Agilent HLMP-PB00-N0000, HLMP-PM00-N0000, HLMP-QB00-S0000, HLMP-QM00-S0000 Subminiature Blue and Green InGaN LED Lamps Data Sheet Features • Subminiature flat top package Ideal for backlighting and light piping applications Description Lead Configurations Flat Top Package All these devices are made by encapsulating LED chip on axial lead frames to form molded epoxy subminiature lamps. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bend at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature Lamps data sheet. The HLMP-Pxxx flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Dome Package The HLMP-Qxxx dome lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern. • Subminiature dome package Nondiffused dome for high brightness • Colors: 468 nm blue, 525 nm green • Ideal for space limited applications • Axial leads • Available with lead configurations for surface mount and through hole PC board mounting Applications • Consumer • Industrial • Computer peripheral • Communication CAUTION: HLMP-xB00 and HLMP-xM00 LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details. Package Dimensions (A) Flat Top Lamps 0.50 (0.020) REF. 1.40 (0.055) 1.65 (0.065) 11.68 (0.460) 10.67 (0.420) BOTH SIDES CATHODE 0.46 (0.018) 0.56 (0.022) ANODE 1.65 (0.065) DIA. 1.91 (0.075) 0.20 (0.008) MAX. 0.25 (0.010) MAX.* NOTE 2 2.21 (0.087) 1.96 (0.077) 1.14 (0.045) 1.40 (0.055) 0.63 (0.025) 0.38 (0.015) 2.44 (0.096) 1.88 (0.074) 0.79 (0.031) MAX. 0.18 (0.007) 0.23 (0.009) 2.08 (0.082) 2.34 (0.092) CATHODE STRIPE NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. * REFER TO FIGURE 1 FOR DESIGN CONCERNS. 2 Package Dimensions B) Domed Lamps 0.50 (0.020) REF. 11.68 (0.460) 10.67 (0.420) BOTH SIDES CATHODE 0.46 (0.018) 0.56 (0.022) ANODE 1.65 (0.065) DIA. 1.91 (0.075) 0.20 (0.008) MAX. 0.18 (0.007) 0.23 (0.009) 0.25 (0.010) MAX.* NOTE 2 2.21 (0.087) 1.96 (0.077) 0.76 (0.030) R. 0.89 (0.035) 0.94 (0.037) 1.24 (0.049) 2.03 (0.080) 1.78 (0.070) 2.92 (0.115) MAX. 0.79 (0.031) 0.53 (0.021) 0.63 (0.025) 0.38 (0.015) 2.08 (0.082) 2.34 (0.092) CATHODE STRIPE NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. * REFER TO FIGURE 1 FOR DESIGN CONCERNS. 3 CATHODE TAB NO. ANODE DOWN. YES. CATHODE DOWN. Figure 1. Proper right angle mounting to a PC board to prevent protruding cathode tab from shorting to anode connection. Device Selection Guide Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000 Color Blue Green Blue Green Viewing Angle 2θ1/2 85˚ Package Description Flat Top, Nondiffused, Untinted Package Outline A 20˚ Domed, Nondiffused, Untinted B Ordering Information HLMX-XXXX-X X X X X Packaging Option Color Bin Selection Max. Iv Bin Min. Iv Bin 4 x 4 Prod. Part Number 4 Absolute Maximum Ratings at TA = 25˚C Parameter Peak Forward Current DC Forward Current[1] Power Dissipation Reverse Voltage (I R = 10 µA) Operating Temperature Range Storage Temperature Range LED Junction Temperature Lead Soldering Temperature [1.6 mm (0.063 in.) from body] SMT Reflow Soldering Temperatures Convective Reflow Vapor Phase Reflow Value 90 mA 30 mA 110 mW 5V –40˚C to +85˚C –55˚C to +100˚C 110˚C 260˚C for 5 seconds 235˚C Peak, above 183˚C for 90 seconds 215˚C for 3 minutes Note: 1. Derate linearly as shown in Figure 5. Optical Characteristics at T A = 25˚C Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000 Luminous Intensity Iv (mcd) @ IF = 20 mA Min. Typ. 25 60 25 200 160 290 160 690 Peak Wavelength λPEAK (nm) Typ. 470 523 470 523 Color, Dominant Wavelength λd (nm) Typ. 468 525 468 525 Spectral Halfwidth ∆λ1/2 (nm) Typ. 26 36 26 36 Viewing Angle 2 θ1/2 Degrees Typ. 85 85 20 20 Luminous Efficacy ηv (lm/W) 70 500 70 500 Electrical Characteristics at TA = 25˚C Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000 5 Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.7 4.1 3.7 4.1 3.7 4.1 3.7 4.1 Reverse Breakdown VR (Volts) @ I R = 100 µA Min. 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 52 52 52 52 Thermal Resistance RθJ-PIN (˚C/W) Typ. 170 170 170 170 BLUE GREEN 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 680 730 780 35 1.6 30 1.4 25 20 15 10 5 1 2 3 4 5 0.8 0.6 0.4 0 5 10 15 20 0.9 30 25 20 RθJ-A = 400°C/W 15 RθJ-A = 550°C/W 10 5 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 20 40 60 80 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 AMBIENT TEMPERATURE – °C Figure 5. Maximum forward current vs. ambient temperature. Derating based on TJ MAX = 110˚C. 0 10 20 30 40 50 60 70 80 90 ANGLE – DEGREES Figure 6. Relative luminous intensity vs. angular displacement for HLMP-Qxxx. 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE – DEGREES Figure 7. Relative luminous intensity vs. angular displacement for HLMP-Pxxx. 6 30 35 Figure 4. Relative luminous intensity vs. DC forward current. 1.0 35 25 DC FORWARD CURRENT – mA Figure 3. Forward current vs. forward voltage. RELATIVE INTENSITY MAXIMUM FORWARD CURRENT – mA 1.0 0 0 VF – FORWARD VOLTAGE – V Figure 2. Relative intensity vs. wavelength. 1.2 0.2 0 WAVELENGTH – nm 0 RELATIVE INTENSITY RELATIVE INTENSITY 0.8 IF – FORWARD CURRENT – mA 1.0 0.9 Intensity Bin limits Bin N P Q R S T U V W X Y Min. 25 40 63 100 160 250 400 630 1000 1600 2500 Color Bin limits Max. 50 80 125 200 320 500 800 1250 2000 3200 5000 Package Blue Green Bin 0 1 2 3 4 5 6 0 3 4 5 6 Min. Max. Full Distribution 460 464 464 468 468 472 472 476 476 480 480 484 Full Distribution 520 525 525 530 530 535 535 540 Tolerance of each bin limit = ± 2 nm. Mechanical Option 00 11 12 14 21 22 24 31 32 34 Straight Leads, Bulk Packaging, Quantity of 500 Parts Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Yoke Leads, Bulk Packaging, Quantity of 500 Parts Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Note: All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 7 www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. October 31, 2001 Obsoletes 5988-0703EN 5988-4572EN