SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE PACKAGE DIMENSIONS 0.118 (3.0) 0.102 (2.6) HER YELLOW GREEN AlGaAs RED 0.083 (2.1) 0.067 (1.7) 0.091 (2.3) 0.083 (2.1) .041 (0.1) 0.035 (0.9) 0.028 (0.7) QTLP670C-2 QTLP670C-3 QTLP670C-4 QTLP670C-7,9 FEATURES • Non-diffused package excellent for 0.134 (3.4) 0.118 (3.0) 0.094 (2.4) back-lighting and coupling to light pipe • Low package profile 0.043 (1.1) 0.020 (0.5) • Low power dissipation 0.024 (0.6) 0.016 (0.4) • Wide viewing angle of 120° 0.007 (.18) 0.005 (.12) CATHODE ANODE FOR QTLP670C-7 DESCRIPTION This surface mount lamp is designed with a flat top and sides for automatic placement equipment. It is compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment process. The package size and configuration conform to EIA-535 BAAC standard specification for case size 3528 tantalum capacitor. NOTE: 1. Dimensions for all drawings are in inches (mm). 2. QTLP670C-7 corner notch denotes anode. 3. QTLP670C-2,3,4,9 corner notch denotes cathode. ABSOLUTE MAXIMUM RATINGS Parameter Continuous Forward Current - IF Peak Forward Current - IF (f = 1.0 KHz, Duty Factor = 1/10) Reverse Voltage - VR (IR = 10 µA) Power Dissipation - PD (TA = 25°C unless otherwise specified) HER Yellow Green AlGaAs Red QTLP670C-2 QTLP670C-3 QTLP670C-4 QTLP670C-7,9 30 20 30 30 mA 160 160 160 160 mA Units 5 5 5 5 V 100 85 100 100 mW Operating Temperature - TOPR -40 to +100 °C Storage Temperature - TSTG -40 to +100 °C Wave 260 for 5 sec °C Reflow 260 for 10 sec Lead Soldering Time - TSOL ELECTRICAL / OPTICAL CHARACTERISTICS Part Number Luminous Intensity (mcd) Minimum Typical Forward Voltage (V) Maximum Typical Peak Wavelength (nm) Spectral Line Half Width (nm) Viewing Angle (°) 1 of 4 (TA =25°C) HER QTLP670C-2 Yellow QTLP670C-3 Green QTLP670C-4 AlGaAs Red QTLP670C-7,9 6 10 6 10 15 25 25 40 2.8 2.0 635 45 120 2.8 2.0 585 35 120 2.8 2.1 565 30 120 2.4 1.9 660 20 120 Condition IF = 20mA IF = 20mA 3/14/00 IF = 20mA IF = 20mA IF = 20mA 300044A SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE HER YELLOW GREEN AlGaAs RED QTLP670C-2 QTLP670C-3 QTLP670C-4 QTLP670C-7,9 TYPICAL PERFORMANCE CURVES 2.5 90 IF - FORWARD CURRENT (mA) RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 20 mA) AlGaAs RED 80 70 HER 60 50 YELLOW 40 30 20 10 2.0 HER YELLOW GREEN 1.5 1.0 AlGaAs RED 0.5 GREEN 0.0 0 1.0 2.0 3.0 4.0 5.0 0 5 10 15 20 25 30 IF - DC FORWARD CURRENT (mA) VF - FORWARD VOLTAGE (V) Fig. 2 Relative Luminous Intensity vs. DC Forward Current Fig. 1 Forward Current vs. Forward Voltage RELATIVE INTENSITY 1.0 GREEN YELLOW -30˚ AlGaAs RED -20˚ -10˚ 0˚ 10˚ 20˚ 30˚ -40˚ 40˚ -50˚ 0.5 50˚ -60˚ 60˚ -70˚ 70˚ -80˚ 0 HER 500 550 600 650 700 750 -90˚ 1.0 80˚ 0.8 0.6 0.4 0.2 0 0.2 0.4 0.6 WAVELENGTH (nm) REL. LUMINOUS INTENSITY (%) Fig. 3 Relative Intensity vs. Peak Wavelength Fig.4 Radiation Diagram 0.8 1.0 90˚ IF - FORWARD CURRENT (mA) 50 40 HER, GREEN, AlGaAs RED 30 YELLOW 20 10 0 0 20 40 60 85 100 TA - AMBIENT TEMPERATURE (˚C) Fig. 5 Current Derating Curve 2 of 4 3/14/00 300044A SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE HER YELLOW GREEN AlGaAs RED QTLP670C-2 QTLP670C-3 QTLP670C-4 QTLP670C-7,9 RECOMMENDED PRINTED CIRCUIT BOARD PATTERN INFRARED VAPOR PHASE REFLOW SOLDERING COMPONENT LOCATION ON PAD 0.175 (4.45) 0.095 (2.41) 0.065 (1.65) 2X COMPONENT LOCATION ON PAD 0.175 (4.45) 0.095 (2.41) 0.065 (1.65) 2X 0.64 (.025) SQ. CENTERED HOLE RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 240° C MAX +5° C/s MAX -5° C/s MAX 60 - 120 sec Preheating 120 - 150° C MAX 3 of 4 3/14/00 300044A SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 4 of 4 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. © 2000 Fairchild Semiconductor Corporation 3/14/00 300044A