Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Standard P/N 621A 621K 623A 623K Low-Profile Heat Sinks for All Metal-Case Power Semiconductors Footprint Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2) 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) (1) TO-3 None (1) TO-3 None A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) MECHANICAL DIMENSIONS TO-3 Thermal Performance at Typical Load Natural Forced Convection Convection 75°C @ 15W 75°C @ 15W 52°C @ 15W 52°C @ 15W Weight lbs. (grams) 2.0°C/W @ 250 LFM 2.0°C/W @ 250 LFM 1.5°C/W @ 250 LFM 1.5°C/W @ 250 LFM 0.1000 (45.36) 0.1000 (45.36) 0.2100 (95.26) 0.210O (95.26) in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the standard TO-3 package. Material: Aluminum Alloy, Black Anodized. 621 AND 623 SERIES (EXTRUSION PROFILE 1327) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) 301/302/303 SERIES Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases Standard P/N Outline Dimensions in. (mm) Length “A” in. (mm) Mounting Hole (s) Pattern and Number 301K 301M 301N 302M 302MM 302N 302NN G 303M 303MM 303N G 303NN 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) 0.750 (19.1) 0.750 (19.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) None (1) 10-32UNF, 0.625 in. thread depth (1) 1⁄4 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 1⁄ 4 -28UNF, 0.625 in. thread depth (2) 1⁄ 4 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 1⁄4 -28UNF, 0.625 in. thread depth (2) 1⁄4 -28UNF, 0.625 in. thread depth The large fin area in minimum total volume provided by the radial design of the 301/302/303 Series offers maximum heat transfer efficiency in natural convection. All types are available with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the STUD-MOUNT Thermal Performance at Typical Load Natural Forced Convection Convection 70°C @ 15W 70° C @ 15W 70° C @ 15W 50° C @ 15W 50°C @ 15W 5O°C @ 15W 50°C @ 15W 37° C @ 15W 37° C @ 15W 37° C @ 15W 37° C @ 15W Weight lbs. (grams) 2.5° C/W @ 250 LFM 2.5° C/W @ 250 LFM 2.5° C/W @ 250 LFM 1.8° C/W @ 250 LFM 1.8°C/W @ 250 LFM 1.8° C/W @ 250 LFM 1.8°C/W @ 250 LFM 1.3° C/W @ 250 LFM 1.3° C/W @ 250 LFM 1.3° C/W @ 250 LFM 1.3° C/W @ 250 LFM 0.0580 (26.31) 0.0580 (26.31) 0.0580 (26.31) 0.1330 (60.33) 0.1330 (6033) 0.1330 (60.33) 0.1330 (60.33) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56) 302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and “NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black Anodized. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS SEMICONDUCTOR MOUNTING HOLES K M N 302 AND 303 SERIES Dimensions: in. (mm) 301 SERIES 641 SERIES SERIES 301 302 303 Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors Standard P/N Outline Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 641A G 641K G 4.125 (104.8) x 3.000 (76.2) 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) 1.000 (25.4) (1) TO-3 None Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of MECHANICAL DIMENSIONS TO-3 Thermal Performance at Typical Load Natural Forced Convection Convection 36°C @ 15W 36°C @ 15W Weight lbs. (grams) 0.9°C/W @ 250 LFM 0.9°C/W @ 250 LFM 0.2900 (131.54) 0.2900 (131.54) 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Material: Aluminum Alloy, Black Anodized. 641 SERIES (EXTRUSION PROFILE 1371) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 50 G Normally stocked Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles TO-3; Stud-Mount Standard P/N Width in. (mm) Overall Dimensions in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattem 401A G 401F 401K G 403A G 403F G 403K G 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style “F” offers a single centered Thermal Performance at Typical Load Natural Convection Forced Convection 80°C @ 30W 80°C @ 30W 80°C @ 30W 55°C @ 30W 55°C @ 30W 55°C @ 30W 1.5° C/W @ 250 LFM 1.5° C/W @ 250 LFM 1.5° C/W @ 250 LFM 0.9° C/W @ 250 LFM 0.9° C/W @ 250 LFM 0.9° C/W @ 250 LFM Weight lbs. (grams) 0.1500 (68.04) 0.1500 (68.04) 0.1500 (68.04) 0.3500 (158.76) 0.3500 (158.76 0.3500 (158.76) 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 401 SERIES 403 SERIES Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES A V K F 401 AND 403 SERIES (EXTRUSION PROFILE 1024) 413/421/423 SERIES Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes Standard P/N Width in. (mm) Nominal Dimensions Length in. (mm) Height “A” in. (mm) 413A 413F 413K G 421A 421F 421K G 423A 423K G 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 5.500 (140.2) 5.500 (140.2) 1.875 (47.6) 1.875 (47.6) 1.875 (47.6) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) TO-3; DO-5; Stud-Mount Semiconductor Thermal Performance at Typical Load Mounting Hole Pattern Natural Convection Forced Convection (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 None Space-saving double surface 413, 421, and 423 Series utilize finned surface area on both sides of the power semiconductor mounting surface to provide maximum heat dissipation in a compact profile. Ready to install on popular power components in natural and forced convection applications. Apply 72° C @ 50W 72° C @ 50W 72° C @ 50W 58° C @ 50W 58° C @ 50W 58° C @ 50W 47° C @ 50W 47° C @ 50W 0.85° C/W @ 250 LFM 0.85° C/W @ 250 LFM 0.85° C/W @ 250 LFM 0.7° C/W @ 250 LFM 0.7° C/W @ 250 LFM 0.7° C/W @ 250 LFM 0.5° C/W @ 250 LFM 0.5° C/W @ 250 LFM Weight lbs. (grams) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 1.1700 (530.71) 1.1700 (530.71) Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad™ interface materials for maximum performance. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 423 SERIES (EXTRUSION PROFILE 1025) 413 SERIES (EXTRUSION PROFILE 2276 421 SERIES (EXTRUSION PROFILE 1025) SEMICONDUCTOR MOUNTING HOLES A F K V SERIES 413 421 Dimensions: in. (mm) G Normally stocked 51 All other products, please contact factory for price, delivery, and minimums. Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 431 AND 433 SERIES High-Performance Heat Sinks for 30-100W Metal Power Semiconductors Nominal Dimensions Standard Width Length “A” Height Semiconductor Thermal Performance at Typical Load P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection 431K 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) None 55°C @ 5OW 0.40°C/W @ 250 LFM 433K G 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) None 42°C @ 5OW 0.28°C/W @ 250 LFM Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum space? The Wakefield 431 and 433 Series center channel double-surface heat sinks offer the highest performance-to-weight ratio for minimum volume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to TO-3; Stud-Mount Weight lbs. (grams) 0.7800 (353.81) 1.4900 (675.86) 100-watt operating range. Additional interface resistance reduction for maximized overall performance can be achieved with proper application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SERIES 431 433 SEMICONDUCTOR MOUNTING HOLE 431 AND 433 SERIES (EXTRUSION PROFILE 2726) K Dimensions: in. (mm) 435 SERIES Standard P/N 435AAAA Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.250(108.0) 5.500(139.7) 4.300(109.2) This lightweight high-performance heat sink is designed to mount and cool efficiently one to four TO-3 style metal case power semiconductors. The Type 435AAAA is the standard configuration available from stock, predrilled for mounting four TO-3 style devices. Increased performance can be achieved with TO-3 Semiconductor Thermal Performance at Typical Load Weight Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) (4) TO-3 37°C @ 50W 0.38°C/W @ 250 LFM 1.1500 (521.64) 54°C @ 80W 0.24°C/W @ 600 LFM the proper selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface material for each power semiconductor or, for maximum reduction of case-to-sink interface loss, the application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS Dimensions: in. (mm) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES AAAA 435 SERIES (EXTRUSION PROFILE 4226) 441 SERIES Standard P/N 441K G High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) Semiconductor Mounting Hole Pattern None Designed for vertical mounting within a power supply enclosure or equipment cabinet without forced airflow available. This Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a maximum 55°C heat sink temperature rise above ambient. When applied in a forced Dimensions: in. (mm) Thermal Performance at Typical Load Natural Convection Forced Convection 34°C @ SOW 0.30°C/W @ 250 LFM 47°C @ 80W 0.19°C/W @ 600 LFM Stud-Mount Weight lbs. (grams) 1.9700 (893.59) convection environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS SEMICONDUCTOR MOUNTING HOLE NATURAL AND FORCED CONVECTION CHARACTERISTICS K 441 SERIES (EXTRUSION PROFILE 1273) All other products, please contact factory for price, delivery, and minimums. 52 G Normally stocked Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 465 AND 476 SERIES Standard P/N 465K 476K 476W High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes Width in. (mm) Nominal Dimensions Length in. (mm) Height in. (mm) Hex Style Type Mounting Hole Pattern 4.000 (101.6) 5.000 (127.0) 5.000 (127.0) 5.000 (127.0) 6.000 (152.4) 6.000 (152.4) 4.000 (101.6) 5.000 (127.0) 5.000 (127.0) 1.060 in. Hex 1.250 in. Hex 1.250 in. Hex None None 0.765 in. (19.4)Dia. Center Mount Wakefield Engineering has designed four standard heat sink types for ease of installation and efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are Stud-Mount Thermal Performance at Typical Load Natural Convection Forced Convection 38°C @ 5OW 25°C @ 5OW 25°C @ 5OW 0.27°C/W @500 LFM 0.19°C/W @500 LFM 0.19°C/W @500 LFM Weight lbs. (grams) 1.9300 (875.45) 2.8200(1279.15) 2.8000(1270.08) designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized. MECHANICAL DIMENSIONS 465 SERIES (EXTRUSION PROFILE 1244) NATURAL AND FORCED CONVECTION CHARACTERISTICS 476 SERIES (EXTRUSION PROFILE 1245) W K SEMICONDUCTOR MOUNTING HOLES Dimensions: in. (mm) 486 AND 489 SERIES Heat Sinks for High-Power Hex-Type Rectifiers and Diodes Standard P/N Width in. (mm) Nominal Dimensions Length in. (mm) 486K G 6.250 (158.8) 6.000 (152.4) 6.250 (158.8) 1.750 in. Hex None 489K G 6.250 (158.8) 9.000 (228.6) 6.250 (158.8) 1.750 in. Hex None Height in. (mm) Hex Style Type Mounting Hole Pattern These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000 Stud-Mount Thermal Performance at Typical Load Natural Convection Forced Convection 24° C @ 50W 86° C @ 250W 19° C @ 50W 75° C @ 250W 0.20° C/W @250 LFM 0.13° C/W @500 LFM 0.15° C/W @250 LFM 0.10° C/W @500 LFM Weight lbs. (grams) 4.2100 (1909.66) 6.1400 (2785.10) in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS SEMICONDUCTOR MOUNTING HOLE K NATURAL AND FORCED CONVECTION CHARACTERISTICS 486 AND 489 SERIES (EXTRUSION PROFILE 1541) SERIES Dimensions: in. (mm) G Normally stocked 486 489 53 All other products, please contact factory for price, delivery, and minimums. Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 490 SERIES Standard P/N 490-35K 490-6K G 490-12K G King Size Heat Sinks for High-Power Rectifiers GENERAL PURPOSE Width in. (mm) Nominal Dimensions Length “A” in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattern 9.250 (235.0) 9.250 (235.0) 9.250 (235.0) 3.500 (88.9) 6.000 (152.4) 12.000 (304.8) 6.750 (171.5) 6.750 (171.5) 6.750 (171.5) None None None The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller power devices. The semiconductor device mounting surface is free of anodize on the entire surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see accessories section) for mounting to enclosure wall and for electrical isolation. The Thermal Performance at Typical Load Natural Convection Forced Convection 84° C @ 20OW 60° C @ 20OW 45° C @ 20OW 0.18° C/W @ 600 LFM 0.13° C/W @ 600 LFM 0.09° C/W @ 600 LFM Weight lbs. (grams) 3.2400(1469.66) 5.4700(2481.19) 10.62 (4817.23) anodize-free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLE 490 SERIES (EXTRUSION PROFILE 2131) Dimensions: in. (mm) PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S 394, 395, 396 SERIES Standard P/N Overall Dimensions: in. (mm) Length Height in. (mm) in. (mm) Width in. (mm) Device Base Mounting Area (mm) 394-1AB 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 394-2AB 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 395-1AB 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 395-2AB 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 396-1AB 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 396-2AB 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 Note: 1.Thermal resistance values shown are for black anodized finish at 50°C rise above ambient. MECHANICAL DIMENSIONS Base Mounting Holes 4 6 4 6 4 6 Thermal Resistance at Typical Load Natural Forced Convection (Øsa)(1) Convection (Øsa) (°C/W) (°C/W @ 500 LFM) 1.85 1.51 1.10 0.90 1.85 1.51 0.90 0.60 0.50 0.32 1.07 0.64 NATURAL AND FORCED CONVECTION CHARACTERISTICS 394 SERIES (EXTRUSION PROFILE 7332) NATURAL AND FORCED CONVECTION CHARACTERISTICS 395 SERIES (EXTRUSION PROFILE 7330) NATURAL AND FORCED CONVECTION CHARACTERISTICS 396 SERIES (EXTRUSION PROFILE 7331) Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 54 G Normally stocked Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS SERIES 517, 527, 518 AND 528 Standard P/N Heat Sinks for “Half Brick” DC/DC Converters Footprint Dimensions in. (mm) 517-95AB 2.28 (57.9) x 2.40 (61.0) 527-45AB 2.28 (57.9) x 2.40 (61.0) 527-24AB 2.28 (57.9) x 2.40 (61.0) 518-95AB 2.40 (61.0) x 2.28 (57.9) 528-45AB 2.40 (61.0) x 2.28 (57.9) 528-24AB 2.40 (61.0) x 2.28 (57.9) Material: Aluminum, Black Anodized. Height in. (mm) Fin Orientation Number of Fins 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) Horizontal Horizontal Horizontal Vertical Vertical Vertical 8 11 11 8 11 11 Keep your "half brick" size AT&T and Computer Products power modules cool with these efficient black anodized aluminum heat sinks made for natural or forced convection applications. To include four M3 x 8mm Phillips head SEM attachment screws, add an “M” suffix to stan- MECHANICAL DIMENSIONS TO-220 and TO-218 Thermal Performance Natural Convection Forced Convection Power Dissipation (Watts) Thermal Resistance 60°C Rise Heat Sink to Ambient at 300 ft/min 11W 7W 5W 11W 7W 5W 2.0 °C/W 3.2 °C/W 5.8 °C/W 2.0 °C/W 3.2 °C/W 5.8 °C/W dard part number. To specify factory applied Deltalink IV thermal interface material, add an “S4” suffix to standard part number. Deltalink IV is a non-insulating graphite based material used as a clean, thermally efficient alternative to thermal grease. 517, 527, 518 AND 528 SERIES PRODUCT DESIGNATION 517 /527 SERIES DIMENSIONS 518 /528 SERIES DIMENSIONS Dimensions: in. (mm) MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS 100 SERIES Teflon Mounting Insulators Standard P/N ▲ 103 107 Description Spool-shaped insulator Spool-shaped insulator 103 SERIES G Normally stocked For Use with Series 300, 400, 600, 111, 113 300, 400, 600, 111, 113 Mounting Hardware #6-32 screw #6-32 screw, nut Material Hipot Rating (VAC) Teflon Teflon 1500 5000 Weight lbs. (grams) 0.00012 (0.05) 0.0034 (1.54) 107 SERIES 55 All other products, please contact factory for price, delivery, and minimums. Extruded Heat Sinks HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTs, RELAYS Height 510, 511 AND 512 SERIES Standard Catalog P/N (5) Milled Nonmilled Base(1) Base(2) 510-3M 510-6M 510-9M 510-12M G 510-14M G 511-3M 511-6M 511-9M 511-12M 512-3M 512-6M 512-9M 512-12M Base Width in. (mm) 510-3U 510-6U 510-9U 510-12U G 510-14U G 511-3U 511-6U 511-9U 511-12U 512-3U 512-6U 512-9U 512-12U 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88) Notes: 1. Precision-milled base for maximum heat transfer performance (flatness 0.002 in./in.) Length in. (mm) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 14.000 (355.6) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 0.56 0.38 0.29 0.24 0.21 0.90 0.65 0.56 0.45 0.90 0.65 0.56 0.45 0.088 0.070 0.066 0.062 0.059 0.120 0.068 0.060 0.045 0.120 0.068 0.060 0.045 4. Forced convection heat dissipation for distributed heat sources at 100 cubic feet per minute, shrouded condition. 5. Standard models are provided without finish. 510 Series (Extrusion Profile 5113) A B Flatness 510-U 0.216 (5.5) 3.136 (79.7) 0.006 in./in. (0.15 mm/mm) 510-M 0.165 (4.2) 3.106 (78.9) 0.002 in./in. (0.05 mm/mm) 511 AND 512 SERIES Series 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 2.350 (59.7) 2,350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) NATURAL AND FORCED CONVECTION CHARACTERISTICS Series 511 Series (Extrusion Profile 6438-1) 512 Series (Extrusion Profile 6438-2) A B 0.250 (6.4) 2.410 (61.2) 0.372 (9.4) 0.006 in./in. (0.15 mm/mm) 511-M 512-M 0.220 (5.6) 2.350 (59.7 0.342 (8.7) 0.002 in./in. (0.05 mm/mm) 511-U 512-U Nonmilled Base (2) (“U” Series) in. (mm) 2. Nonmilled base flatness: 0.006 in./in. 3. Natural convection heat dissipation for distributed heat sources at 50°C rise. MECHANICAL DIMENSIONS 510 SERIES Milled Base (1) (“M Series”) in. (mm) Thermal Resistance (5) (Øsa) at Typical Load Natural Forced Convection(3) Convection(4) (°C/W) (°C/W @ 100 CFM) C Flatness Dimensions: in. (mm) 392 SERIES HIGH PERFORMANCE HEAT SINKS FOR POWER MODULES, IGBTs AND SOLID STATE RELAYS Standard P/N, Finish Black Gold Anodized Iridite 392-120AB 392-120AG 392-180AB G 392-180AG G 392-300AB G 392-300AG G Length in. (mm) 4.725 (120.0) 7.087 (180.0) 11.811 (300.0) Thermal Resistance at Typical Load Natural Forced Convection (Øsa) Convection (Øsa) (°CW) (°CW) 0.50 0.16 @ 100 CFM 0.43 0.11 @ 100 CFM 0.33 0.08 @ 100 CFM Weight lbs. (grams) 4.452 (2019.43) 6.636 (3010.09) 1O.420 (4726.51) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS NATURAL CONVECTION 392-120 (1 MOD) 392-180 (1 MOD) 392-300 (1 MOD) 392-300 (3 MOD) FORCED CONVECTION 392-120 (1 MOD) 392-120 (3 MOD) 392-180 (1 MOD) 392-180 (3 MOD) 392-300 (3 MOD) 392 SERIES (EXTRUSION PROFILE 5658) Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 56 G Normally stocked