MX27C1000/1001 1M-BIT [128K x 8] CMOS EPROM FEATURES • • • • • • • Operating current: 30mA • Standby current: 100uA • Package type: 128K x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 45/55/70/90/100/120/150 ns Totally static operation Completely TTL compatible - 32 pin plastic DIP 32 pin SOP 32 pin PLCC 32 pin TSOP GENERAL DESCRIPTION MX27C1000/1001 supports an intelligent fast programming algorithm which can result in programming time of less than thirty seconds. The MX27C1000/1001 is a 5V only, 1M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 128K words by 8 bits per word, operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC , 32 lead SOP , and 32 lead TSOP packages. PIN CONFIGURATIONS PDIP/SOP MX27C1000 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VCC PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VPP OE A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27C1001 PDIP/SOP(MX27C1001) VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM NC A14 A13 A8 A9 A11 A16 A10 CE Q7 Q6 Q5 Q4 Q3 1 32 NC VCC A16 VPP 5 A15 A12 A7 4 PGM TSOP(MX27C1000) PLCC 30 29 A14 A6 A13 A5 A8 A9 A4 A3 9 MX27C1000 25 A11 A2 OE A1 A10 CE A0 21 20 Q5 Q4 Q3 GND Q2 17 Q7 Q6 13 14 Q1 Q0 A11 A9 A8 A13 A14 NC PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27C1000 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 REV. 5.5,FEB. 25, 2000 MX27C1000/1001 BLOCK DIAGRAM CE PGM CONTROL LOGIC OE . . A0~A16 ADDRESS INPUTS Y-DECODER . . OUTPUT BUFFERS . Q0~Q17 X-DECODER . . . . SYMBOL PIN NAME A0~A16 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin Y-SELECT . . . . . . VCC GND PIN DESCRIPTION 1M BIT CELL MAXTRIX . VPP FUNCTIONAL DESCRIPTION THE PROGRAMMING OF THE MX27C1000/1001 PROGRAM INHIBIT MODE When the MX27C1000/1001 is delivered, or it is erased, the chip has all 1M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C1000 through the procedure of programming. Programming of multiple MX27C1000/1001s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C1000/1001 may be common. A TTL low-level program pulse applied to an MX27C1000/1001 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27C1000/1001. A high-level CE input inhibits the other MX27C1000/1001s from being programmed. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 01.uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at VIL, PGM at VIH, and VPP at its programming voltage. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C1000/ 1001. REV. 5.5, FEB. 25, 2000 2 MX27C1000/1001 To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C1000/1001, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (DQ7) defined as the parity bit. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. READ MODE The MX27C1000/1001 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. STANDBY MODE The MX27C1000/1001 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C1000/1001 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 3 MX27C1000/1001 MODE SELECT TABLE PINS MODE CE OE PGM A0 A9 VPP OUTPUTS Read VIL VIL X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2H Device Code(27C1000)(3) VIL VIL X VIH VH VCC 0EH Device Code(27C1001)(3) VIL VIL X VIH VH VCC 0FH 3. A1 - A8 = A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 4 MX27C1000/1001 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 5 MX27C1000/1001 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance(30pF for 45/55/70 ns parts) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70. P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 6 MX27C1000/1001 ABSOLUTE MAXIMUM RATINGS NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C1000/1001 -45* -55 -70 -90 0°C to 70°C Temperature Industrial -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 5V ± 5% 5V ± 10% 0°C to 70°C -15 Commercial 0°C to 70°C 5V ± 5% 0°C to 70°C -12 Operating Vcc Power Supply 0°C to 70°C -10 5V ±10% 5V ± 10% 0°C to 70°C 5V ± 10% 0°C to 70°C 5V ± 10% *Note:45ns for MX27C1000 only DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V Vpp VPP Capacitance 18 25 pF VPP = 0V P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 7 MX27C1000/1001 AC CHARACTERISTICS SYMBOL PARAMETER 27C1000 27C1000/1001 27C1000/1001 -45 -55 -70 MAX. UNIT CONDITIONS tACC Address to Output Delay 45 55 70 ns CE = OE = VIL tCE Chip Enable to Output Delay 45 55 70 ns OE = VIL tOE Output Enable to Output Delay 25 30 35 ns CE = VIL 20 ns tDF OE High to Output Float, MIN. 0 MAX. 17 MIN. 0 MAX. 20 MIN. 0 or CE High to Output Float tOH Output Hold from Address, 0 0 0 ns CE or OE which ever occurred first 27C1000/1001 27C1000/1001 -90 SYMBOL PARAMETER MIN. 27C1000/1001 27C1000/1001 -10 MAX. MIN. -12 MAX. MIN. MAX. -15 MIN. MAX. UNIT CONDITIONS tACC Address to Output Delay 90 100 120 150 ns CE = OE = VIL tCE Chip Enable to Output Delay 90 100 120 150 ns OE = VIL tOE Output Enable to Output Delay 65 ns CE = VIL tDF OE High to Output Float, 50 ns 40 0 25 45 0 30 50 0 35 0 or CE High to Output Float tOH Output Hold from Address, 0 0 0 0 ns CE or OE which ever occurred first DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VIN = 0 to 5.5V CE = PGM = VIL, OE = VIH VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 8 MX27C1000/1001 AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC SYMBOL PARAMETER MIN. MAX. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2.0 us tOE Data valid from OE 130 UNIT CONDITIONS ns us 105 150 us ns WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer tOH REV. 5.5, FEB. 25, 2000 9 MX27C1000/1001 FAST PROGRAMMING ALGORITHM WAVEFORMS PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tOES tPW tOE Max VIH OE VIL P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 10 MX27C1000/1001 PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY CURRENT MAX.(mA) MX27C1000PC-45 CURRENT MAX.(uA) OPERATING PACKAGE TEMPERATURE 45 30 100 0°C to 70°C 32 PIN DIP MX27C1000MC-45 45 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-45 45 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-45 45 30 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-55 55 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-55 55 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-55 55 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-55 30 100 0°C to 70°C 32 Pin TSOP 55 MX27C1001MC-55 55 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-55 55 30 100 0°C to 70°C 32 Pin DIP MX27C1000PC-70 70 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-70 70 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-70 70 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-70 30 100 0°C to 70°C 32 Pin TSOP 70 MX27C1001MC-70 70 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-70 70 30 100 0°C to 70°C 32 Pin DIP MX27C1000PC-90 90 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-90 90 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-90 90 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-90 90 30 100 0°C to 70°C 32 Pin TSOP MX27C1001MC-90 90 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-90 90 30 100 0°C to 70°C 32 Pin DIP MX27C1000PC-10 100 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-10 100 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-10 100 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-10 100 30 100 0°C to 70°C 32 Pin TSOP MX27C1001MC-10 100 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-10 100 30 100 0°C to 70°C 32 Pin DIP MX27C1000PC-12 120 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-12 120 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-12 120 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-12 30 100 0°C to 70°C 32 Pin TSOP 120 MX27C1001MC-12 120 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-12 120 30 100 0°C to 70°C 32 Pin DIP MX27C1000PC-15 150 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-15 150 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-15 150 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-15 30 100 0°C to 70°C 32 Pin TSOP 150 MX27C1001MC-15 150 30 100 0°C to 70°C 32 Pin SOP MX27C1001PC-15 30 100 0°C to 70°C 32 Pin DIP 150 P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 11 MX27C1000/1001 ORDER INFORMATION(CONTINUED) PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY CURRENT MAX.(mA) CURRENT MAX.(uA) OPERATING PACKAG TEMPERATURE MX27C1000PI-55 55 30 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-55 55 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-55 55 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-55 55 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-70 70 30 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-70 70 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-70 70 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-70 70 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-90 90 30 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-90 90 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-90 90 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-90 90 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-12 120 30 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-12 120 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-12 120 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-12 120 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-15 150 30 100 -40°C to 85°C 32 Pin SOP MX27C1000MI-12 120 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-15 150 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-15 150 30 100 -40°C to 85°C 32 Pin TSOP P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 12 MX27C1000/1001 PACKAGE INFORMATION 32-PIN PLASTIC DIP(600 mil) ITEM MILLIMETERS INCHES A 42.13 max. 1.660 max. B 1.90 [REF] .075 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .018 [Typ.] E 38.07 1.500 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± .25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± .25 .155 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .010 L 13.97 ± .25 .550 ± .010 .25 [Typ.] .010 [Typ.] M NOTE: 32 17 1 16 A K L F D Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. C I J H G 0~15¡ M B E 32-PIN PLASTIC SOP (450 mil) ITEM MILLIMETERS A 20.95 max. .825 max. B 1.00 [REF] .039 [REF] C 1.27 [TP] .050 [TP] D .40 [Typ.] .016 [Typ.] E .05 min. .002 min. F 3.05 max. .120 max. G 2.69 ± .13 .106 ± .005 H 14.12 ± .25 .556 ± .010 I 11.30 ± .13 .445 ± .005 J 1.42 .056 K .20 [Typ.] .008 [Typ.] L .79 .031 NOTE: INCHES Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer 32 17 1 16 H A I G J F K E D C B L REV. 5.5, FEB. 25, 2000 13 MX27C1000/1001 PACKAGE INFORMATION(Continued) 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) A ITEM MILLIMETERS A 12.44 ± .13 .490 ± .005 B 11.50 ± .13 .453 ± .005 C 14.04 ± .13 .553 ± .005 D 14.98 ± .13 .590 ± .005 E 1.93 .076 F 3.30 ± .25 .130 ± .010 G 2.03 ± .13 .080 ± .005 H .51 ± .13 .020 ± .005 I 1.27 [Typ.] .050 [Typ.] J .71[REF] .028[REF] K L .46 [REF] 10.40/12.94 (W) (L) .018 [REF] .410/.510 (W) (L) M .89 R .035 R N .25 (TYP.) .010 (TYP.) NOTE: B 1 INCHES 4 32 30 5 29 9 25 13 C D 21 14 20 17 E F G Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. N H M I J K L 32-PIN PLASTIC TSOP ITEM MILLIMETERS INCHES A 20.0 ± .20 .078 ± .006 A B 18.40 ± .10 .724 ± .004 B C 8.20 max. .323 max. D 0.15 [Typ.] .006 [Typ.] E .80 [Typ.] .031 [Typ.] F .20 ± .10 .008 ± .004 G .30 ± .10 .012 ± .004 H .50 [Typ.] .020 [Typ.] I .45 max. .018 max. J 0 ~ .20 0 ~ .008 K 1.00 ± .10 .039 ± .004 L 1.27 max. .050 max. M .50 .020 N 19.00 .748 O 0~5 .500 NOTE: C O N M K L D E F G H I J Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at a maximum material condition. P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer REV. 5.5, FEB. 25, 2000 14 MX27C1000/1001 Revision History Revision No. Description 5.0 1) Reduce operating current change from 40mA to 30mA. 2) Eliminate Interactive Programming Mode. 3) Add 27C1001 pin configuration. 5.1 IPP 100uA --> 10uA 5.2 Change TSOP Orientation 5.3 27C1000CDIP 70/90/100/120/150ns speed grades deleted from ordering information. 5.4 Add 55ns speed grade parts for industrial grade 5.5 Cancel 32pin ceramic DIP Package P/N: PM0234 This Material Copyrighted by Its Respective Manufacturer Page Date 5/28/1997 8/08/1997 4/09/1998 5/07/1998 P6,7,13 5/10/1999 P1,2,11,13,14 FEB/25/2000 REV. 5.5, FEB. 25, 2000 15 MX27C1000/1001 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-509-3300 FAX:+886-2-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 16 This Material Copyrighted by Its Respective Manufacturer