ETC HFCT

Agilent HFCT-5963xxx Single Mode
Laser Small Form Factor Transceivers
for ATM, SONET OC-3/SDH STM-1
Part of the Agilent METRAK family
Data Sheet
Description
The HFCT-5963xxx are high
performance, cost effective
modules for serial optical data
communications applications
specified for a signal rate of
155 Mb/s. They are designed to
provide SONET/SDH compliant
intermediate and long reach
links at 155 Mb/s.
All modules are designed for
single mode fiber and operate at
a nominal wavelength of 1300
nm. They incorporate high
performance, reliable, long
wavelength optical devices and
proven circuit technology to give
long life and consistent service.
The transmitter section of the
HFCT-5963xxx incorporates a
1300 nm Fabry Perot (FP) laser.
The transmitter has full IEC 825
and CDRH Class 1 eye safety.
The receiver section uses an
MOVPE grown planar PIN
photodetector for low dark
current and excellent
responsivity.
These transceivers are supplied
in the new industry standard 2 x
5 DIP style package with the LC
fiber connector interface and is
footprint compatible with SFF
Multi Source Agreement (MSA).
Features
• HFCT-5963TL/ATL
Links of 15 km with 9/125 µm
single mode fiber (S1.1)
• HFCT-5963NL
Links of 40 km with 9/125 µm
single mode fiber (L1.1)
• Multisourced 2 x 5 package style
with LC receptacle
• Single +3.3 V power supply
• Temperature range:
HFCT-5963TL
0 °C to +70
°C
HFCT-5963ATL:
-40 °C to +85
°C
HFCT-5963NL:
-5 °C to +70
°C
• Wave solder and aqueous wash
process compatible
• Manufactured in an ISO9002
certified facility
• Fully Class 1 CDRH/IEC 825
compliant
• +3.3 V TTL signal detect output
• Transceivers are available with
and without EMI nose shield
(see ordering information details)
Applications
• SONET/SDH equipment
interconnect, OC-3/SDH STM-1
rate
• Long and intermediate reach
ATM/SONET links
• Suitable for Fast Ethernet
Applications
Functional Description
Receiver Section
Design
The receiver section for the
HFCT-5963xxx contains an
InGaAs/InP photo detector and
a preamplifier mounted in an
optical subassembly. This optical
subassembly is coupled to a
postamp/decision circuit on a
circuit board. The design of the
optical assembly is such that it
provides better than 14 dB
Optical Return Loss (ORL).
Figure 1 also shows a filter
function which limits the
bandwidth of the preamp output
signal. The filter is designed to
bandlimit the preamp output
noise and thus improve the
receiver sensitivity.
These components will reduce
the sensitivity of the receiver as
the signal bit rate is increased
above 155 Mb/s.
The postamplifier is ac coupled
to the preamplifier as illustrated
in Figure 1. The coupling
capacitors are large enough to
pass the SONET/SDH test
pattern at 155 Mb/s without
significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
Figure 1. Receiver Block Diagram
2
LVPECL
OUTPUT
BUFFER
AMPLIFIER
GND
The Signal Detect Circuit
The signal detect circuit works
by sensing the level of the
received signal and comparing
this level to a reference. The SD
output is +3.3 V TTL.
DATA OUT
FILTER
TRANSIMPEDANCE
PREAMPLIFIER
Noise Immunity
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
Application Section).
SIGNAL
DETECT
CIRCUIT
LVTTL
OUTPUT
BUFFER
DATA OUT
SD
Functional Description
Transmitter Section
Design
A schematic diagram for the
transmitter is shown in Figure 2.
The HFCT-5963xxx incorporates
an FP laser as its optical source.
All part numbers have been
designed to be compliant with
IEC 825 eye safety requirements
under any single fault condition
and CDRH under normal
operating conditions. The
optical output is controlled by a
custom IC that detects the laser
output via the monitor
photodiode. This IC provides
both dc and ac current drive to
the laser to ensure correct
modulation, eye diagram and
extinction ratio over
temperature, supply voltage and
operating life.
FP
LASER
DATA
LASER
MODULATOR
DATA
LVPECL
INPUT
LASER BIAS
DRIVER
LASER BIAS
CONTROL
Figure 2. Simplified Transmitter Schematic
3
PHOTODIODE
(rear facet monitor)
Package
The overall package concept for
these devices consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and the
housing as illustrated in the
block diagram in Figure 3.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin out
are compliant with the multisource definition of the 2 x 5
DIP. The low profile of the
Agilent transceiver design
complies with the maximum
height allowed for the LC
connector over the entire length
of the package.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
encased with a metal EMI
protective shield. The case is
connected to signal ground and
we recommend soldering the
four ground tabs to host card
signal ground.
The receiver electrical
subassembly includes an
internal shield for the electrical
and optical subassembly to
ensure high immunity to
external EMI fields.
The PCBs for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required to
withstand the loads imposed on
the transceiver by mating with
the LC connectored fiber cables.
Although they are not connected
electrically to the transceiver, it
is recommended to connect
them to chassis ground.
The optical subassemblies are
each attached to their respective
transmit or receive electrical
subassemblies. These two units
are then fitted within the outer
housing of the transceiver that is
molded of filled nonconductive
plastic to provide mechanical
strength. The housing is then
RX SUPPLY
NOTE
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
DATA OUT
RX GROUND
SIGNAL
DETECT
LC
RECEPTACLE
TX GROUND
DATA IN
DATA IN
Tx DISABLE
LASER BIAS
MONITORING
LASER DRIVER
AND CONTROL
CIRCUIT
TX SUPPLY
LASER DIODE
MODULATOR
LASER
OPTICAL
SUBASSEMBLY
CASE
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram
4
15.0 ± 0.2
(0.591 ± 0.008)
13.59 + 0
- 0.2
0.535 +0
-0.008
(
13.59
(0.535)
MAX
)
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
(0.386)
MAX
10.8 ± 0.2
9.6 ± 0.2
(0.425 ± 0.008)(0.378 ±0.008)
3.81
(0.15)
10.16
(0.4)
Ø 1.07
(0.042)
19.5 ±0.3
(0.768 ±0.012)
FRONT VIEW
1
(0.039)
10 x 0.5
(0.02)
1.78
(0.07)
4.06
(0.16)
0.25
(0.01)
1
(0.039)
BACK VIEW
SIDE VIEW
48.2
(1.898)
9.8
(0.386)
MAX
G MODULE - NO EMI NOSE SHIELD
Ø 1.07
(0.042)
19.5 ±0.3
(0.768 ±0.012)
1
(0.039)
1.78
(0.07)
10 x 0.5
(0.02)
3.81
(0.15)
0.25
(0.01)
SIDE VIEW
10 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-5963xxx Package Outline Drawing
5
Connection Diagram
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
o
o
o
o
o
1
2
3
4
5
10
9
8
7
6
o
o
o
o
o
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Figure 5. Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Receiver Signal Ground VEE RX:
Directly connect this pin to the
receiver ground plane.
Pin 2 Receiver Power Supply VCC RX:
Provide +3.3 V dc via the
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the VCC RX
pin. Note: the filter circuit
should not cause VCC to drop
below minimum specification.
Pin 3 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a +3.3 V TTL input
on an upstream circuit, such as
Signal Detect input or Loss of
Signal-bar.
6
Pin 4 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 9 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 5 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 10 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 6 Transmitter Power Supply
VCC TX:
Provide +3.3 V dc via the
recommended transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
VCC TX pin.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Pin 7 Transmitter Signal Ground
VEE TX:
Directly connect these pins to
the transmitter signal ground
plane.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
Pin 8 Transmitter Disable TDIS:
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Application Information
The Applications Engineering
Group at Agilent is available to
assist you with technical
understanding and design tradeoffs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of the parts.
minimum transmitter output
optical power (dBm avg) and the
lowest receiver sensitivity (dBm
avg). This OPB provides the
necessary optical signal range to
establish a working fiber-optic
link. The OPB is allocated for the
fiber-optic cable length and the
corresponding link penalties.
For proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
Optical Power Budget and
Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiberoptic link is determined by the
difference between the
Electrical and Mechanical Interface
Recommended Circuit
Figures 6a and 6b show
recommended dc and ac coupled
circuits for deploying the Agilent
transceivers in +3.3 V systems.
Data Line Interconnections
Agilent’s HFCT-5963xxx fiberoptic transceivers are designed
to couple to +3.3 V PECL signals.
The transmitter driver circuit
regulates the output optical
power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is reasonably
balanced in duty cycle. If the
data duty cycle has long,
continuous state times (low or
high data duty cycle), then the
output optical power will
gradually change its average
output optical power level to its
preset value.
PHY DEVICE
TERMINATE AT
TRANSCEIVER INPUTS
Z = 50 W
VCC (+3.3 V)
TDIS (LVTTL)
130 W
100 W
TD-
Z = 50 W
LVPECL
130 W
1
7
6
TDIS o
VEE TX o
VCC TX o
o RD+
TD+ o
2
8
o SD
o V CC RX
RX
o VEE RX
TX
9
TD- o
10
o RD-
TD+
3
4
1 µH
C2
C5 *
10 µF
VCC (+3.3 V)
C3
10 µF
VCC (+3.3 V)
1 µH
C1
5
RD+
C4 *
10 µF
Z = 50 W
100 W
LVPECL
RD-
Z = 50 W
130 W
130 W
Z = 50 W
Note: C1 = C2 = C3 = 10 nF or 100 nF
* C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL
LOW FREQUENCY NOISE FILTERING.
Figure 6a. Recommended dc coupled interface circuit
7
SD
TERMINATE AT
DEVICE INPUTS
LVTTL
VCC (+3.3 V)
82 Ω
100 nF
100 nF
TDIS (LVTTL)
BMON-
82 Ω
Z = 50 Ω
VCC (+3.3 V)
130 Ω
130 Ω
100 nF
BMON+
Z = 50 Ω
TD130 Ω
130 Ω
PMON-
NOTE A
TD+
PMON+
o RD-
VCC TX o
o SD
5
6
7
8
9 10
1 µH
C2
C3
C1
VCC (+3.3 V)
10 µF
1 µH
VCCRX (+3.3 V)
200 Ω
NOTE C
C5 *
10 µF
VCC (+3.3 V)
100 nF
o RD+
TD+ o
o VCC RX
4
TDIS o
TD- o
o VEE RX
VEE TX o
BMON- o
3
VEE TX o
o DNC
2
o VEERX BMON+ o
1
o DNC
RX
o VEE RX PMON- o
TX
o VpdR
PMON+ o
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
82 Ω
82 Ω
RD+
C4 *
10 µF
100 nF
Z = 50 Ω
130 ΩW
NOTE B
RD-
10 nF
100 nF
130 Ω
130 Ω
Z = 50 Ω
Z = 50 Ω
VCC (+3.3 V)
100 nF
130 Ω
130
Ω
SD
LVPECL
82 Ω
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100 Ω TERMINATION
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 Ω
* C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
Figure 6b. Recommended ac coupled interface circuit
The HFCT-5963xxx have a
transmit disable function which
is a single-ended +3.3 V TTL
input which is dc-coupled to pin
8.
As for the receiver section, it is
internally ac-coupled between
the preamplifier and the
postamplifier stages. The actual
Data and Data-bar outputs of the
postamplifier are dc-coupled to
their respective output pins
(pins 4, 5). The two data outputs
of the receiver should be
terminated with identical load
circuits.
Signal Detect is a single-ended,
+3.3 V TTL output signal that is
dc-coupled to pin 3 of the
module. Signal Detect should not
be ac-coupled externally to the
follow-on circuits because of its
infrequent state changes.
8
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figures
6a and 6b show the power
supply circuit which complies
with the small form factor
multisource agreement. It is
further recommended that a
continuous ground plane be
provided in the circuit board
directly under the transceiver to
provide a low inductance
ground for signal return current.
This recommendation is in
keeping with good high
frequency board layout
practices.
Package footprint and front panel
considerations
The Agilent transceivers comply
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 5 package style.
This drawing is reproduced in
Figure 7 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure 8
shows the front panel
dimensions associated with such
a layout.
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the event
of a single fault failure, the
transmitter must either
maintain eye-safe operation or
be disabled.
The HFCT-5963xxx is
intrinsically eye safe and does
not require shut down circuitry.
Signal Detect
The Signal Detect circuit
provides a deasserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optical power and
-45 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or
data source). The Signal Detect
does not detect receiver data
error or error-rate. Data errors
can be determined by signal
processing offered by upstream
PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-5963xxx
to provide excellent EMI
performance. The EMI
performance of a chassis is
dependent on physical design
and features which help improve
EMI suppression. Agilent
encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
Agilent’s OC-3 LC transceivers
(HFCT-5963xxx) have nose
shields which provide a
convenient chassis connection to
the nose of the transceiver. This
9
2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1
(0.09)
(0.055 ±0.004)
17.8
(0.700)
2 x Ø 1.4 ±0.1
7.11
(0.055 ±0.004)
(0.28)
3.56
(0.14)
4 x Ø 1.4 ±0.1
(0.055 ±0.004)
13.34
(0.525)
10.16
(0.4)
7.59
(0.299)
9.59
(0.378)
3
(0.118)
4 x 1.78
(0.07)
3
(0.118)
6
(0.236)
2
(0.079)
2
2 x Ø 2.29
(0.079) (0.09)
4.57
(0.18)
3.08
(0.121)
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 7. Recommended Board Layout Hole Pattern
nose shield improves system
EMI performance by effectively
closing off the LC aperture.
Localized shielding is also
improved by tying the four metal
housing package grounding tabs
to signal ground on the PCB.
Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and signal grounds together.
The recommended transceiver
position, PCB layout and panel
opening for these devices are the
same, making them mechanically
drop-in compatible. Figure 8
shows the recommended
positioning of the transceivers
with respect to the PCB and
faceplate.
Package and Handling Instructions
Flammability
The HFCT-5963xxx transceiver
housing consists of high
strength, heat resistant and UL
94 V-0 flame retardant plastic
and metal packaging.
Recommended Solder and Wash
Process
The HFCT-5963xxx are
compatible with industrystandard wave solder processes.
Process plug
This transceiver is supplied with
a process plug for protection of
the optical port within the LC
connector receptacle. This
process plug prevents
contamination during wave
solder and aqueous rinse as well
as during handling, shipping and
storage. It is made of a hightemperature, molded sealing
material that can withstand
+85°C and a rinse pressure of
110 lbs per square inch.
The process plug should only be
used once. After removing it
from the transceiver, it must not
be used again as a process plug;
however, if it has not been
contaminated it can be reused as
a dust cover.
000
000
000
15.24
(0.6)
10.16 ±0.1
(0.4 ±0.004)
TOP OF PCB
000
000
000
000
000
000
000
000000000
000000000
000000000
000000000
000000000
B
B
DETAIL A
15.24
(0.6)
1
(0.039)
000
000
000
0000000000000000000000000000
0000000000000000000000000000
14.22 ±0.1
(0.56 ±0.004)
A
SOLDER POSTS
000 00000000000
00000000000000000000000000000000000000000
000000000000000000000000000000
000
000
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5963xxx should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
10
DIMENSIONS IN MILLIMETERS (INCHES)
1.
2.
FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
Figure 8. Recommended Panel Mounting
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process
is the use of forced nitrogen. If
contamination is thought to have
remained, the optical ports can
be cleaned using a NTT
international Cletop stick type
(diam. 1.25mm) and HFE7100
cleaning fluid.
Regulatory Compliance
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
equipment design will determine
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the transceiver parts.
To the extent that the LC
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
Immunity
Transceivers will be subject to
radio-frequency electromagnetic
fields following the IEC 61000-4-3
test method.
Eye Safety
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per EN 60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH.
They are also eye safe under
normal operating conditions and
under all reasonably foreseeable
single fault conditions per
EN60825-1. Agilent has tested
the transceiver design for
compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV
Rheinland has granted
certification to these
transceivers for laser eye safety
and use in EN 60825-2
applications. Their performance
enables the transceivers to be
used without concern for eye
safety up to 3.5 V transmitter
VCC.
Table 1: Regulatory Compliance - Targeted Specification
Feature
Test Method
Electrostatic Discharge (ESD) MIL-STD-883
to the
Performance
Class 1 (>500 V).
Method 3015
Electrical Pins
Electrostatic Discharge (ESD) Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
to the LC Receptacle
Electromagnetic Interference
FCC Class B
Margins are dependent on customer board and chassis designs.
(EMI)
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the transceiver
Laser Eye Safety
FDA CDRH 21-CFR 1040
and Equipment Type Testing
Class 1
without a chassis enclosure.
Accession Number:
HFCT-5961NL/NG ) 9521220-46
HFCT-5961TL/TG/ATL/ATG ) 9521220-47
IEC 60825-1
Amendment 2 2001-01
Component
Recognition
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition
for Information Technology Equipment
Including Electrical Business Equipment.
11
License Number:
HFCT-5961NL/NG ) 933/510116/01 26 July 2001
HFCT-5963TL/TG/ATL/ATG ) 933/510201/02 18 Jan. 2002
UL File Number: E173874, 01SC14051
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5963xxx.
All adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of
the parts will result in voided
product warranty. It may also
result in improper operation of
the circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the devices to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5963xxx in
a manner inconsistent with its
design and function may result
in hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
12
Absolute Maximum Ratings (HFCT-5963xxx)
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values
of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Symbol
Min.
Max.
Unit
Storage Temperature
TS
-40
Typ.
+85
°C
Supply Voltage
VCC
-0.5
3.6
V
Data Input Voltage
VI
-0.5
VCC
V
Reference
Data Output Current
ID
50
mA
Relative Humidity
RH
85
%
Max.
Unit
Reference
Recommended Operating Conditions (HFCT-5963xxx)
Parameter
Symbol
Min.
Typ.
HFCT-5963TL/TG
TA
0
+70
°C
1
HFCT-5963NL/NG
TA
-5
+70
°C
1
HFCT-5963ATL/ATG
Supply Voltage
TA
VCC
-40
3.1
+85
3.5
°C
V
1
2
Power Supply Noise Rejection
PSNR
mVP-P
3
Transmitter Differential Input Voltage
VD
Data Output Load
RDL
Transmit Disable Input Voltage - Low
TDIS
Transmit Disable Input Voltage - High
TDIS
Ambient Operating Temperature
100
0.3
1.6
V
W
50
0.6
2.2
V
V
Transmit Disable Assert Time
TASSERT
10
µs
4
Transmit Disable Deassert Time
TDEASSERT
1.0
ms
5
Max.
+260/10
Unit
°C/sec.
Reference
6
Process Compatibility (HFCT-5963xxx)
Parameter
Wave Soldering and Aqueous Wash
Symbol
TSOLD/tSOLD
Min.
Typ.
Notes:
1. Ambient operating temperature utilizes air flow of 2 ms-1 over the device.
2. The transceiver is class 1 eye safe up to V CC = 3.5 V.
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place.
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser startup.
6. Aqueous wash pressure <110 psi.
The transceivers are compliant to OC-3 parametric specification when operating at 125 Mbit/s.
13
Transmitter Electrical Characteristics
HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963/NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Supply Current
ICCT
Min.
Power Dissipation
PDIST
Data Input Voltage Swing (single-ended)
VIH - VIL
250
Transmitter Differential
Data Input Current - Low
IIL
-350
Typ.
Max.
Unit
54
140
mA
0.5
W
930
mV
Reference
µA
Transmitter Differential
Data Input Current - High
IIH
350
µA
Typ.
Max.
Unit
Reference
95
140
mA
1
Receiver Electrical Characteristics
HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Supply Current
ICCR
Min.
0.5
W
930
mV
2
tr
2.2
ns
3
tf
2.2
ns
3
0.6
V
100
µs
100
µs
Power Dissipation
PDISR
Data Output Voltage Swing (single-ended)
VOH - VOL
Data Output Rise Time
Data Output Fall Time
575
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
2.2
Signal Detect Assert Time (OFF to ON)
ASMAX
Signal Detect Deassert Time (ON to OFF)
ANSMAX
Notes:
1. Includes current for biasing Rx data outputs.
2. These outputs are compatible with low voltage PECL inputs.
3. These are 20-80% values.
14
2.3
V
Transmitter Optical Characteristics
HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Min.
Max.
Unit
Reference
Output Optical Power 9 µm SMF
POUT
-15
Typ.
-8
dBm
1
Center Wavelength
lC
1261
1360
nm
Spectral Width - rms
s
7.7
nm rms
2
Optical Rise Time
tr
2
ns
3
Optical Fall Time
tf
2
ns
3
Extinction Ratio
ER
Output Optical Eye
Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957
8.2
dB
Transmitter Optical Characteristics
HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Min.
Max.
Unit
Reference
Output Optical Power 9 µm SMF
POUT
-5
Typ.
0
dBm
1
Center Wavelength
lC
1270
1360
nm
Spectral Width - rms
s
3
nm rms
2
Optical Rise Time
tr
2
ns
3
Optical Fall Time
tf
2
ns
3
Extinction Ratio
ER
Output Optical Eye
Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957
10
dB
Receiver Optical Characteristics
HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V)
HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Typ.
Max.
Unit
Reference
Receiver Sensitivity HFCT-5963TL/TG/ATL/ATG
PIN MIN
Min.
-38
-31
dBm avg.
4
Receiver Sensitivity HFCT-5963NL/NG
Receiver Overload
-34
PIN MAX
-8
-38
0
dBm avg.
dBm avg.
4
4
Input Operating Wavelength
l
1261
1580
nm
Signal Detect - Asserted
PA
-34
dBm avg.
Signal Detect - Deasserted
PD
-45
-42.2
Signal Detect - Hysteresis
PH
0.5
1.89
-40.3
dBm avg.
4
dB
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/2.35.
3. These are unfiltered 10-90% values.
4. PIN represents the typical optical input sensitivity of the receiver. Sensitivity (PINMIN ) and saturation (PINMAX) levels for a 223 -1 PRBS with 72 ones
and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10-10.
15
Ordering Information
1300 nm FP Laser (Temperature range 0 °C to +70 °C,
HFCT-5963TL = 2 x 5 LC connector, IR, +3.3 V TTL SD with EMI nose shield
HFCT-5963TG = 2 x 5 LC connector, IR, +3.3 V TTL SD without EMI nose shield
1300 nm FP Laser (Temperature range -5 °C to +70 °C,
HFCT-5963NL = 2 x 5 LC connector. LR, +3.3 V TTL SD with EMI nose shield
HFCT-5963NG = 2 x 5 LC connector. LR, +3.3 V TTL SD without EMI nose shield
1300 nm FP Laser (Temperature range -40°C to +85 °C,
HFCT-5963ATL = 2 x 5 LC connector. IR, +3.3 V TTL SD with EMI nose shield
HFCT-5963ATG = 2 x 5 LC connector, IR, +3.3 V TTL SD without EMI nose shield
Related Products
Other single mode
HFCT-5961xxx =
HFCT-5962xxx =
HFCT-5964xxx =
OC-3 transceivers in this product family are:2 x 5 LC connector, LR/IR, LVPECL SD
2 x 10 LC connector. LR/IR, LVPECL SD
2 x 10 LC connector, LR/IR, +3.3 V TTL SD
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5963xxx can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes: 5988-7874EN
December 18, 2002
5988-8394EN