a 0.1 mF, +5 V Powered CMOS RS-232 Drivers/Receivers ADM205–ADM211/ADM213 TYPICAL OPERATING CIRCUIT FEATURES 0.1 mF to 10 mF Capacitors 120 kB/s Data Rate 2 Receivers Active in Shutdown (ADM213) On-Board DC-DC Converters 69 V Output Swing with +5 V Supply Low Power (15 mW) Low Power Shutdown ≤5 mW 630 V Receiver Input Levels Latch-Up FREE Plug-In Upgrade for MAX205-211/213 +5V INPUT TTL/CMOS INPUTS* APPLICATIONS Computers Peripherals Modems Printers Instruments TTL/CMOS OUTPUTS 12 C1+ 0.1µF 16V 14 C1– 0.1µF 16V 16 C2– 15 C2+ T1 IN 7 T2 IN 6 T3 IN 20 T4 IN 21 R1 OUT 8 R2 OUT 5 R3 OUT 26 R4 OUT 22 R5 OUT 19 EN 24 +5V TO +10V VOLTAGE DOUBLER V CC 11 +10V TO –10V VOLTAGE INVERTER V– 17 V+ 13 T1 T2 T3 T4 R1 R2 R3 R4 R5 GND ADM211 0.1µF 6.3V 0.1µF 0.1µF 16V 2 T1 OUT 3 T2 OUT 1 T3 OUT 28 T4 OUT 9 R1 IN 4 R2 IN 27 R3 IN 23 R4 IN 18 R5 IN 25 SD RS-232 OUTPUTS RS-232 INPUTS** 10 *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT GENERAL DESCRIPTION The ADM2xx family of line drivers/receivers is intended for all EIA-232-E and V.28 communications interfaces, especially in applications where ± 12 V is not available. The ADM205, ADM206, ADM211 and ADM213 feature a low power shutdown mode which reduces power dissipation to less than 5 µW making them ideally suited for battery powered equipment. The ADM205 does not require any external components and is particularly useful in applications where printed circuit board space is critical. The ADM213 has an active-low shutdown and an active-high receiver enable control. Two receivers of the ADM213 remain active during shutdown. This feature is useful for ring indicator monitoring. All members of the ADM2xx family, except the ADM209, include two internal charge pump voltage converters which allow operation from a single +5 V supply. These converters convert the +5 V input power to the ± 10 V required for RS-232 output levels. The ADM209 is designed to operate from +5 V and +12 V supplies. An internal +12 V to –12 V charge pump voltage converter generates the –12 V supply. Table I. Selection Table Part Number Power Supply Voltage No. of RS-232 Drivers No. of RS-232 Receivers External Capacitors Low Power Shutdown (SD) TTL Three-State EN No. of Receivers Active in Shutdown ADM205 ADM206 ADM207 ADM208 ADM209 ADM211 ADM213 +5 V +5 V +5 V +5 V +5 V & +9 V to +13.2 V +5 V +5 V 5 4 5 4 3 4 4 5 3 3 4 5 5 5 None 4 4 4 2 4 4 Yes Yes No No No Yes Yes (SD) Yes Yes No No Yes Yes Yes (EN) 0 0 0 0 0 0 2 REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. © Analog Devices, Inc., 1994 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703 (VCC = +5 V 6 10% (206, 207, 208, 2O9, 211, 213); VCC = +5 V 6 5% (ADM205); V+ = +9 V to +13.2 V (ADM209); C1–C4 = 0.1 mF Ceramic. All Specifications TMIN to TMAX unless otherwise noted.) ADM205–ADM211/ADM213–SPECIFICATIONS Parameter Min Typ Output Voltage Swing ±5 ±9 VCC Power Supply Current V+ Power Supply Current Shutdown Supply Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Logic Pull-Up Current RS-232 Input Voltage Range RS-232 Input Threshold Low RS-232 Input Threshold High RS-232 Input Hysteresis RS-232 Input Resistance TTL/CMOS Output Voltage Low, VOL TTL/CMOS Output Voltage High, VOH TTL/CMOS Output Leakage Current Output Enable Time (TEN) 3 5 0.4 3.5 1 Max 7 9 1 5 5 0.8 10 0.2 3 1.2 1.7 0.5 5 3.5 0.05 115 25 +30 2.4 1.0 7 0.4 ±5 Output Disable Time (TDIS) 165 Propagation Delay Instantaneous Slew Ratel Transition Region Slew Rate 0.5 25 6 5 30 ± 12 ± 60 Output Resistance RS-232 Output Short Circuit Current 3 300 Test Conditions/Comments Volts All Transmitter Outputs Loaded with 3 kΩ to Ground No Load, ADM206, ADM211, ADM213 No Load, ADM205, ADM207, ADM208 No Load, ADM209 No Load, V+ = 12 V ADM209 Only mA mA mA mA µA V V µA V V V V kΩ V V µA ns 2.0 –30 0.8 Units ns µs V/µs V/µs Ω mA TIN, EN, SD, EN, SD TIN, EN, SD, EN, SD TIN = 0 V IOUT = 1.6 mA IOUT = –1.0 mA EN = VCC, EN = 0 V, 0 V ≤ ROUT ≤ VCC ADM205, ADM206, ADM209, ADM211 (Figure 25. CL = 150 pF) ADM205, ADM206, ADM209, ADM211 (Figure 25. RL = 1 kΩ) RS-232 to TTL CL = 10 pF, RL = 3-7 kΩ, TA = +25°C RL = 3 kΩ, CL = 2500 pF Measured from +3 V to –3 V or –3 V to +3 V VCC = V+ = V– = 0 V, VOUT = ± 2 V NOTE 1 Sample tested to ensure compliance. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC – 0.3 V) to +14 V V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V–, –0.3 V) ROUT . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Power Dissipation N-24 DIP (Derate 13.5 mW/°C above +70°C) . . . 1000 mW N-24A DIP (Derate 13.5 mW/°C above +70°C) . . 500 mW R-24 SOIC (Derate 12 mW/°C above +70°C) . . . . . 850 mW R-28 SOIC (Derate 12.5 mW/°C above +70°C) . . 900 mW RS-28 SSOP (Derate 10 mW/°C above +70°C) . . . . 900 mW Q-24 Cerdip (Derate 12.5 mW/°C above +70°C) . 1000 mW D-24 Ceramic (Derate 20 mW/°C above +70°C) . . 1000 mW Thermal Impedance, θJA N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C/W R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . . -40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . . +300°C Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 2000 V *This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. –2– REV. 0 ADM205–ADM211/ADM213 ORDERING GUIDE Model Temperature Range Package Option* ADM205 ADM205AN –40°C to +85°C N-24A ADM208 ADM208AN –40°C to +85°C ADM208AR –40°C to +85°C ADM208ARS –40°C to +85°C N-24 R-24 RS-24 ADM213 ADM213AR –40°C to +85°C ADM213ARS –40°C to +85°C R-28 RS-28 Model Temperature Range Package Option* Model ADM206 ADM206AN –40°C to +85°C ADM206AR –40°C to +85°C ADM206ARS –40°C to +85°C N-24 R-24 RS-24 ADM209 ADM209AN –40°C to +85°C ADM209AR –40°C to +85°C ADM209ARS –40°C to +85°C N-24 R-24 RS-24 Temperature Range Package Option* ADM207 ADM207AN –40°C to +85°C ADM207AR –40°C to +85°C ADM207ARS –40°C to +85°C N-24 R-24 RS-24 ADM211 ADM211AR –40°C to +85°C ADM211ARS –40°C to +85°C R-28 RS-28 *N = Plastic DIP; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP). +5V INPUT T4OUT 1 24 R3 IN T3OUT 2 23 R3 OUT T1OUT 3 22 T5 IN T2OUT 4 21 SD R2 IN 5 20 EN R2 OUT 6 ADM205 19 T5 OUT T2IN 7 Top View (Not to Scale) 18 R4 IN T1IN 8 17 R4 OUT R1 OUT 9 16 T4 IN R1 IN 10 15 T3 IN GND 11 14 R5 OUT 12 13 R5 IN VCC 0.1µF 12 VCC TTL/CMOS INPUTS * TTL/CMOS OUTPUTS Figure 1. ADM205 DIP Pin Configuration T1 IN 8 T1 3 T1OUT T2 IN 7 T2 4 T2OUT T3 IN 15 T3 2 T3OUT T4 IN 16 T4 1 T4OUT T5 IN 22 T5 19 T5OUT R1 OUT 9 R1 10 R1 IN R2 OUT 6 R2 5 R2 IN R3 OUT 23 R3 24 R3 IN R4 OUT 17 R4 18 R4 IN R5 OUT 14 R5 13 R5 IN EN 20 21 SD GND ADM205 RS-232 OUTPUTS RS-232 INPUTS ** 11 * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 2. ADM205 Typical Operating Circuit REV. 0 –3– ADM205–ADM211/ADM213 24 T3OUT 1 23 R2 IN T1OUT 2 23 R2IN T2OUT 3 22 R2 OUT 21 T5IN T3OUT 1 24 T1OUT 2 T4OUT T4OUT T2OUT 3 22 R2 OUT R1 IN 4 21 SD R1 IN 4 R1 OUT 5 20 EN R1 OUT 5 20 T5 OUT T2IN 6 ADM206 T2IN 6 ADM207 19 T4IN 7 Top View (Not to Scale) 7 Top View (Not to Scale) 18 T3IN T1IN 19 T4IN 18 T3IN T1IN GND 8 17 R3 OUT GND 8 17 R3 OUT VCC 9 16 R3IN VCC 9 16 R3IN C1+ C1+ 10 15 V– 10 15 V– V+ 11 14 C2– V+ 11 14 C2– C1– 12 13 C2+ C1– 12 13 C2+ Figure 3. ADM206 DIP/SOIC/SSOP Pin Configuration Figure 5. ADM207 DIP/SOIC/SSOP Pin Configuration +5V INPUT +5V INPUT 0.1µF 6.3V 0.1µF 16V TTL/CMOS INPUTS * TTL/CMOS OUTPUTS 10 C1+ 12 C1– 13 C2+ 14 C2– +5V TO +10V VOLTAGE DOUBLER VCC 9 +10V TO –10V VOLTAGE INVERTER V+ 11 V– 15 0.1µF 6.3V 0.1µF 16V 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 18 T3 1 T3OUT T4IN 19 T4 24 T4OUT R1 OUT 5 R1 4 R1 IN R2 OUT 22 R2 23 R2 IN R3 OUT 17 R3 16 R3 IN EN 20 21 SD ADM206 0.1µF 0.1µF 16V T1IN GND 0.1µF 6.3V TTL/CMOS INPUTS * RS-232 OUTPUTS RS-232 INPUTS ** TTL/CMOS OUTPUTS 10 C1+ +5V TO +10V VOLTAGE DOUBLER 12 C1– 13 C2+ 14 C2– +10V TO –10V VOLTAGE INVERTER V+ 11 V– 15 0.1µF 6.3V 0.1µF 0.1µF 16V T1IN 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 18 T3 1 T3OUT T4IN 19 T4 24 T4OUT T5IN 21 T5 20 T5OUT R1 OUT 5 R1 4 R1 IN R2 OUT 22 R2 23 R2 IN R3 OUT 17 R3 16 R3 IN GND 8 VCC 9 RS-232 OUTPUTS RS-232 INPUTS ** ADM207 8 * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 4. ADM206 Typical Operating Circuit Figure 6. ADM207 Typical Operating Circuit –4– REV. 0 ADM205–ADM211/ADM213 24 T2OUT 1 T3OUT T1OUT 2 23 R3IN R2 IN 3 22 R3 OUT R2OUT 4 21 T4IN T1IN 5 20 R1 OUT 6 ADM208 19 Top View (Not to Scale) 24 R1 OUT 1 R1 IN 2 23 T2IN GND 3 22 R2OUT VCC 4 21 R2 IN T4 OUT V+ 5 20 T2OUT T3IN C+ 6 ADM209 19 T1OUT 7 Top View (Not to Scale) 18 R3 IN R1 IN 7 18 T2IN GND 8 17 R4 OUT VCC 9 16 R4IN C1+ C– T1IN V– 8 17 R3OUT R5 IN 9 16 T3IN 10 15 V– R5 OUT 10 15 NC V+ 11 14 C2– R4 OUT 11 14 EN C1– 12 13 C2+ R4 IN 12 13 T3OUT NC = NO CONNECT Figure 7. ADM208 DIP/SOIC/SSOP Pin Configuration Figure 9. ADM209 DIP/SOIC/SSOP Pin Configuration +5V INPUT +5V INPUT 0.1µF 0.1µF 6.3V 0.1µF 16V TTL/CMOS INPUTS * +5V TO +10V VOLTAGE DOUBLER 12 C1– 13 C2+ 14 C2– VCC 9 +10V TO –10V VOLTAGE INVERTER V+ 11 V– 15 T2IN 18 T2 1 T2OUT T3IN 19 T3 24 T3OUT T4IN 21 T4 20 T4OUT 7 R1 IN R2 OUT R1 6 4 R2 3 0.1µF 0.1µF 16V T1OUT TTL/CMOS INPUTS * RS-232 OUTPUTS TTL/CMOS OUTPUTS 22 R3 23 R3 IN R4 OUT 17 R3 16 R4 IN ADM208 C1– VCC 4 V+ +9V TO +13.2V INPUT 5 V– 8 T1IN 24 T1 19 T1OUT T2IN 23 T2 20 T2OUT T3IN 16 T3 13 T3OUT R1 OUT 1 R1 2 R1 IN R2 OUT 22 R2 21 R2 IN R3 OUT 17 R3 18 R3 IN R4 OUT 11 R4 12 R4 IN R5 OUT 10 R5 9 R5 IN EN 14 15 NC RS-232 OUTPUTS RS-232 INPUTS ** GND ADM209 3 * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 10. ADM209 Typical Operating Circuit Figure 8. ADM208 Typical Operating Circuit REV. 0 7 +12V TO –12V VOLTAGE INVERTER R2 IN R3 OUT 8 C1+ 0.1µF 16V RS-232 INPUTS ** GND 6 0.1µF 16V 5 T1 2 0.1µF 6.3V T1IN R1 OUT TTL/CMOS OUTPUTS 10 C1+ –5– ADM205–ADM211/ADM213 T3OUT 1 T1OUT 2 27 R3IN T2OUT 3 26 R3 OUT R2 IN 4 25 SD R2 OUT 5 24 EN T2IN 6 T1IN 7 ADM211 R1 OUT 8 Top View (Not to Scale) R1 IN 9 28 23 VCC 21 T3OUT 1 28 T1OUT 2 27 R3 IN T2OUT 3 26 R3 OUT R2 IN 4 25 SD R2 OUT 5 24 EN T2IN 6 23 R4 IN * T1IN 7 ADM213 R1 OUT 8 Top View (Not to Scale) R1 IN 9 R4IN 22 R4 OUT 20 GND 10 T4OUT T4IN T3IN GND 10 19 R5 OUT 11 VCC 18 R5IN C1+ 12 17 V– V+ 13 16 C2– C1– 14 15 T4OUT 22 R4 OUT * 21 T4IN 20 T3IN 19 R5 OUT * 11 18 R5 IN * C1+ 12 17 V– V+ 13 16 C2– C1– 14 15 C2+ C2+ * ACTIVE IN SHUTDOWN Figure 11. ADM211 SOIC/SSOP Pin Configuration Figure 13. ADM213 SOIC/SSOP Pin Configuration +5V INPUT +5V INPUT 0.1µF 16V 0.1µF 16V TTL/CMOS INPUTS * TTL/CMOS OUTPUTS 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER VCC 11 +10V TO –10V VOLTAGE INVERTER V– 17 V+ 13 0.1µF 6.3V 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 20 T3 1 T3OUT T4IN 21 T4 28 T4OUT R1 OUT 8 R1 9 R1 IN R2 OUT 5 R2 4 R2 IN R3 OUT 26 R3 27 R3 IN R4 OUT 22 R4 23 R4 IN R5 OUT 19 R5 18 R5 IN EN 24 25 SD ADM211 0.1µF 0.1µF 16V 0.1µF 16V T1IN GND 0.1µF 16V TTL/CMOS INPUTS * RS-232 OUTPUTS TTL/CMOS OUTPUTS RS-232 INPUTS ** 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER VCC 11 +10V TO –10V VOLTAGE INVERTER V– 17 V+ 13 0.1µF 6.3V 0.1µF 0.1µF 16V T1IN 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 20 T3 1 T3OUT T4IN 21 T4 28 T4OUT R1 OUT 8 R1 9 R1 IN R2 OUT 5 R2 4 R2 IN R3 OUT 26 R3 27 R3 IN R4 OUT *** 22 R4 23 R4 IN *** RS-232 INPUTS ** R5 OUT *** 19 R5 18 R5 IN *** EN 24 25 SD GND ADM213 RS-232 OUTPUTS 10 10 *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT ** INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT *** ACTIVE IN SHUTDOWN Figure 12. ADM211 Typical Operating Circuit Figure 14. ADM213 Typical Operating Circuit –6– REV. 0 ADM205–ADM211/ADM213 PIN FUNCTION DESCRIPTION Mnemonic Function VCC Power Supply Input 5 V ± 10% (+5 V ± 5% ADM205). V+ Internally generated positive supply (+10 V nominal) on all parts except ADM209. ADM209 requires external 9 V to 13.2 V supply. V– Internally generated negative supply (–10 V nominal). GND Ground pin. Must be connected to 0 V. C+ (ADM209 only) External capacitor (+ terminal) is connected to this pin. C– (ADM209 only) External capacitor (– terminal) is connected to this pin. C1+ (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin. C1– (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (– terminal) is connected to this pin. C2+ (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin. C2– (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (– terminal) is connected to this pin. TIN Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to Vcc is connected on each input. TOUT Transmitter (Driver) Outputs. These are RS-232 levels (typically ± 10 V). RIN Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input. ROUT Receiver Outputs. These are TTL/CMOS levels. EN/EN Enable Input. Active low on ADM205, ADM206, ADM209, ADM211. Active high on ADM213. This input is used to enable/disable the receiver outputs. With EN = Low (EN = High ADM213), the receiver outputs are enabled. With EN =High (EN = low ADM213), the outputs are placed in a high impedance state. This facility is useful for connecting to microprocessor systems. SD/SD Shutdown Input. Active high on ADM205, ADM206, ADM211. Active low on ADM213. With SD = high on the ADM205, ADM206, ADM211, the charge pump is disabled, the receiver outputs are placed in a high impedance state and the driver outputs are turned off. With SD low on the ADM213, the charge pump is disabled, the driver outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power consumption reduces to 5 µW. NC No Connect. No connections are required to this pin. Table II. ADM205, ADM206, ADM211 Truth Table SD EN Status Transmitters T1–T5 Receivers R1–R5 0 0 1 0 1 0 Normal Operation Normal Operation Shutdown Enabled Enabled Disabled Enabled Disabled Disabled Table III. ADM213 Truth Table REV. 0 SD EN Status Transmitters T1-T4 Receivers R1-R3 Receivers R4, R5 0 0 1 1 0 1 0 1 Shutdown Shutdown Normal Operation Normal Operation Disabled Disabled Enabled Enabled Disabled Disabled Disabled Enabled Disabled Enabled Disabled Enabled –7– ADM205–ADM211/ADM213–Typical Performance Characteristics 10 10 V+ VOUT (1 O/P LOADED) | V– | VOUT – V VOUT — Volts 8 6 8 4 VOUT (ALL O/Ps LOADED) 6 2 0 4 0 10 20 IOUT — mA 30 40 3.0 4.0 Figure 15. Charge Pump V+, V– vs. Current Figure 17. Transmitter Output Voltage vs. VCC 18 12 16 10 T OUT HIGH 14 8 12 TOUT – V SLEW RATE – V/µs 5.0 VCC – V 10 6 T OUT LOW 4 8 2 6 4 0 0 500 1000 1500 CAPACITIVE LOAD – pF 2000 2500 0 Figure 16. Transmitter Slew Rate vs. Load Capacitance 2 4 IOUT – mA 6 8 Figure 18. Transmitter Output Voltage vs. Current 300 V+, V– IMPEDANCE – Ω V– (UNLOADED) 200 V– (LOADED) V+ (UNLOADED) 100 V+ (LOADED) 0 3 4 VCC – V 5 Figure 19. Charge Pump Impedance vs. VCC –8– REV. 0 ADM205–ADM211/ADM213 A3 The ADM205, ADM206, ADM211, and ADM213 are particularly useful in battery powered systems as they feature a low power shutdown mode which reduces power dissipation to less than 5 µW. 0.8 V 100 90 The ADM205 is designed for applications where space saving is important as the charge pump capacitors are molded into the package. The ADM209 includes only a negative charge pump converter and are intended for applications where a positive 12 V is available. 10 0% 5V 5V B Lw 5 1Ms H O To facilitate sharing a common line or for connection to a microprocessor data bus the ADM205, ADM206, ADM209, ADM211 and ADM213 feature an enable (EN) function. When disabled, the receiver outputs are placed in a high impedance state. Figure 20. Charge Pump, V+, V– Exiting Shutdown A3 0.8 V 100 CIRCUIT DESCRIPTION 90 The internal circuitry in the ADM205-ADM211 and ADM213 consists of three main sections. These are: (a) A charge pump voltage converter (b) RS-232 to TTL/CMOS receivers (c) TTL/CMOS to RS-232 transmitters 10 0% B Lw 5V 5 5µs Charge Pump DC-DC Voltage Converter H O The charge pump voltage converter consists of an oscillator and a switching matrix. The converter generates a ± 10 V supply from the input 5 V level. This is done in two stages using a switched capacitor technique as illustrated in Figures 23 and 24. First, the 5 V input supply is doubled to 10 V using capacitor C1 as the charge storage element. The 10 V level is then inverted to generate –10 V using C2 as the storage element. Figure 21. Transmitter Output Loaded Slew Rate A3 0.8 V 100 90 S1 S3 VCC V+ = 2V CC C1 10 S2 0% S4 GND 5V B Lw 5 1µs VCC H O INTERNAL OSCILLATOR Figure 22. Transmitter Output Unloaded Slew Rate Figure 23. Charge-Pump Voltage Doubler GENERAL INFORMATION The ADM205-ADM211 and ADM213 family of RS-232 drivers/receivers are designed to solve interface problems by meeting the EIA-232-E specifications while using a single digital +5 V supply. The EIA-232-E standard requires transmitters which will deliver ± 5 V minimum on the transmission channel and receivers which can accept signal levels down to ± 3 V. The ADM205-ADM211 and ADM213 meet these requirements by integrating step up voltage converters and level shifting transmitters and receivers onto the same chip. CMOS technology is used to keep the power dissipation to an absolute minimum. A comprehensive range of transmitter/receiver combinations is available to cover most communications needs. The ADM205– ADM211 and ADM213 are modifications, enhancements and improvements to the AD230–AD241 family and derivatives thereof. They are essentially plug-in compatible and do not have materially different applications. REV. 0 C3 S1 S3 V+ FROM VOLTAGE DOUBLER GND C2 S2 C4 S4 GND V– = – (V+) INTERNAL OSCILLATOR Figure 24. Charge-Pump Voltage Inverter Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be reduced if higher levels of ripple are acceptable. The charge pump capacitors C1 and C2 may also be reduced at the expense of higher output impedance on the V+ and V– supplies. The V+ and V– supplies may also be used to power external circuitry if the current requirements are small. –9– ADM205–ADM211/ADM213 Transmitter (Driver) Section Enable Input The drivers convert TTL/CMOS input levels into EIA-232-E output levels. With VCC = +5 V and driving a typical EIA-232-E load, the output voltage swing is ± 9 V. Even under worst case conditions the drivers are guaranteed to meet the ± 5 V EIA-232-E minimum requirement. The ADM205, ADM209, ADM211, and ADM213 feature an enable input used to enable or disable the receiver outputs. The enable input is active low on the ADM205, ADM209, ADM211 and active-high on the ADM213. Refer to Tables II and III. When disabled, all receiver outputs are placed in a high impedance state. This function allows the outputs to be connected directly to a microprocessor data bus. It can also be used to allow receivers from different devices to share a common data line. The timing diagram for the enable function is shown in Figure 25. The input threshold levels are both TTL and CMOS compatible with the switching threshold set at VCC/4. With a nominal VCC = 5 V the switching threshold is 1.25 V typical. Unused inputs may be left unconnected, as an internal 400 kΩ pull-up resistor pulls them high forcing the outputs into a low state. As required by the EIA-232-E standard, the slew rate is limited to less than 30 V/µs without the need for an external slew limiting capacitor and the output impedance in the power-off state is greater than 300 Ω. 3V EN* 0V TEN Receiver Section The receivers are inverting level shifters which accept EIA-232-E input levels (± 5 V to ± 15 V) and translate them into 5 V TTL/ CMOS levels. The inputs have internal 5 kΩ pull-down resistors to ground and are also protected against overvoltages of up to ± 30 V. The guaranteed switching thresholds are 0.8 V minimum and 2.4 V maximum which are well within the ± 3 V EIA-232-E requirement. The low level threshold is deliberately positive as it ensures that an unconnected input will be interpreted as a low level. The receivers have Schmitt trigger inputs with a hysteresis level of 0.5 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times. Shutdown (SD) The ADM205, ADM206, ADM211 and ADM213 feature a control input which may be used to disable the part and reduce the power consumption to less than 5 µW. This is very useful in battery operated systems. During shutdown the charge pump is turned off, the transmitters are disabled and all receivers except R4 and R5 on the ADM213 are put into a high-impedance disabled state. Receivers R4 and R5 on the ADM213 remain enabled during shutdown. This feature allows monitoring external activity such as ring indicator monitoring while the device is in a low power shutdown mode. The shutdown control input is active high on all parts except the ADM213 where it is active low. Refer to Tables II and III. TDIS 3.5V VOH – 0.1V 0.8V VVOL + 0.1V ROUT * POLARITY OF EN IS REVERSED FOR ADM213 Figure 25. Enable Timing APPLICATION HINTS Driving Long Cables In accordance with the EIA-232-E standard, long cables are permissible provided that the total load capacitance does not exceed 2500 pF. For longer cables which do exceed this, then it is possible to trade off baud rate vs. cable length. Large load capacitances cause a reduction in slew rate, and hence the maximum transmission baud rate is decreased. The ADM205–ADM211 and ADM213 are designed so that the slew rate reduction with increasing load capacitance is minimized. For the receivers, it is important that a high level of noise immunity be inbuilt so that slow rise and fall times do not cause multiple output transitions as the signal passes slowly through the transition region. The ADM205–ADM211 and ADM213 have 0.5 V of hysteresis to guard against this. This ensures that, even in noisy environments, error-free reception can be achieved. High Baud Rate Operation The ADM205–ADM211 and ADM213 feature high slew rates permitting data transmission at rates well in excess of the EIA-232-E specification. The drivers maintain ± 5 V signal levels at data rates up to 120-kB/s under worst-case loading conditions. –10– REV. 0 ADM205–ADM211/ADM213 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 24-Lead Cerdip (Q-24) 24-Lead Plastic DIP (N-24) 12 1 24 13 1 12 PIN 1 13 24 PIN 1 0.295 (7.493) MAX 0.260 ± 0.001 (6.61 ± 0.03) 0.320 (8.128) 0.290 (7.366) 1.290 (32.77) MAX 0.130 (3.30) 0.128 (3.25) 0.11 (2.79) 0.09 (2.28) SEATING PLANE 0.125 (3.175) MIN SEATING PLANE 0.02 (0.5) 0.016 (0.41) 0.180 (4.572) MAX 0.225 (5.715) MAX 0.32 (8.128) 0.30 (7.62) 1.228 (31.19) 1.226 (31.14) 15 ° 0 0.07 (1.78) 0.05 (1.27) 0.021 (0.533) 0.015 (0.381) TYP 0.011 (0.28) 0.009 (0.23) 0.110 (2.794) 0.090 (2.286) TYP 0.070 (1.778) 0.020 (0.508) 15 ° 0° 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 24-Lead Plastic DIP (N-24A) 28-Lead SOIC (R-28) 13 24 24 0.55 (13.97) 0.53 (13.47) PIN 1 13 0.299 (7.6) 0.291 (7.39) 12 1 1.25 (31.75) 1.24 (31.5) 0.606 (15.4) 0.594 (15.09) 0.2 (5.08) MAX PIN 1 12 1 0.414 (10.52) 0.398 (10.10) 0.16 (4.07) 0.14 (3.56) 0.175 (4.45) 0.12 (3.05) 0.02 (0.508) 0.015 (0.381) 0.065 (1.651) 0.055 (1.397) TYP 0.105 (2.67) 0.095 (2.42) 0.065 (1.66) 0.045 (1.15) SEATING PLANE 15 ° 0° 0.096 (2.44) 0.089 (2.26) 0.608 (15.45) 0.596 (15.13) 0.012 (0.305) 0.008 (0.203) 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 0.03 (0.76) 0.02 (0.51) 6° 0° 0.042 (1.067) 0.018 (0.447) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS 28-Lead SSOP (RS-28) 24 13 0.212 (5.38) 0.205 (5.207) 0.311 (7.9) 0.301 (7.64) PIN 1 12 1 0.328 (8.33) 0.318 (8.08) 0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 0.07 (1.78) 0.066 (1.67) 0.009 (0.229) 0.005 (0.127) 8° 0° 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS REV. 0 –11– 0.037 (0.94) 0.022 (0.559) 0.012 (0.305) 0.008 (0.203) TYP ADM205–ADM211/ADM213 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 28 15 28 15 0.299 (7.6) 0.291 (7.39) PIN 1 14 1 0.212 (5.38) 0.205 (5.207) 0.414 (10.52) 0.398 (10.10) 0.311 (7.9) 0.301 (7.64) PIN 1 1 0.096 (2.44) 0.089 (2.26) 0.708 (18.02) 0.696 (17.67) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 0.03 (0.76) 0.02 (0.51) 6° 0° 14 0.407 (10.34) 0.397 (10.08) 0.07 (1.78) 0.066 (1.67) 0.042 (1.067) 0.018 (0.457) 0.008 (0.203) 0.002 (0.050) 1. LEAD NO. IDENTIFIED BY A DOT. 2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 0.0256 (0.65) BSC 0.009 (0.229) 0.005 (0.127) 8° 0° 0.037 (0.94) 0.022 (0.559) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS PRINTED IN U.S.A. 0.01 (0.254) 0.006 (0.15) C1897–18–4/94 28-Lead SSOP (RS-28) 28-Lead SOIC (R-28) –12– REV. 0