing – SPI Mode 3 (Continued)
Buffer Read (Opcode: D4H or D6H)
CS
SCK
1
2
3
4
5
37
38
39
40
41
42
43
44
tSU
COMMAND OPCODE
SI
1
1
1
0
0
X
X
X
X
X
tV
DATA OUT
HIGH-IMPEDANCE
SO
D7
MSB
D6
D5
D4
Status Register Read (Opcode: D7H)
CS
SCK
1
2
3
4
5
6
7
8
9
10
11
12
17
18
tSU
COMMAND OPCODE
SI
1
1
0
1
0
1
1
1
tV
SO
HIGH-IMPEDANCE
STATUS REGISTER OUTPUT
D7
MSB
D6
D5
D4
D0
LSB
D7
MSB
D6
25
2225E–DFLSH–11/02
Figure 1. Algorithm for Sequentially Programming or Reprogramming the Entire Array
START
provide address
and data
BUFFER WRITE
(84H, 87H)
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
END
Notes:
26
1. This type of algorithm is used for applications in which the entire array is programmed sequentially, filling the array page-bypage.
2. A page can be written using either a Main Memory Page Program operation or a Buffer Write operation followed by a Buffer
to Main Memory Page Program operation.
3. The algorithm above shows the programming of a single page. The algorithm will be repeated sequentially for each page
within the entire array.
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Figure 2. Algorithm for Randomly Modifying Data
START
provide address of
page to modify
MAIN MEMORY PAGE
TO BUFFER TRANSFER
(53H, 55H)
If planning to modify multiple
bytes currently stored within
a page of the Flash array
BUFFER WRITE
(84H, 87H)
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
(2)
AUTO PAGE REWRITE
(58H, 59H)
INCREMENT PAGE
(2)
ADDRESS POINTER
END
Notes:
1. To preserve data integrity, each page of a DataFlash sector must be updated/rewritten at least once within every 10,000
cumulative page erase/program operations.
2. A Page Address Pointer must be maintained to indicate which page is to be rewritten. The Auto Page Rewrite command
must use the address specified by the Page Address Pointer.
3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 10,000
cumulative page erase/program operations have accumulated before rewriting all pages of the sector. See application note
AN-4 (“Using Atmel’s Serial DataFlash”) for more details.
Sector Addressing
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2 - PA0
Sector
0
0
0
0
0
0
0
0
0
X
0
0
0
0
0
X
X
X
X
X
X
1
0
0
0
1
X
X
X
X
X
X
2
0
0
1
X
X
X
X
X
X
X
3
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1
0
0
X
X
X
X
X
X
X
6
1
0
1
X
X
X
X
X
X
X
7
1
1
0
X
X
X
X
X
X
X
8
1
1
1
X
X
X
X
X
X
X
9
27
2225E–DFLSH–11/02
Ordering Information
ICC (mA)
fSCK
(MHz)
Active
Standby
20
10
20
15
Ordering Code
Package
Operation Range
0.01
AT45DB081B-CC
AT45DB081B-CNC
AT45DB081B-RC
AT45DB081B-TC
14C1
8CN2
28R
28T
Commercial
(0°C to 70°C)
10
0.01
AT45DB081B-CI
AT45DB081B-CNI
AT45DB081B-RI
AT45DB081B-TI
14C1
8CN2
28R
28T
Industrial
(-40°C to 85°C)
10
0.01
AT45DB081B-CC-2.5
AT45DB081B-CNC-2.5
AT45DB081B-RC-2.5
AT45DB081B-TC-2.5
14C1
8CN2
28R
28T
Commercial
(0°C to 70°C)
2.5V to 3.6V
Package Type
14C1
14-ball (3 x 5 Array), Plastic Chip-scale Ball Grid Array (CBGA)
8CN2
8-pad (6 mm x 8 mm ) Chip Array Small Outline No Lead Package (CASON)
28R
28-lead, 0.330" Wide, Plastic Gull Wing Small Outline Package (SOIC)
28T
28-lead, Plastic Thin Small Outline Package (TSOP)
28
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
Packaging Information
14C1 – CBGA
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
4.60(0.181)
4.40(0.173)
A1 ID
7.10(0.280)
6.90(0.272)
SIDE VIEW
TOP VIEW
0.30 (0.012)MIN
1.40 (0.055) MAX
2.0 (0.079)
1.50 (0.059) REF
1.25 (0.049) REF
3
2
1
A
B
1.00 (0.0394) BSC
NON-ACCUMULATIVE
4.0 (0.157)
C
D
E
0.46 (0.018)
DIA BALL TYP
1.00 (0.0394) BSC
NON-ACCUMULATIVE
BOTTOM VIEW
04/11/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
14C1, 14-ball (3 x 5 Array), 4.5 x 7 x 1.4 mm Body, 1.0 mm Ball
Pitch Chip-scale Ball Grid Array Package (CBGA)
DRAWING NO.
14C1
REV.
A
29
2225E–DFLSH–11/02
8CN2 – CASON
Marked Pin1 Indentifier
E
A
A1
D
Top View
Side View
Pin1 Pad Corner
L1
0.10 mm
TYP
8
1
e
7
2
6
3
COMMON DIMENSIONS
(Unit of Measure = mm)
b
5
4
e1
L
Bottom View
Notes:
1.
2.
3.
4.
All dimensions and tolerance conform to ASME Y 14.5M, 1994.
The surface finish of the package shall be EDM Charmille #24-27.
o
Unless otherwise specified tolerance: Decimal ±0.05, Angular ±2 .
Metal Pad Dimensions.
SYMBOL
MIN
NOM
MAX
A
0.62
0.71
0.80
A1
0.17
0.21
0.25
b
0.41 TYP
4
D
7.90
8.00
8.10
E
6.90
6.00
6.10
e
1.27 BSC
e1
1.095 REF
L
0.67 TYP
L1
0.92
0.97
NOTE
4
1.02
4
10/21/02
R
30
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8CN2, 8-pad (6 x 8 x 0.8 mm Body), Lead Pitch 1.27 mm,
Chip Array Small Outline No Lead Package (CASON)
DRAWING NO.
8CN2
REV.
A
AT45DB081B
2225E–DFLSH–11/02
AT45DB081B
28R – SOIC
B
E
E1
PIN 1
e
D
A
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
NOM
A
2.39
–
2.79
A1
0.002
–
0.014
D
18.00
–
18.50
E
11.70
–
12.50
E1
8.59
–
8.79
SYMBOL
0º ~ 8º
C
L
Note: 1. Dimensions D and E1 do not include mold Flash
or protrusion. Mold Flash or protrusion shall not exceed
0.25 mm (0.010").
MAX
B
0.356
–
0.508
C
0.203
–
0.305
L
0.94
–
1.27
e
NOTE
Note 1
Note 1
1.27 TYP
10/08/2002
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28R, 28-lead, 0.330" Body Width,
Plastic Gull Wing Small Outline (SOIC)
DRAWING NO.
REV.
28R
B
31
2225E–DFLSH–11/02
28T – TSOP
PIN 1
0º ~ 5º
c
Pin 1 Identifier
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.90
1.00
1.05
D
13.20
13.40
13.60
D1
11.70
11.80
11.90
Note 2
E
7.90
8.00
8.10
Note 2
L
0.50
0.60
0.70
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-183.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
L1
NOTE
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
0.55 BASIC
10/18/01
R
32
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
28T
B
AT45DB081B
2225E–DFLSH–11/02
Atmel Headquarters
Atmel Operations
Corporate Headquarters
Memory
2325 Orchard Parkway
San Jose, CA 95131
USA
TEL 1(408) 441-0311
FAX 1(408) 487-2600
2325 Orchard Parkway
San Jose, CA 95131
TEL 1(408) 441-0311
FAX 1(408) 436-4314
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
TEL (49) 71-31-67-0
FAX (49) 71-31-67-2340
Microcontrollers
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
TEL (41) 26-426-5555
FAX (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
TEL (852) 2721-9778
FAX (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
TEL (81) 3-3523-3551
FAX (81) 3-3523-7581
2325 Orchard Parkway
San Jose, CA 95131
TEL 1(408) 441-0311
FAX 1(408) 436-4314
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
TEL (33) 2-40-18-18-18
FAX (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TEL 1(719) 576-3300
FAX 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
TEL (33) 4-76-58-30-00
FAX (33) 4-76-58-34-80
Zone Industrielle
13106 Rousset Cedex, France
TEL (33) 4-42-53-60-00
FAX (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TEL 1(719) 576-3300
FAX 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
TEL (44) 1355-803-000
FAX (44) 1355-242-743
e-mail
[email protected]
Web Site
http://www.atmel.com
© Atmel Corporation 2002.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical
components in life support devices or systems.
Atmel ® and DataFlash ® are the registered trademarks of Atmel.
Other terms and product names may be the trademarks of others
Printed on recycled paper.
2225E–DFLSH–11/02
/xM