Temperature Measurement SMDs B57621 C 621 Applications ● ● ● ● ● ● Temperature compensation Hybrid circuits Data systems Telecom systems Automotive electronics LC displays Features ● ● ● ● ● ● Small dimensions, EIA size 1206 Silver palladium terminations Cost-effective Suitable for automatic placement Suitable for wave and reflow soldering Available on tape (PU: 4000 pcs) Termination Dimensions in mm Approx. weight 18 mg Options Alternative resistance ratings and resistance tolerance < 5% available on request Climatic category (IEC 68-1) Max. power at 25 °C (on PCB) Resistance tolerance Rated temperature B value tolerance Dissipation factor (on PCB) Thermal cooling time constant (on PCB) Heat capacity Type R25 C 621/2,2 k/+ C 621/3,3 k/+ C 621/4,7 k/+ C 621/10 k/+ C 621/15 k/+ C 621/22 k/+ C 621/33 k/+ C 621/47 k/+ C 621/68 k/+ Ω 2,2 k 3,3 k 4,7 k 10 k 15 k 22 k 33 k 47 k 68 k P25 ∆R/RN TN ∆B/B δth1) τc1) Cth1) No. of R/T characteristic 1308 1309 1309 1010 1008 1008 2003 2001 2001 55/125/21 300 ± 5 %, ± 10 %, ± 20 % 25 ±3% approx. 5 approx. 10 approx. 50 mW °C mW/K s mJ/K B25/100 Ordering code K 3060 3520 3520 3530 3560 3560 3980 3920 3920 B57621-C222-+62 B57621-C332-+62 B57621-C472-+62 B57621-C103-+62 B57621-C153-+62 B57621-C223-+62 B57621-C333-+62 B57621-C473-+62 B57621-C683-+62 +: J for ∆R/RN = ± 5 % K for ∆R/RN = ± 10 % M for ∆R/RN = ± 20 % 1) Depends on mounting situation Siemens Matsushita Components 43 B57621 C 621 Type R25 C 621/100 k/+ C 621/150 k/+ C 621/220 k/+ C 621/330 k/+ C 621/470 k/+ Ω 100 k 150 k 220 k 330 k 470 k No. of R/T characteristic 4901 2903 2903 1014 1014 B25/100 Ordering code K 3950 4200 4200 4250 4250 B57621-C104-+62 B57621-C154-+162 B57621-C224-+62 B57621-C334-+62 B57621-C474-+62 +: J for ∆R/RN = ± 5 % K for ∆R/RN = ± 10 % M for ∆R/RN = ± 20 % Reliability data Tested on standardized PCB in accordance with IEC 60068-2-21 ∆R25/R25 (typical) Test Standard Storage in dry heat IEC 60068-2-2 Storage in damp heat, steady state IEC 60068-2-3 Storage at upper category temperature T: 125 °C t: 1000 h Temperature of air: 40 °C Relative humidity of air: 93 % Duration: 21 days Rapid temperature cycling IEC 60068-2-14 Lower test temperature: – 55 °C Upper test temperature: 125 °C < 3 % Number of cycles: 10 Pmax: 300 mW Duration: 1000 h Endurance Solderability Robustness of terminations Test conditions IEC 60068-2-58 <3% <3% No visible damage <5% Solderability: 215 °C/4 s 235 °C/2 s Resistance to soldering heat: 260 °C/10 s Bending of carrier (2 mm bending) Remarks <3% 95 % of terminations wetted <3% No visible damage Refer also to page 120 44 Siemens Matsushita Components