ETC HSMA-L640

Surface Mount Lensed
High Performance Chip LEDs
Technical Data
SunPower Series
HSMA-L640
HSMC-L640
HSML-L640
Features
Description
• High Brightness AlInGaP
Material
• Three Colors Available
• Compatible with IR Solder
Process
• Narrow Viewing Angle
• Small 3.0 x 1.5 mm Package
• Available in 8 mm Tape on
7” (180 mm) Diameter
Reels
The HSMx-L640 is a Chip LED
with an integrated lens. The lens
concentrates the emitted light
into a narrow viewing angle,
which has the effect of doubling
the on-axis intensity. These
LEDs are optimum for light
piping, backlighting buttons and
switches, and applications, where
as much flux as possible is
required on axis.
Applications
These LEDs utilize aluminum
indium gallium phosphide
(AlInGaP) material technology.
The AlInGaP material has a very
high luminous efficiency, capable
of producing high light output
over a wide range of drive
currents.
•
•
•
•
Keypad Backlighting
Light Piping
LCD Backlighting
Front Panel Indicator
The available colors are 590 nm
Amber, 605 nm Orange, and 626
nm Red.
The 3.0 x 1.5 mm package
closely matches industry standard
sizes for chip capacitors which
makes it compatible with
automated pick and place
equipment.
This package is compatible with
IR and convective reflow
soldering processes.
Device Selection Guide
Amber 590 nm
HSMA-L640
Orange 605 nm
HSML-L640
Red 626 nm
HSMC-L640
2
Package Dimensions
1.5
1.5
1.3
0.6
3
2
CATHODE
MARK
1.8
1.6
TOLERANCES: ± 0.2 mm
Notes:
1. Dimensions are in millimeters.
2. Tolerance, ± 0.2 mm
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current[3][4][5]
Power Dissipation
Reverse Current VR = 5 V
Operating Temperature Range
Storage Temperature Range[6]
Value
30
Units
mA
81
100
-30 to +85
-40 to +100
mW
µA
°C
°C
Notes:
3. Derate linearly as shown in Figure 4.
4. Drive currents between 1 mA and 30 mA are recommended for best long term performance.
5. Operating at currents below 1 mA is not recommended. Please contact your Agilent
representative for further information.
6. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at TA = 25°C
Part
Number
HSMA-L640
HSML-L640
HSMC-L640
Color
Amber
Orange
Red
Luminous
Intensity
IV (mcd)
@IF 20 mA[7]
Min.
Typ.
63
130
63
130
63
100
Peak
Wavelength
λpeak (nm)
Typ.
592
609
635
Color,
Dominant
Wavelength
λd[8] (nm)
Typ.
590
605
626
Viewing
Angle
2θ 1/2
Degrees[9]
Typ.
70
70
70
Notes:
7. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern.
8. The dominant wavelength, λd, is derived from the CIE Chromaticity diagram, and represents the perceived color of the device.
9. θ 1/2 is the off-axis angle where the luminous intensity is 1/ 2 the peak intensity.
3
Electrical Characteristics at TA = 25°C
Part
Number
HSMA-L640
HSML-L640
HSMC-L640
Forward
Voltage
VF (Volts)
@ I F = 20 mA
Typ.
Max.
2.02
2.4
1.98
2.4
1.90
2.4
Color
Amber
Orange
Red
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
5
Capacitance
C (pF)
VF = 0
f = 1 MHz
Typ.
40
40
40
Thermal
Resistance
RθJ-PIN (°C/W)
500
500
500
1.0
ORANGE
RELATIVE INTENSITY
AMBER
RED
0.5
0
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 5 mA)
IF – FORWARD CURRENT – mA
5
100
50
20
10
5
2
1
0.5
4
3
2
1
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VF – FORWARD VOLTAGE – V
Figure 2. Forward Current vs. Forward Voltage.
0
5
10
15
20
25
IF – FORWARD CURRENT – mA
Figure 3. Relative Luminous Intensity vs. DC Forward
Current.
4
IF – FORWARD CURRENT – mA
35
30
25
20
15
10
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum DC Current vs. Ambient Temperature.
Light Intensity (Iv) Bin Limits[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
Intensity
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
(mcd)
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity
Min.
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
(mcd)
Max.
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Tolerance: ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.
5
Color Bin Limits[1]
Yellow/Amber Color Bins[1]
Bin ID
A
B
C
D
E
F
Tolerance: ± 0.5 nm
Dom. Wavelength (nm)
Min.
Max.
582.0
584.5
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
594.5
597.0
Orange Color Bins[1]
Bin ID
A
B
C
D
E
F
Dom. Wavelength (nm)
Min.
Max.
597.0
600.0
600.0
603.0
603.0
606.0
606.0
609.0
609.0
612.0
612.0
615.0
Tolerance: ± 1 nm
Note:
1. Bin categories are established for classification or products. Products may not be available in all bin categories. Pleae contact your
Agilent representative for information of currently available bins.
6
20°
10°
0°
1.0
30°
RELATIVE INTENSITY
0.8
40°
50°
0.6
60°
0.4
70°
0.2
80°
90°
1.0
0.8
0.6
0.4
0.2
0 10 20 30 40 50 60 70 80 90 100
RELATIVE INTENSITY
DEGREES
Figure 5. Intensity vs. Angle.
1.6
4.4
1.6
10 SEC. MAX.
TEMPERATURE
240°C MAX.
4°C/SEC. MAX.
140-160°C
4°C/SEC. MAX.
PWB
CAMBER
DIRECTION
OVER 2 MIN.
TIME
TOLERANCES: ± 0.2 mm
Figure 6. Recommended SMT Reflow Soldering Profile.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling Orientation.
Figure 7. Recommended Solder Patterns.
7
2 ± 0.5
Ø 21 ± 0.8
+1
Ø 60 – 0
Ø 13.0 ± 0.2
11.4 ± 1.0
+0
Ø 180 – 3
9 ± 0.3
Figure 9. Reel Dimensions.
1.7 ± 0.1
4 ± 0.1
∅ 1.5 +0.1
0
CATHODE
0.2 ± 0.05
1.75 ± 0.1
3.5 ± 0.05
3.35 ± 0.1
8 ± 0.3
CENTER HOLE
1.8
USER DIRECTION
OF FEED
2 ± 0.05
4 ± 0.1
Figure 10. Tape Dimensions.
END
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
Figure 11. Tape Leader and Trailer Dimensions.
150 mm-360 mm
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(408) 654-8675
Europe: +49 (0) 6441 92460
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Hong Kong: (+65) 6271 2451
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Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-6272EN
July 19, 2002
5988-7315EN